System and method for increasing electron density levels in a plasma of a substrate processing system

1. A system for increasing electron density levels in a plasma, the system comprising:

a substrate processing chamber;

one or more injectors that inject an electronegative gas, a baseline electropositive gas, and an additional electropositive gas into the substrate processing chamber, wherein the electronegative gas includes an etch precursor, and wherein the additional electropositive gas mixes with and increases electron density of a plasma in the substrate processing chamber; and

a controller configured to set an amount, flow rate or pressure of the additional electropositive gas based on at least one of a pressure of the electronegative gas or an electron affinity level of the additional electropositive gas,

wherein the controller is configured to decrease a percentage of the electronegative gas relative to a total amount of gas supplied to the substrate processing chamber when (i) the additional electropositive gas is supplied, and (ii) a total amount of electropositive gas is increased.

2. The system of claim 1 , wherein the controller is configured to adjust an amount of the additional electropositive gas injected into the substrate processing chamber, wherein the controller sets a concentration level of the additional electropositive gas to be greater than 0% and less than 5%.

3. The system of claim 1 , wherein the controller is configured to adjust concentration levels of the electronegative gas, the baseline gas, and the additional electropositive gas based on the electron affinity level of the additional electropositive gas.

4. The system of claim 1 , wherein the electronegative gas is provided to the substrate processing chamber at a pressure greater than 0.5 Torr.

5. The system of claim 1 , wherein the additional electropositive gas is provided to the substrate processing chamber at a pressure greater than 0.5 Torr.

6. The system of claim 1 , wherein the additional electropositive gas includes an inert gas.

7. The system of claim 1 , wherein the additional electropositive gas includes a non-inert gas.

8. The system of claim 1 , wherein the additional electropositive gas has a lower electron affinity than the baseline electropositive gas.

9. The system of claim 1 , wherein a pressure of the additional electropositive gas is a same pressure as the electronegative gas and a pressure of the baseline electropositive gas.

10. The system of claim 1 , wherein a flow rate of the plasma is not reduced while (i) the percentage of the electronegative gas relative to the total amount of gas supplied to the substrate processing chamber is decreased, and (ii) a percentage of an overall amount of electropositive gas relative to the total amount of gas supplied to the substrate processing chamber is increased.

11. The system of claim 1 , wherein a flow rate of the plasma is maintained at a same flow rate while (i) the percentage of the electronegative gas relative to the total amount of gas supplied to the substrate processing chamber is decreased, and (ii) a percentage of an overall amount of electropositive gas relative to the total amount of gas supplied to the substrate processing chamber is increased.

12. A method comprising:

arranging a substrate on a substrate support within a substrate processing chamber;

injecting an electronegative gas, a baseline electropositive gas, and an additional electropositive gas into the substrate processing chamber, wherein the electronegative gas includes an etch precursor, wherein the additional electropositive gas mixes with and increases electron density of a plasma in the substrate processing chamber, and

wherein prior to injecting the electronegative gas, the baseline electropositive gas, and the additional electropositive gas into the substrate processing chamber, setting an amount, flow rate or pressure of the additional electropositive gas based on at least one of a pressure of the electronegative gas or an electron affinity level of the additional electropositive gas;

decreasing a percentage of the electronegative gas relative to a total amount of gas supplied to the substrate processing system when (i) the additional electropositive gas is supplied, and (ii) a total amount of electropositive gas is increased; and

striking the plasma to etch the substrate.

13. The method of claim 12 , further comprising:

adjusting an amount of the additional electropositive gas injected into the substrate processing chamber; and

setting a concentration level of the additional electropositive gas to be greater than 0% and less than 5%.

14. The method of claim 12 , further comprising adjusting concentration levels of the electronegative gas, the baseline gas, and the additional electropositive gas based on the electron affinity level of the additional electropositive gas.

15. The method of claim 12 , wherein the electronegative gas is provided to the substrate processing chamber at a pressure greater than 0.5 Torr.

16. The method of claim 12 , wherein the additional electropositive gas is provided to the substrate processing chamber at a pressure greater than 0.5 Torr.

17. The method of claim 12 , wherein the additional electropositive gas includes an inert gas.

18. The method of claim 12 , wherein the additional electropositive gas includes a non-inert gas.

19. The method of claim 12 , wherein the additional electropositive gas has a lower electron affinity than the baseline electropositive gas.