IP Library › Granted Patent US 10,177,195
Granted Patent B2
US 10,177,195 · App. 15/283,180 · Granted Jan 8, 2019

Micro-LED displays

Inventors: Khaled Ahmed (Anaheim, CA); Kunjal Parikh (San Jose, CA); Peter L. Chang (Portland, OR)
Assignee: Intel Corporation
H01L27/156H01L33/0075
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Quick Facts
Patent No.
US 10,177,195
App. No.
15/283,180
Granted
Jan 8, 2019
Kind
B2
Abstract

A micro-light emitting diode (LED) display panel and a method of forming the display panel, the micro-LED display panel having a monolithically grown micro-structure including a first color micro-LED that is a first color nanowire LED, and a second color micro-LED that is a second color nanowire LED.

Claims (51)

1. A method of forming a micro-light emitting diode (LED) display panel, comprising:

growing monolithically a first color nanowire LED and a second color nanowire LED on a wafer to give a micro-structure having a first color micro-LED and a second color micro-LED, the second color different than the first color; and

transferring the micro-structure from the wafer to a backplane for a pixel of the micro-LED display, wherein the micro-structure to provide emission colors of the first color and the second color.

2. The method of claim 1 , wherein growing monolithically comprises growing a first plurality of nanowires to a first diameter for the first color nanowire LED and a second plurality of nanowires to a second diameter for the second color nanowire LED, the second diameter larger than the first diameter.

3. The method of claim 1 , comprising growing monolithically a second color nanowire LED and a third color nanowire LED on another wafer to give a second micro-structure having a second color micro-LED and a third color micro-LED, and transferring the second micro-structure from the another wafer to the backplane for the pixel.

4. The method of claim 3 , wherein growing monolithically comprises growing indium gallium nitride (InGaN), and wherein performing transfers to the backplane for the pixel comprises performing four separate transfers comprising the transferring of the first micro-structure from the wafer to the backplane, the transferring of the second micro-structure from the another wafer to the backplane, transferring a blue micro-LED comprising a blue nanowire LED to the backplane from a third wafer, and transferring a red micro-LED comprising a red nanowire LED to the backplane from a fourth wafer.

5. The method of claim 4 , wherein no more transfers than the four separate transfers are performed for the pixel.

6. The method of claim 3 , wherein the first color is blue, the second color is green, and the third color is red.

7. The method of claim 1 , comprising forming the micro-LED display panel with the backplane, wherein the first color is blue and the second color is green.

8. The method of claim 1 , wherein the first color is green and the second color is red.

9. The method of claim 1 , wherein the first color is green and the second color is yellow.

10. The method of claim 1 , wherein the first color is yellow and the second color is red.

11. The method of claim 1 , comprising growing a first color nanowire LED comprising a first color micro-LED on another wafer and transferring the first color micro-LED from the another wafer to the backplane for the pixel.

12. The method of claim 1 , comprising:

growing a third color nanowire LED, the third color different from the first color, and the third color different from the second color; and

transferring the third color nanowire LED to the backplane for the pixel of the micro-LED display.

13. The method of claim 1 , comprising:

growing a nanowire LED of the first color; and

transferring the nanowire LED of the first color to the backplane for the pixel of the micro-LED display.

14. The method of claim 12 , comprising:

growing a nanowire LED of the first color; and

transferring the nanowire LED of the first color to the backplane for the pixel of the micro-LED display.

15. The method of claim 1 , comprising:

growing monolithically a second color nanowire LED and a third color nanowire LED on a wafer to give a second micro-structure having a second color micro-LED and a third color micro-LED, the third color different than the second color; and

transferring the second micro-structure from the wafer to a backplane for a pixel of the micro-LED display, wherein the micro-structure to provide emission colors of the second color and the third color.

16. The method of claim 12 , comprising:

growing monolithically a second color nanowire LED and a third color nanowire LED on a wafer to give a second micro-structure having a second color micro-LED and a third color micro-LED, the third color different than the second color; and

transferring the second micro-structure from the wafer to a backplane for a pixel of the micro-LED display, wherein the micro-structure to provide emission colors of the second color and the third color.

17. The method of claim 13 , comprising:

growing monolithically a second color nanowire LED and a third color nanowire LED on a wafer to give a second micro-structure having a second color micro-LED and a third color micro-LED, the third color different than the second color; and

transferring the second micro-structure from the wafer to a backplane for a pixel of the micro-LED display, wherein the micro-structure to provide emission colors of the second color and the third color.

18. The method of claim 14 , comprising:

growing monolithically a second color nanowire LED and a third color nanowire LED on a wafer to give a second micro-structure having a second color micro-LED and a third color micro-LED, the third color different than the second color; and

transferring the second micro-structure from the wafer to a backplane for a pixel of the micro-LED display, wherein the micro-structure to provide emission colors of the second color and the third color.

19. The method of claim 18 , wherein the transferring of the micro-structure having the first color micro-LED and the second color micro-LED, the transferring of the third color nanowire LED to the backplane for the pixel of the micro-LED display, the transferring of the nanowire LED of the first color to the backplane for the pixel of the micro-LED display, and the transferring of the second micro-structure comprise four separate transfers to the backplane of the pixel of the micro-LED display.

20. The method of claim 1 , wherein growing monolithically the first color nanowire LED and the second color nanowire LED on the wafer comprises forming or integrating on the wafer the first color nanowire LED and the second color nanowire LED as a single unit.

21. The method of claim 1 , wherein the growing monolithically comprises growing the first color nanowire LED and the second color nanowire LED with different indium compositions.

22. The method of claim 1 , wherein the microstructure has a first diameter for the first color nanowire LED and a second diameter for the second color nanowire LED.

23. The method of claim 1 , wherein the growing monolithically comprises simultaneously growing on the same wafer the first and second color nanowire LEDs using different nanowire core diameters and different indium compositions for the first and second color nanowire LEDs.

24. The method of claim 1 , wherein the backplane is a glass backplane.

25. A method of forming a micro-light emitting diode (LED) display panel having pixels, comprising:

growing monolithically a blue (B) nanowire LED and a green (G) nanowire LED to give a BG micro-structure having a B micro-LED and a G micro-LED;

growing monolithically a green (G) nanowire LED and a red (R) nanowire LED to give a GR micro-structure having a G micro-LED and a R micro-LED;

growing a blue (B) nanowire LED comprising a B micro-LED;

growing a red (R) nanowire LED comprising a R micro-LED; and

performing four separate transfers to a backplane substrate for a pixel of the micro-LED display panel, comprising separate respective transfers of the B micro-LED, the BG micro-structure, the GR micro-structure, and the R micro-LED.

26. The method of claim 25 , wherein no more transfers than the four separate transfers are performed for the pixel.

27. The method of claim 25 , comprising forming the micro-LED display panel with the backplane substrate.

28. The method of claim 25 , comprising installing the micro-LED display panel in a display of an electronic device.

29. The method of claim 25 , wherein growing monolithically the blue nanowire LED and the green nanowire LED comprises forming or integrating the blue nanowire LED and the green nanowire LED as a single unit.

30. The method of claim 25 , wherein the backplane substrate is a glass backplane substrate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 27, 2016
From: AHMED, KHALED; PARIKH, KUNJAL; CHANG, PETER L.
To: INTEL CORPORATION
Reel/Frame 040148/0801 →
Continuity (1)
Related Publication 20180097033A1 · Apr 5, 2018
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