Granted Patent
S1
US 1,064,005 · App. 29/848,745 · Granted Feb 25, 2025
Grounding ring of a process kit for semiconductor substrate processing
Inventors:
Abhishek Chowdhury (Bangalore, IN); Nataraj Bhaskar Rao (Bangalore, IN); Edwin C. Suarez (Pleasanton, CA); Harisha Sathyanarayana (Bangalore, IN); Diego Ramiro Puente Sotomayor (Phoenix, AZ); Qanit Takmeel (Mesa, AZ); Mohammad Kamruzzaman Chowdhury (Phoenix, AZ); Arun Chakravarthy Chakravarthy (Tamil Nadu, IN)
Assignee:
APPLIED MATERIALS, INC.
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Claims (1)
The ornamental design for a grounding ring of a process kit for semiconductor substrate processing, as shown and described.
Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded Dec 13, 2022
From: CHOWDHURY, ABHISHEK; BHASKAR RAO, NATARAJ; SUAREZ, EDWIN C.; SATHYANARAYANA, HARISHA; PUENTE SOTOMAYOR, DIEGO RAMIRO; TAKMEEL, QANIT; CHOWDHURY, MOHAMMAD KAMRUZZAMAN; CHAKRAVARTHY, ARUN CHAKRAVARTHY
To: APPLIED MATERIALS, INC.
Reel/Frame 062069/0278 →
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