Semiconductor device and manufacturing method thereof
A semiconductor device includes a semiconductor substrate and at least one gate stack. The gate stack is present on the semiconductor substrate, and the gate stack includes at least one work function conductor and a filling conductor. The work function conductor has a recess therein. The filling conductor includes a plug portion and a cap portion. The plug portion is present in the recess of the work function conductor. The cap portion caps the work function conductor.
1. A method of manufacturing a semiconductor device, the method comprising:
forming a first work function conductor between a sidewall of a first gate spacer and a sidewall of a second gate spacer;
forming a filling conductor:
between a first sidewall of the first work function conductor and a second sidewall of the first work function conductor, and
over the first work function conductor and between the sidewall of the first gate spacer and the sidewall of the second gate spacer; and
recessing the filling conductor to define a recess between the sidewall of the first gate spacer and the sidewall of the second gate spacer.
2. The method of claim 1 , comprising:
forming a dielectric cap in the recess.
3. The method of claim 1 , comprising:
forming a second work function conductor between the first sidewall of the first work function conductor and the second sidewall of the first work function conductor prior to forming the filling conductor.
4. The method of claim 1 , comprising:
forming a gate dielectric prior to forming the first work function conductor, wherein forming the first work function conductor comprises forming the first work function conductor to overlie an uppermost surface of the gate dielectric.
5. The method of claim 1 , comprising:
forming a dummy gate structure;
forming the first gate spacer and the second gate spacer on opposing sides of the dummy gate structure;
etching a semiconductor fin disposed below the dummy gate structure to define a second recess adjacent the first gate spacer and a third recess adjacent the second gate spacer;
forming a first epitaxy structure in the second recess and a second epitaxy structure in the third recess; and
removing the dummy gate structure after forming the first epitaxy structure and the second epitaxy structure, wherein forming the first work function conductor comprises forming the first work function conductor after removing the dummy gate structure.
6. The method of claim 2 , wherein:
a portion of the filling conductor remains over an uppermost surface of the first work function conductor after recessing the filling conductor, and
the portion of the filling conductor is disposed between the dielectric cap and the uppermost surface of the first work function conductor.
7. The method of claim 3 , wherein the first work function conductor is a p-type work function layer and the second work function conductor is an n-type work function layer.
8. The method of claim 3 , wherein forming the filling conductor comprises forming the filling conductor between a first sidewall of the second work function conductor and a second sidewall of the second work function conductor.
9. The method of claim 3 , comprising:
forming a mask between a first sidewall of the second work function conductor and a second sidewall of the second work function conductor; and
removing a first portion of the second work function conductor and a first portion of the first work function conductor while the mask conceals a second portion of the second work function conductor and a second portion of the first work function conductor.
10. A method of manufacturing a semiconductor device, the method comprising:
forming a first work function conductor between a sidewall of a first gate spacer and a sidewall of a second gate spacer;
forming a second work function conductor between a first sidewall of the first work function conductor and a second sidewall of the first work function conductor;
forming a filling conductor after forming the second work function conductor:
between the first sidewall of the first work function conductor and the second sidewall of the first work function conductor, and
over the first work function conductor and between the sidewall of the first gate spacer and the sidewall of the second gate spacer; and
forming a dielectric cap over the filling conductor and between the sidewall of the first gate spacer and the sidewall of the second gate spacer.
11. The method of claim 10 , wherein forming the dielectric cap comprises forming the dielectric cap such that the dielectric cap is spaced apart from an uppermost surface of the first work function conductor by a portion of the filling conductor.
12. The method of claim 10 , wherein forming the filling conductor comprises forming the filling conductor such that a first portion of the filling conductor between the first sidewall of the first work function conductor and the second sidewall of the first work function conductor has a first width and a second portion of the filling conductor over the first work function conductor and between the sidewall of the first gate spacer and the sidewall of the second gate spacer has a second width different than the first width.
13. The method of claim 10 , wherein the first work function conductor is a p-type work function layer and the second work function conductor is an n-type work function layer.
14. The method of claim 10 , wherein forming the filling conductor comprises forming the filling conductor between a first sidewall of the second work function conductor and a second sidewall of the second work function conductor.
15. A semiconductor device, comprising:
a semiconductor fin
a gate stack disposed over the semiconductor fin and between a first gate spacer and a second gate spacer, the gate stack comprising:
a first work function conductor;
a filling conductor; and
a dielectric cap, wherein:
a plug portion of the filling conductor is disposed between a first sidewall of the first work function conductor and a second sidewall of the first work function conductor,
a cap portion of the filling conductor is over an uppermost surface of the first work function conductor, and
the dielectric cap is separated from the first work function conductor by the cap portion of the filling conductor.
16. The semiconductor device of claim 15 , wherein the dielectric cap is in contact with a sidewall of the first gate spacer and a sidewall of the second gate spacer.
17. The semiconductor device of claim 15 , wherein the cap portion of the filling conductor is in contact with a sidewall of the first gate spacer and a sidewall of the second gate spacer.
18. The semiconductor device of claim 15 , wherein a width of the cap portion of the filling conductor measured in a direction from the first gate spacer to the second gate spacer is equal to a width of the dielectric cap measured in the direction from the first gate spacer to the second gate spacer.
19. The semiconductor device of claim 15 , wherein the gate stack comprises a second work function conductor between the first work function conductor and the filling conductor.
20. The semiconductor device of claim 19 , wherein the first work function conductor is a p-type work function layer and the second work function conductor is an n-type work function layer.