Display device and method for manufacturing the same
A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.
1. A method of manufacturing a display device, comprising:
providing a stacked body over a substrate;
irradiating the stacked body with a beam through the substrate;
separating the stacked body from the substrate; and
bonding a first flexible substrate to a surface of the stacked body in which the substrate was separated,
wherein the stacked body includes an organic resin layer, a transistor, a light-emitting element and a second flexible substrate in this order from the substrate,
wherein the beam is irradiated to a processing region of the stacked body to weaken the organic resin layer or to reduce an adhesion between the organic resin layer and the substrate, and
wherein a part of the organic resin layer is left on the substrate.
2. The method of manufacturing a display device according to claim 1 , wherein the organic resin layer is in contact with the substrate in the step of providing the stacked body.
3. The method of manufacturing a display device according to claim 1 , wherein the beam is a pulsed laser.
4. The method of manufacturing a display device according to claim 1 , wherein the beam is a linear beam.
5. The method of manufacturing a display device according to claim 1 , wherein the beam is irradiated while the substrate and the stacked body are moved.
6. The method of manufacturing a display device according to claim 1 , wherein the organic resin layer includes at least one of an epoxy resin, an acrylic resin, a polyimide resin, a polyamide resin, and a polyamide-imide resin.
7. The method of manufacturing a display device according to claim 1 , wherein the organic resin layer is polyimide with a thickness of greater than or equal to 3 nm and less than or equal to 20 μm.
8. A method of manufacturing a display device, comprising:
providing a stacked body over a substrate;
irradiating the stacked body with a beam through the substrate;
separating the stacked body from the substrate; and
bonding a first flexible substrate to a surface of the stacked body in which the substrate was separated,
wherein the stacked body includes an organic resin layer, a transistor, a light-emitting element and a second flexible substrate in this order from the substrate,
wherein the beam is irradiated to the organic resin layer to weaken the organic resin layer or to reduce an adhesion between the organic resin layer and the substrate, and
wherein a part of the organic resin layer is left on the substrate.
9. The method of manufacturing a display device according to claim 8 , wherein the organic resin layer is in contact with the substrate in the step of providing the stacked body.
10. The method of manufacturing a display device according to claim 8 , wherein the beam is a pulsed laser.
11. The method of manufacturing a display device according to claim 8 , wherein the beam is a linear beam.
12. The method of manufacturing a display device according to claim 8 , wherein the beam is irradiated while the substrate and the stacked body are moved.
13. The method of manufacturing a display device according to claim 8 , wherein the organic resin layer includes at least one of an epoxy resin, an acrylic resin, a polyimide resin, a polyamide resin, and a polyamide-imide resin.
14. The method of manufacturing a display device according to claim 8 , wherein the organic resin layer is polyimide with a thickness of greater than or equal to 3 nm and less than or equal to 20 μm.
15. A method of manufacturing a display device, comprising:
providing a stacked body over a substrate;
irradiating the stacked body with a beam through the substrate;
separating the stacked body from the substrate; and
bonding a first flexible substrate to a surface of the stacked body in which the substrate was separated,
wherein the stacked body includes an organic resin layer, a transistor, a light-emitting element, a sealing layer covering the light-emitting element and a second flexible substrate in this order from the substrate,
wherein the beam is irradiated to a processing region of the stacked body to weaken the organic resin layer or to reduce an adhesion between the organic resin layer and the substrate, and
wherein a part of the organic resin layer is left on the substrate.
16. The method of manufacturing a display device according to claim 15 , wherein the organic resin layer is in contact with the substrate in the step of providing the stacked body.
17. The method of manufacturing a display device according to claim 15 , wherein the beam is a pulsed laser.
18. The method of manufacturing a display device according to claim 15 , wherein the beam is a linear beam.
19. The method of manufacturing a display device according to claim 15 , wherein the beam is irradiated while the substrate and the stacked body are moved.
20. The method of manufacturing a display device according to claim 15 , wherein the organic resin layer includes at least one of an epoxy resin, an acrylic resin, a polyimide resin, a polyamide resin, and a polyamide-imide resin.
21. The method of manufacturing a display device according to claim 15 , wherein the organic resin layer is polyimide with a thickness of greater than or equal to 3 nm and less than or equal to 20 μm.
22. A method of manufacturing a display device, comprising:
providing a stacked body over a substrate;
irradiating the stacked body with a beam through the substrate;
separating the stacked body from the substrate; and
bonding a first flexible substrate to a surface of the stacked body in which the substrate was separated,
wherein the stacked body includes an organic resin layer, a transistor, a light-emitting element, a sealing layer covering the light-emitting element and a second flexible substrate in this order from the substrate,
wherein the beam is irradiated to the organic resin layer to weaken the organic resin layer or to reduce an adhesion between the organic resin layer and the substrate, and
wherein a part of the organic resin layer is left on the substrate.
23. The method of manufacturing a display device according to claim 22 , wherein the organic resin layer is in contact with the substrate in the step of providing the stacked body.
24. The method of manufacturing a display device according to claim 22 , wherein the beam is a pulsed laser.
25. The method of manufacturing a display device according to claim 22 , wherein the beam is a linear beam.
26. The method of manufacturing a display device according to claim 22 , wherein the beam is irradiated while the substrate and the stacked body are moved.
27. The method of manufacturing a display device according to claim 22 , wherein the organic resin layer includes at least one of an epoxy resin, an acrylic resin, a polyimide resin, a polyamide resin, and a polyamide-imide resin.
28. The method of manufacturing a display device according to claim 22 , wherein the organic resin layer is polyimide with a thickness of greater than or equal to 3 nm and less than or equal to 20 μm.