Polarizer with multiple evanescently coupled waveguides
Disclosed are embodiments of an on-chip polarizer and of methods of forming the polarizer. The polarizer includes first and second waveguides with different shapes at different design levels above a substrate. The first waveguide has a main body between an input end and an output end. The second waveguide is spiral in shape with an inner end and with an outer end that is evanescently coupled to the main body of the first waveguide. Light signals, including first light signals with a first type polarization and second light signals with a second type polarity, are received at the input end of the first waveguide. The first waveguide passes the first light signals to the output end and passes at least some second light signals out the main body and into the outer end of the second waveguide. The second waveguide attenuates the received second light signals.
1. An photonic integrated circuit chip comprising:
a substrate; and
a polarizer on the substrate and comprising differently shaped waveguides at different levels, wherein the waveguides comprise at least:
a first waveguide having an input end, an output end opposite the input end, and a main body between the input end and the output end; and
a second waveguide having a spiral shape with an outer end and an inner end, wherein the outer end is evanescently coupled to the main body of the first waveguide.
2. The photonic integrated circuit chip of claim 1 ,
wherein the first waveguide receives light signals at the input end,
wherein the light signals comprise first light signals with a first type polarization and second light signals with a second type polarization,
wherein the first waveguide passes the first light signals out the output end and further passes at least a portion of the second light signals out the main body into the outer end of the second waveguide, and
wherein the second waveguide attenuates received second light signals between the outer end and the inner end.
3. The photonic integrated circuit chip of claim 1 , wherein the main body of the first waveguide has a different thickness than the input end and the output end.
4. The photonic integrated circuit chip of claim 1 , wherein the main body of the first waveguide is one of the following:
essentially linear;
curved toward the outer end of the second waveguide; and
curved away from the outer end of the second waveguide.
5. The photonic integrated circuit chip of claim 1 , wherein the outer end of the second waveguide is diagonally offset from the main body of the first waveguide.
6. The photonic integrated circuit chip of claim 1 ,
wherein the first waveguide is in an active device level and a semiconductor material core, and
wherein the second waveguide is in a metal level above the active device level and has a dielectric material core.
7. The photonic integrated circuit chip of claim 1 ,
wherein the first waveguide is in an active device level and has a silicon core, and
wherein the second waveguide is in a metal level above the active device level and has a silicon nitride core.
8. The photonic integrated circuit chip of claim 1 ,
wherein the second waveguide is in an active device level and has a semiconductor material core, and
wherein the first waveguide is in a metal level above the active device level and has a dielectric material core.
9. The photonic integrated circuit chip of claim 1 ,
wherein the second waveguide is in an active device level and has a silicon core, and
wherein the first waveguide is in a metal level above the active device level and has a silicon nitride core.
10. The photonic integrated circuit chip of claim 1 , wherein a core of at least one of the waveguides comprises a thick portion of a material layer and wherein a thin portion of the material layer extends laterally beyond the thick portion.
11. The photonic integrated circuit chip of claim 1 , wherein the waveguides further comprise any of the following:
an additional first waveguide aligned vertically with the first waveguide; and
an additional second waveguide aligned vertically with the second waveguide.
12. A photonic integrated circuit chip comprising:
a substrate; and
a polarizer on the substrate and comprising differently shaped waveguides at different levels, wherein the waveguides comprise at least:
a first waveguide having an input end, an output end opposite the input end, and a main body between the input end and the output end; and
multiple second waveguides on opposing sides of the first waveguide, wherein each second waveguide has a spiral shape with an outer end and an inner end and wherein the outer end of each second waveguide is evanescently coupled to the main body of the first waveguide.
13. A method of forming a photonic integrated circuit chip, the method comprising:
providing a substrate; and
forming, on the substrate, a polarizer comprising differently shaped waveguides at different levels such that the waveguides comprise at least:
a first waveguide having an input end, an output end opposite the input end, and a main body between the input end and the output end; and
at least one second waveguide having a spiral shape with an outer end and an inner end, wherein the outer end is evanescently coupled to the main body of the first waveguide.
14. The method of claim 13 , wherein the forming of the polarizer comprises forming the waveguides so that, when the first waveguide receives light signals comprising first light signals with a first type polarization and second light signals with a second type polarization, the first waveguide passes the first light signals out the output end and passes at least a portion of the second light signals out the main body into the outer end of the second waveguide and the second waveguide attenuates received second light signals between the outer end and the inner end.
15. The method of claim 13 , wherein the forming of the polarizer comprises forming the waveguides so that the main body of the first waveguide has a different thickness than the input end and the output end.
16. The method of claim 13 , wherein the forming of the polarizer comprises forming the waveguides so that the main body of the first waveguide is one of the following:
essentially linear;
curved toward the outer end of the second waveguide; and
curved away from the outer end of the second waveguide.
17. The method of claim 13 , wherein the forming of the polarizer comprises forming the waveguides so that the outer end of the second waveguide is diagonally offset from the main body of the first waveguide.
18. The method of claim 13 , wherein the forming of the polarizer comprises:
forming the first waveguide in an active device level so as to have a semiconductor material core; and
forming the second waveguide in a metal level above the active device level so as to have a dielectric material core.
19. The method of claim 13 , wherein the forming of the polarizer comprises:
forming the second waveguide in an active device level and having a semiconductor material core; and
forming the first waveguide in a metal level above the active device level and having a dielectric material core.
20. The method of claim 13 , wherein the forming of the polarizer comprises:
forming the waveguides so as to include at least one of stacked first waveguides and stacked second waveguides.