Method and apparatus for supplying power to VLSI silicon chips
View Patent ↗An integrated circuit module, system and method of providing power and signals is disclosed that includes a silicon chip and a package substrate having voltage connections and signal connections. The silicon chip includes a silicon substrate having a top surface, a bottom surface and circuitry formed therein, one or more front-side metal layers formed on the top surface of the silicon substrate, one or more back-side metal layers formed on the bottom surface of the silicon substrate, and one or more through silicon vias (TSVs) formed through the silicon substrate for creating a conductive pathway from the back-side of the silicon substrate to the front-side of the silicon substrate, preferably closest to the silicon substrate.
1. An integrated circuit module comprising:
a silicon chip comprising:
a silicon substrate having a top surface, a bottom surface, and circuitry formed in the top surface including one or more transistors;
one or more front-side metal layers formed on the top surface of the silicon substrate;
one or more back-side metal layers formed on the bottom surface; and
one or more through silicon vias (TSVs) formed through the silicon substrate for creating a conductive pathway from the back-side of the silicon substrate to the front-side of the silicon substrate; and
a package substrate having voltage connections and signal connections, wherein, the module is configured so that:
a plurality of signal routing pathways are formed from the signal connections on the package substrate through a plurality of C4 connections to one or more of the front-side metal layers formed on the top surface of the silicon substrate to the circuitry in the silicon substrate, and
a plurality of voltage routing pathways are formed from the voltage connections on the package substrate to the one or more back-side metal layers formed on the bottom surface of the silicon substrate to the one or more TSVs to one or more of the front-side metal layers to the circuitry in the silicon substrate.
2. The integrated circuit module of claim 1 , wherein the one or more TSVs are configured to extend through the silicon substrate to the front-side metal layer closest to the top surface of the silicon substrate, and the voltage routing pathways extend to the front-side metal layer closest to the top surface of the silicon substrate.
3. The integrated circuit module of claim 1 , wherein the voltage routing pathways are configured and routed from the voltage connections on the package substrate through wire bonds to the one or more back-side metal layers.
4. The integrated circuit module of claim 1 , wherein all voltage connections on the package substrate are configured and routed from the package substrate to the back-side metal layers.
5. The integrated circuit of claim 4 , wherein all the voltage connections on the package substrate are configured and routed from the package substrate through wire bonds to the one or more backside metal layers.
6. The integrated circuit module of claim 4 , wherein all the signal connections on the package substrate are configured and routed from the package substrate through C4 connections to the one or more front-side metal layers.
7. The integrated circuit module of claim 1 , further comprising a heat sink attached to the silicon chip closer to the bottom surface of the silicon substrate than to the top surface of the silicon substrate.
8. The integrated circuit module of claim 7 , further comprising notches in the heat sink to facilitate connecting one or more wire bonds to the one or more backside metal layers.
9. The integrated circuit module of claim 1 , wherein the module is configured to receive at least two voltage levels comprising VDD and ground.
10. The integrated circuit module of claim 9 , wherein the voltage levels are supplied to the one or more backside metal layers and voltage power grid is provided in a front-side metal layer closest to the silicon substrate.