IP Library › Granted Patent US 1,128,614
Granted Patent S1
US 1,128,614 · App. 29/938,927 · Granted Jun 2, 2026

Power semiconductor module

Inventors: Yuki Nakano (Kyoto, JP); Yasunori Kutsuma (Kyoto, JP); Kenji Yamamoto (Kyoto, JP)
Assignee: ROHM CO., LTD.
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Quick Facts
Patent No.
US 1,128,614
App. No.
29/938,927
Granted
Jun 2, 2026
Kind
S1
Claims (1)

The ornamental design for a power semiconductor module, as shown and described.

Priority Claims (2)
JP 2021-005996 D · Mar 23, 2021 · national
JP 2021-005997 D · Mar 23, 2021 · national
Continuity (1)
Division 29808479 · Sep 20, 2021
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