Smart cards with metal layer(s) and methods of manufacture
Smartcards with metal layers manufactured according to various techniques disclosed herein. One or more metal layers of a smartcard stackup may be provided with slits overlapping at least a portion of a module antenna in an associated transponder chip module disposed in the smartcard so that the metal layer functions as a coupling frame. One or more metal layers may be pre-laminated with plastic layers to form a metal core or clad subassembly for a smartcard, and outer printed and/or overlay plastic layers may be laminated to the front and/or back of the metal core. Front and back overlays may be provided. Various constructions of and manufacturing techniques (including temperature, time, and pressure regimes for laminating) for smartcards are disclosed herein.
1. A smartcard comprising:
a first coupling frame having a module opening and a first slit;
a second coupling frame having a second slit, wherein the second coupling frame is under the first coupling frame and a portion of the second slit is underneath the module opening; and
a transponder chip module disposed in the module opening and overlapping the second.
2. The smartcard of claim 1 , wherein the second coupling frame does not have a module opening.
3. The smartcard of claim 1 , wherein the transponder chip module is configured to communicate with an external device through both directly contacting the external device and without contacting the external device.
4. The smartcard of claim 1 , wherein the transponder chip module is not configured to communicate with an external device without contacting the external device.
5. The smartcard of claim 1 , further comprising:
a first inner plastic layer disposed above the first coupling frame; and
a second inner plastic layer disposed below the second coupling frame.
6. The smartcard of claim 1 , further comprising:
a first inner plastic layer disposed above the first coupling frame;
a first plastic printed core layer disposed above the first inner plastic layer; and
a first clear plastic overlay disposed above the first plastic printed core layer.
7. The smartcard of claim 6 , wherein each of the first clear plastic overlay, first plastic printed core layer, and the first inner plastic layer include openings, each sized to accommodate the transponder chip module.
8. The smartcard of claim 6 , further comprising:
a second inner plastic layer disposed below the second coupling frame;
a second plastic printed core layer disposed below the second inner plastic layer; and
a second clear plastic overlay disposed below the second plastic printed core layer.
9. The smartcard of claim 1 , wherein the second slit has a varying width.
10. The smartcard of claim 1 , wherein the transponder chip module includes a module antenna, wherein a portion of the module antenna is above a portion of the second slit.
11. The smartcard of claim 10 , wherein the module antenna includes windings, and wherein a portion of the windings are above a portion of the second slit.
12. The smartcard of claim 10 , wherein the second slit describes a nearly complete loop that permits passage of alternating electromagnetic fields through the first coupling frame the second coupling frame and the transponder chip module.
13. The smartcard of claim 10 , wherein the extended second slit is configured to direct eddy currents induced in the second coupling frame towards the module antenna.
14. The smartcard of claim 1 , wherein the entire second slit is under the module opening.
15. The smartcard of claim 1 , wherein the second slit does not extend to an outer periphery of the second coupling frame.
16. The smartcard of claim 1 , wherein the second slit has an open-ended loop shape.
17. The smartcard of claim 16 , wherein the second slit comprises a plurality of straight segments.