IP Library › Granted Patent US 11,710,794
Granted Patent B2
US 11,710,794 · App. 17/063,748 · Granted Jul 25, 2023

Semiconductor device

Inventors: Takahiro Sato (Tochigi, JP); Yasutaka Nakazawa (Tochigi, JP); Takayuki Cho (Tochigi, JP); Shunsuke Koshioka (Tochigi, JP); Hajime Tokunaga (Yokohama, JP); Masami Jintyou (Shimotsuga, JP)
Assignee: Semiconductor Energy Laboratory Co., Ltd.
H01L29/7869G02F1/1368G02F1/136277H01L21/02365H01L21/02403H01L21/02422H01L21/02551H01L21/02554H01L21/02565H01L21/02631H01L21/30604H01L21/465H01L27/1225H01L27/1259H01L29/045H01L29/0657H01L29/1033H01L29/24H01L29/42356H01L29/66742H01L29/66969H01L29/786H01L29/78603H01L29/78693H01L29/78696H10K59/123
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Quick Facts
Patent No.
US 11,710,794
App. No.
17/063,748
Granted
Jul 25, 2023
Kind
B2
Abstract

A transistor includes a multilayer film in which an oxide semiconductor film and an oxide film are stacked, a gate electrode, and a gate insulating film. The multilayer film overlaps with the gate electrode with the gate insulating film interposed therebetween. The multilayer film has a shape having a first angle between a bottom surface of the oxide semiconductor film and a side surface of the oxide semiconductor film and a second angle between a bottom surface of the oxide film and a side surface of the oxide film. The first angle is acute and smaller than the second angle. Further, a semiconductor device including such a transistor is manufactured.

Claims (68)

1. A semiconductor device comprising:

a glass substrate;

a gate electrode with a tapered side surface over the glass substrate;

a first insulating film comprising at least one of silicon oxide, silicon nitride, silicon oxynitride, and silicon nitride oxide over the gate electrode;

an oxide semiconductor film over and in contact with the first insulating film, the oxide semiconductor film comprising a first oxide film and a second oxide film;

a first conductive film over and in contact with a top surface of the second oxide film, the first conductive film being in contact with a first side surface of the first oxide film and a first side surface of the second oxide film;

a second conductive film over and in contact with the top surface of the second oxide film, the second conductive film being in contact with a second side surface of the first oxide film and a second side surface of the second oxide film;

a second insulating film over the oxide semiconductor film, the first conductive film, and the second conductive film; and

a third insulating film over the second insulating film,

wherein the second conductive film is electrically connected to a first electrode of a display element via an opening provided in the second insulating film and the third insulating film,

wherein a thickness of the first side surface of the first oxide film is larger than a thickness of the first side surface of the second oxide film in a cross-sectional view,

wherein at least one of the first oxide film and the second oxide film is crystalline,

wherein the first oxide film comprises indium and gallium,

wherein the second oxide film overlaps with the first oxide film and comprises indium and gallium,

wherein the first insulating film comprises a fourth insulating film comprising silicon oxide and a fifth insulating film comprising silicon nitride,

wherein a sixth insulating film is provided over the first electrode of the display element,

wherein the sixth insulating film covers a side surface of the first electrode of the display element,

wherein the sixth insulating film overlaps with the first conductive film without the first electrode of the display element provided therebetween,

wherein a second electrode of the display element is provided over the sixth insulating film, and

wherein the first electrode and the second electrode of the display element overlap with the oxide semiconductor film.

2. The semiconductor device according to claim 1 , wherein the first conductive film and the second conductive film overlap with the gate electrode.

3. The semiconductor device according to claim 1 , wherein the second conductive film extends beyond the opening.

4. The semiconductor device according to claim 1 , wherein the first electrode comprises indium and zinc.

5. A semiconductor device comprising:

a substrate;

a gate electrode over the substrate;

a first insulating film over the gate electrode;

an oxide semiconductor film over and in contact with the first insulating film, the oxide semiconductor film comprising a first oxide film and a second oxide film;

a first conductive film over and in contact with a top surface of the second oxide film, the first conductive film being in contact with a first side surface of the first oxide film and a first side surface of the second oxide film;

a second conductive film;

a second insulating film over the oxide semiconductor film, the first conductive film, and the second conductive film; and

a third insulating film over the second insulating film,

wherein the second conductive film is electrically connected to a first electrode of a display element,

wherein a thickness of the first side surface of the first oxide film is larger than a thickness of the first side surface of the second oxide film in a cross-sectional view,

wherein each of the first oxide film and the second oxide film is crystalline,

wherein the first oxide film comprises indium, gallium, and zinc,

wherein the second oxide film overlaps with the first oxide film and comprises indium, gallium, and zinc,

wherein one of the first oxide film and the second oxide film comprises a microcrystal,

wherein the first oxide film and the second oxide film have different compositions,

wherein a fourth insulating film is provided over the first electrode of the display element,

wherein the fourth insulating film covers a side surface of the first electrode of the display element,

wherein the fourth insulating film overlaps with the first conductive film without the first electrode of the display element provided therebetween,

wherein a second electrode of the display element is provided over the fourth insulating film, and

wherein the first electrode and the second electrode of the display element overlap with the oxide semiconductor film.

6. The semiconductor device according to claim 5 , wherein the first conductive film and the second conductive film overlap with the gate electrode.

7. The semiconductor device according to claim 5 , wherein the second conductive film extends beyond an opening provided in the second insulating film and the third insulating film.

8. The semiconductor device according to claim 5 , wherein the first electrode comprises indium and zinc.

9. A semiconductor device comprising:

a substrate;

a gate electrode over the substrate;

a first insulating film over the gate electrode;

an oxide semiconductor film over and in contact with the first insulating film, the oxide semiconductor film comprising a first oxide film and a second oxide film;

a first conductive film over and in contact with a top surface of the second oxide film, the first conductive film being in contact with a first side surface of the first oxide film and a first side surface of the second oxide film;

a second conductive film over and in contact with the top surface of the second oxide film, the second conductive film being in contact with a second side surface of the first oxide film and a second side surface of the second oxide film;

a second insulating film over the oxide semiconductor film, the first conductive film, and the second conductive film, the second insulating film comprising a third insulating film comprising silicon oxide and a fourth insulating film comprising silicon nitride; and

a fifth insulating film over the second insulating film,

wherein the first oxide film comprises indium, gallium, and tin,

wherein the second oxide film overlaps with the first oxide film and comprises indium, gallium, and zinc,

wherein the second conductive film is electrically connected to a first electrode of a display element via an opening provided in the second insulating film and the fifth insulating film,

wherein a thickness of the first side surface of the first oxide film is different from a thickness of the first side surface of the second oxide film in a cross-sectional view,

wherein each of the first oxide film and the second oxide film is crystalline,

wherein each of the first oxide film and the second oxide film comprises a microcrystal,

wherein the first oxide film and the second oxide film have different compositions,

wherein a sixth insulating film is provided over the first electrode of the display element,

wherein the sixth insulating film covers a side surface of the first electrode of the display element,

wherein, in the cross-sectional view, the sixth insulating film overlaps with the first conductive film without the first electrode of the display element provided therebetween,

wherein a second electrode of the display element is provided over the sixth insulating film, and

wherein, in the cross-sectional view, the first electrode and the second electrode of the display element overlap with the oxide semiconductor film.

Priority Claims (1)
JP 2012-251794 · Nov 16, 2012 · national
Continuity (7)
Continuation 16515283 · Jul 18, 2019
Continuation 15785562 · Oct 17, 2017
Continuation 15187106 · Jun 20, 2016
Continuation 14878399 · Oct 8, 2015
Continuation 14733489 · Jun 8, 2015
Continuation 14073993 · Nov 7, 2013
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