High-speed light sensing apparatus
An apparatus including a semiconductor substrate; an absorption layer coupled to the semiconductor substrate, the absorption layer including a photodiode region configured to absorb photons and to generate photo-carriers from the absorbed photons; one or more first switches controlled by a first control signal, the one or more first switches configured to collect at least a portion of the photo-carriers based on the first control signal; and one or more second switches controlled by a second control signal, the one or more second switches configured to collect at least a portion of the photo-carriers based on the second control signal, where the second control signal is different from the first control signal.
1. An optical sensor comprising:
a silicon substrate;
an absorption layer supported by the silicon substrate and configured to absorb photons and to generate electrons and holes in response to the absorbed photons, wherein the absorption layer comprises germanium and includes a first p-doped region;
a first n-doped region formed in the silicon substrate, wherein the first n-doped region is configured to collect a portion of the electrons generated in the absorption layer; and
a second n-doped region formed in the silicon substrate,
wherein the second n-doped region is in direct contact with the absorption layer, and
wherein the second n-doped region is arranged to guide the portion of the electrons from the absorption layer to the first n-doped region.
2. The optical sensor of claim 1 , wherein the absorption layer is formed on the silicon substrate as a mesa.
3. The optical sensor of claim 1 , wherein the absorption layer is at least partially embedded in the silicon substrate.
4. The optical sensor of claim 1 , wherein a dopant level of the second n-doped region ranges from 10 15 cm −3 to 10 17 cm −3 , and wherein a dopant level of the first n-doped region is higher than the dopant level of the second n-doped region.
5. The optical sensor of claim 1 , further comprising an optical component over a backside of the silicon substrate, the optical component being configured to guide an optical signal through the silicon substrate to the absorption layer.
6. The optical sensor of claim 5 , wherein the optical signal has a wavelength that is greater than 850 nm.
7. The optical sensor of claim 1 , further comprising a third n-doped region formed in the silicon substrate, wherein the third n-doped region is configured to collect a second portion of the electrons generated in the absorption layer.
8. The optical sensor of claim 1 , further comprising a second p-doped region formed in the silicon substrate and arranged between the absorption layer and the first n-doped region, wherein the second p-doped region is coupled to a control signal and is configured to control a flow of the portion of the electrons from the absorption layer to the first n-doped region.
9. The optical sensor of claim 1 , further comprising a second p-doped region formed in the absorption layer, wherein the second p-doped region is configured to collect a portion of the holes generated in the absorption layer.
10. The optical sensor of claim 1 , wherein the first n-doped region is coupled to a readout circuitry configured to process the portion of the electrons collected in the first n-doped region.
11. The optical sensor of claim 10 , further comprising a second silicon substrate bonded to the silicon substrate, wherein the readout circuitry is formed in the second silicon substrate.
12. The optical sensor of claim 10 , wherein the optical sensor is configured to determine one or more characteristics of a target object, and wherein the one or more characteristics comprise a depth of the target object or a material of the target object.
13. The optical sensor of claim 1 , comprising an array of pixels, wherein the absorption layer is formed in one pixel of the array of pixels.
14. An optical system comprising:
a transmitter unit comprising multiple light sources; and
a receiver unit comprising an optical sensor, the optical sensor comprising:
a silicon substrate;
an absorption layer supported by the silicon substrate and configured to absorb photons and to generate electrons and holes in response to the absorbed photons, wherein the absorption layer comprises germanium and includes a first p-doped region;
a first n-doped region formed in the silicon substrate, wherein the first n-doped region is configured to collect a portion of the electrons generated in the absorption layer; and
a second n-doped region formed in the silicon substrate,
wherein the second n-doped region is in direct contact with the absorption layer, and
wherein the second n-doped region is arranged to guide the portion of the electrons from the absorption layer to the first n-doped region.
15. The optical system of claim 14 , further comprising a processing unit configured to determine one or more characteristics of a target object.
16. The optical system of claim 15 , wherein the one or more characteristics comprise a depth of the target object or a material of the target object.
17. The optical system of claim 14 , wherein at least one light source of the multiple light sources has a wavelength in a near infrared wavelength range.
18. The optical system of claim 14 , wherein the multiple light sources comprise LEDs.
19. The optical system of claim 14 , further comprising a readout circuitry coupled to the first n-doped region of the receiver unit.
20. The optical system of claim 19 , wherein the readout circuitry is formed on a second silicon substrate bonded to the silicon substrate.