3D semiconductor device and structure with memory
A 3D semiconductor device including: a first level including a plurality of first single-crystal transistors; a plurality of memory control circuits formed from at least a portion of the plurality of first single-crystal transistors; a first metal layer disposed atop the plurality of first single-crystal transistors; a second metal layer disposed atop the first metal layer; a second level disposed atop the second metal layer, the second level including a plurality of second transistors; a third level including a plurality of third transistors, where the third level is disposed above the second level; a third metal layer disposed above the third level; and a fourth metal layer disposed above the third metal layer, where the plurality of second transistors are aligned to the plurality of first single crystal transistors with less than 140 nm alignment error, the second level includes first memory cells, the third level includes second memory cells.
1. A 3D semiconductor device, the device comprising:
a first level comprising a plurality of first single-crystal transistors;
a plurality of memory control circuits formed from at least a portion of said plurality of first single-crystal transistors;
a first metal layer disposed atop said plurality of first single-crystal transistors;
a second metal layer disposed atop said first metal layer;
a second level disposed atop said second metal layer, said second level comprising a plurality of second transistors;
a third level comprising a plurality of third transistors,
wherein said third level is disposed above said second level;
a third metal layer disposed above said third level; and
a fourth metal layer disposed above said third metal layer,
wherein said plurality of second transistors are aligned to said plurality of first single crystal transistors with less than 140 nm and greater than 2 nm of alignment error,
wherein said second level comprises a plurality of first memory cells,
wherein said third level comprises a plurality of second memory cells,
wherein one of said plurality of second transistors is at least partially self-aligned to at least one of said plurality of third transistors, being processed following a same lithography step,
wherein each of said plurality of second memory cells comprises at least one of said plurality of third transistors,
wherein said memory control circuits perform a mapping of memory addresses from a first address to a second address, and
wherein said memory control circuits control a magnitude and a duration of memory write voltages delivered to said plurality of first memory cells or said plurality of second memory cells by using a distance between a write driver circuit and an associated memory cell.
2. The 3D semiconductor device according to claim 1 , further comprising:
a connective path from said third metal layer to said second metal layer,
wherein said path comprises a through said second level via, and
wherein said via has a diameter less than 400 nm.
3. The 3D semiconductor device according to claim 1 ,
wherein fabrication processing of said device comprises first processing said first single crystal transistors followed by processing said second transistors and then processing said third transistors, and
wherein said first processing said first transistors accounts for a temperature and time associated with processing said second transistors and said third transistors by adjusting a process thermal budget of said first transistors accordingly.
4. The 3D semiconductor device according to claim 1 ,
wherein a memory array comprises a portion of or all of said plurality of first memory cells,
wherein a memory location or plurality of memory locations within said memory array comprises device specific process parameter data, and
wherein said memory array comprises DRAM cells.
5. The 3D semiconductor device according to claim 1 , further comprising:
an upper level disposed above said fourth metal layer,
wherein said upper level comprises a mono-crystalline silicon layer.
6. The 3D semiconductor device according to claim 1 ,
wherein at least one of said third transistors comprises a metal gate.
7. The 3D semiconductor device according to claim 1 ,
wherein said second metal layer comprises tungsten.
8. A 3D semiconductor device, the device comprising:
a first level comprising a plurality of first single-crystal transistors;
a plurality of memory control circuits formed from at least a portion of said plurality of first single-crystal transistors;
a first metal layer disposed atop said plurality of first single-crystal transistors;
a second metal layer disposed atop said first metal layer;
a second level disposed atop said second metal layer, said second level comprising a plurality of second transistors;
a third level comprising a plurality of third transistors,
wherein said third level is disposed above said second level;
a third metal layer disposed above said third level; and
a fourth metal layer disposed above said third metal layer,
wherein said plurality of second transistors are aligned to said plurality of first single crystal transistors with less than 140 nm and greater than about 2 nm of alignment error;
wherein said second level comprises a plurality of first memory cells,
wherein said third level comprises a plurality of second memory cells,
wherein one of said plurality of second transistors is at least partially self-aligned to at least one of said plurality of third transistors, being processed following a same lithography step,
wherein each of said plurality of second memory cells comprises at least one of said plurality of third transistors,
wherein said memory control circuits perform a mapping of memory addresses from a first address to a second address,
wherein said memory control circuits perform at least one write cycle to at least one of said memory cells,
wherein said write cycle comprises a first write voltage pulse and a second write voltage pulse, and
wherein said second write voltage pulse is at a higher voltage than said first write voltage pulse.
9. The 3D semiconductor device according to claim 8 , further comprising:
a connective path from said third metal layer to said second metal layer,
wherein said path comprises a through said second level via, and
wherein said via has a diameter of less than 400 nm.
10. The 3D semiconductor device according to claim 8 ,
wherein fabrication processing of said device comprises first processing said first single crystal transistors followed by processing said second transistors and then processing said third transistors, and
wherein said first processing said first transistors accounts for a temperature and time associated with processing said second transistors and said third transistors by adjusting a process thermal budget of said first transistors accordingly.
11. The 3D semiconductor device according to claim 8 ,
wherein a memory array comprises a portion of or all of said plurality of first memory cells,
wherein a memory location or plurality of memory locations within said memory array comprises device specific process parameter data, and
wherein said memory array comprises DRAM cells.
12. The 3D semiconductor device according to claim 8 , further comprising:
an upper level disposed above said fourth metal layer,
wherein said upper level comprises a mono-crystalline silicon layer.
13. The 3D semiconductor device according to claim 8 ,
wherein at least one of said third transistors comprises a metal gate.
14. The 3D semiconductor device according to claim 8 ,
wherein said second metal layer comprises tungsten.
15. A 3D semiconductor device, the device comprising:
a first level comprising a plurality of first single-crystal transistors;
a plurality of memory control circuits formed from at least a portion of said plurality of first single-crystal transistors;
a first metal layer disposed atop said plurality of first single-crystal transistors;
a second metal layer disposed atop said first metal layer;
a second level disposed atop said second metal layer, said second level comprising a plurality of second transistors;
a third level comprising a plurality of third transistors,
wherein said third level is disposed above said second level;
a third metal layer disposed above said third level; and
a fourth metal layer disposed above said third metal layer,
wherein said plurality of second transistors are aligned to said plurality of first single crystal transistors with a less than 140 nm and greater than 2 nm of alignment error,
wherein said second level comprises a plurality of first memory cells,
wherein said third level comprises a plurality of second memory cells,
wherein one of said plurality of second transistors is at least partially self-aligned to at least one of said plurality of third transistors, being processed following a same lithography step,
wherein each of said plurality of second memory cells comprises at least one of said plurality of third transistors, and
wherein said memory control circuits perform a mapping of memory addresses from a first address to a second address.
16. The 3D semiconductor device according to claim 15 , further comprising:
a connective path from said third metal layer to said second metal layer,
wherein said path comprises a through said second level via, and
wherein said via has a diameter of less than 400 nm.
17. The 3D semiconductor device according to claim 15 ,
wherein fabrication processing of said device comprises first processing said first single crystal transistors followed by processing said second transistors and then processing said third transistors, and
wherein said first processing said first transistors accounts for a temperature and time associated with processing said second transistors and said third transistors by adjusting a process thermal budget of said first transistors accordingly.
18. The 3D semiconductor device according to claim 15 ,
wherein a memory array comprises a portion of or all of said plurality of first memory cells,
wherein a memory location or plurality of memory locations within said memory array comprise device specific process parameter data, and
wherein said memory array comprises DRAM cells.
19. The 3D semiconductor device according to claim 15 , further comprising:
an upper level disposed above said fourth metal layer,
wherein said upper level comprises a mono-crystalline silicon layer.
20. The 3D semiconductor device according to claim 15 ,
wherein at least one of said third transistors comprise a metal gate.