Semiconductor device with transmissive layer and manufacturing method thereof
A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that that comprises a transparent, translucent, non-opaque, or otherwise optically-transmissive, external surface.
1. A semiconductor device, comprising:
a transmissive layer comprising a transmissive layer first side and a transmissive layer second side opposite the transmissive layer first side, wherein the transmissive layer permits passage of radiation between the transmissive layer first side and the transmissive layer second side;
a first redistribution structure comprising a first redistribution structure first side, a first redistribution structure second side opposite the first redistribution structure first side, and a first redistribution structure opening that extends through the first redistribution structure first side to the first redistribution structure second side and exposes a portion of the transmissive layer first side, wherein the first redistribution structure first side comprises first conductive pads; and
a first component comprising a first component first side, a first component second side opposite the first component first side, and a first radiation circuit, wherein the first component second side is coupled to the first conductive pads of the first redistribution structure first side, and wherein the first radiation circuit is vertically aligned with the first redistribution structure opening to permit radiation to pass between the first radiation circuit and a portion of the transmissive layer via the first redistribution structure opening.
2. The semiconductor device of claim 1 , comprising an underfill material between the first component second side and the first redistribution structure first side.
3. The semiconductor device of claim 2 , wherein the underfill material extends between the first radiation circuit and the transmissive layer.
4. The semiconductor device of claim 3 , wherein the underfill material fills the first redistribution structure opening and contacts the transmissive layer.
5. The semiconductor device of claim 1 , comprising:
a second redistribution structure; and
conductive vias that couple the second redistribution structure to the first redistribution structure.
6. The semiconductor device of claim 5 , wherein the first component is between the first redistribution structure and the second redistribution structure.
7. The semiconductor device of claim 5 , comprising:
conductive interconnect structures coupled to the second redistribution structure; and
wherein the conductive interconnect structures provide electrical paths to the first component that pass through the second redistributions structure, the conductive vias, and the first redistribution structure.
8. The semiconductor device of claim 1 , wherein the first radiation circuit comprises a sensor radiation circuit configured to receive radiation passing through the transmissive layer and the first redistribution structure opening.
9. The semiconductor device of claim 1 , wherein the first radiation circuit comprises a transmitter radiation circuit configured to transmit radiation through the first redistribution structure opening the transmissive layer.
10. The semiconductor device of claim 1 , comprising:
a second component coupled to second conductive pads of the first redistribution structure first side;
wherein the second component comprises a second radiation circuit;
wherein the first radiation circuit comprises a sensor radiation circuit; and
wherein the second radiation circuit comprises a transmitter radiation circuit.
11. A semiconductor device, comprising:
a redistribution structure comprising a plurality of conductive layers and plurality of dielectric layers between a redistribution structure first side and a redistribution structure second side that is opposite the redistribution structure first side;
conductive interconnection structures below the redistribution structure second side;
a component comprising a first radiation circuit, wherein the component comprises a component first side, a component second side opposite the component first side, and a component sidewall that joins the component first side to the component second side;
conductive bumps between the redistribution structure first side and the component second side, wherein the conductive bumps coupled the component second side to the redistribution structure first side;
a mold material that contacts the redistribution structure first side and the component sidewall; and
a transmissive layer comprising a transmissive layer first side and a transmissive layer second side opposite the transmissive layer first side, wherein the transmissive layer second side faces the component first side, and wherein the transmissive layer permits passage of radiation between the transmissive layer first side and the transmissive layer second side.
12. The semiconductor device of claim 11 , wherein the mold material contacts the transmissive layer second side.
13. The semiconductor device of claim 11 , comprising:
underfill material between the redistribution structure first side and the component second side; and
wherein the underfill material contacts the conductive bumps.
14. The semiconductor device of claim 13 , wherein the mold material contacts the underfill material.
15. The semiconductor device of claim 13 , wherein the mold material comprises a material different than the underfill material.
16. The semiconductor device of claim 11 , wherein:
the redistribution structure comprises a redistribution structure lateral side between the redistribution structure first side and the redistribution structure second side; and
the redistribution structure lateral side is coplanar with a lateral side of the mold material.
17. A method of manufacturing a semiconductor device, the method comprising:
providing a first redistribution structure comprising a first redistribution structure first side, a first redistribution structure second side opposite the first redistribution structure first side, and a first redistribution structure opening that extends through the first redistribution structure first side to the first redistribution structure second side, wherein the first redistribution structure first side comprises first conductive pads;
providing a transmissive layer comprising a transmissive layer first side and a transmissive layer second side opposite the transmissive layer first side; and
providing a first component comprising a first component first side, a first component second side opposite the first component first side, and a first radiation circuit, wherein the first component second side is coupled to the first conductive pads of the first redistribution structure first side, and wherein the first radiation circuit is vertically aligned with the first redistribution structure opening to permit radiation to pass between the first radiation circuit and a portion of the transmissive layer via the first redistribution structure opening.
18. The method of claim 17 , providing an underfill material between the first component second side and the first redistribution structure first side.
19. The method of claim 18 , wherein the underfill material fills the first redistribution structure opening and contacts the transmissive layer.
20. The method of claim 17 , comprising providing a second redistribution structure coupled to the first redistribution structure by conductive vias such that the first component lies between the first redistribution structure and the second redistribution structure.