IP Library Granted Patent US 12,183,832
Granted Patent B2
US 12,183,832 · App. 17/521,021 · Granted Dec 31, 2024

Semiconductor device and manufacturing method thereof

Inventors: Kengo Akimoto (Kanagawa, JP); Tatsuya Honda (Kanagawa, JP); Norihito Sone (Kanagawa, JP)
Assignee: Semiconductor Energy Laboratory Co., Ltd.
H01L29/78696H01L21/02164H01L21/0217H01L21/02178H01L21/02266H01L21/02631H01L21/428H01L21/465H01L21/477H01L27/1225H01L27/1285H01L29/04H01L29/045H01L29/66969H01L29/7869H01L29/78693H01L21/02554H01L21/02565H01L21/02667
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,183,832
App. No.
17/521,021
Granted
Dec 31, 2024
Kind
B2
Abstract

An object is to provide a semiconductor device of which a manufacturing process is not complicated and by which cost can be suppressed, by forming a thin film transistor using an oxide semiconductor film typified by zinc oxide, and a manufacturing method thereof. For the semiconductor device, a gate electrode is formed over a substrate; a gate insulating film is formed covering the gate electrode; an oxide semiconductor film is formed over the gate insulating film; and a first conductive film and a second conductive film are formed over the oxide semiconductor film. The oxide semiconductor film has at least a crystallized region in a channel region.

Claims (34)

1. A semiconductor device comprising:

a gate electrode over a substrate;

a first gate insulating film over the gate electrode, the first gate insulating film comprising silicon nitride;

a second gate insulating film over the first gate insulating film, the second gate insulating film comprising silicon oxide; and

an oxide semiconductor film including a microcrystal over the second gate insulating film,

wherein the oxide semiconductor film comprises indium and zinc,

wherein the oxide semiconductor film includes a first region and a second region,

wherein the first region has higher crystallinity than the second region, and

wherein the second region is located over the first region.

2. The semiconductor device according to claim 1 , wherein the oxide semiconductor film further comprises gallium.

3. The semiconductor device according to claim 1 , wherein the first gate insulating film and the second gate insulating film each have a thickness of 50 nm to 100 nm.

4. The semiconductor device according to claim 1 , wherein the oxide semiconductor film has a thickness of 200 nm or less.

5. The semiconductor device according to claim 1 , wherein an amorphous state and a crystalline state exist in the oxide semiconductor film.

6. The semiconductor device according to claim 1 , wherein the oxide semiconductor film does not include any one of copper, silver or antimony.

7. The semiconductor device according to claim 1 , wherein the gate electrode and the first region overlap with each other.

8. A semiconductor device comprising:

a gate electrode over a substrate;

a first gate insulating film over the gate electrode, the first gate insulating film comprising silicon nitride;

a second gate insulating film over the first gate insulating film, the second gate insulating film comprising silicon and oxygen;

an oxide semiconductor film including a microcrystal over the second gate insulating film; and

a passivation film over the oxide semiconductor film,

wherein the passivation film comprises silicon and oxygen, and

wherein the oxide semiconductor film comprises indium and zinc,

wherein the oxide semiconductor film includes a first region and a second region,

wherein the first region has higher crystallinity than the second region, and

wherein the second region is located over the first region.

9. The semiconductor device according to claim 8 , wherein the oxide semiconductor film further comprises gallium.

10. The semiconductor device according to claim 8 , wherein the first gate insulating film and the second gate insulating film each have a thickness of 50 nm to 100 nm.

11. The semiconductor device according to claim 8 , wherein the oxide semiconductor film has a thickness of 200 nm or less.

12. The semiconductor device according to claim 8 , wherein an amorphous state and a crystalline state exist in the oxide semiconductor film.

13. The semiconductor device according to claim 8 , wherein the passivation film is in direct contact with the oxide semiconductor film.

14. The semiconductor device according to claim 8 , wherein the passivation film is in direct contact with the second gate insulating film.

15. The semiconductor device according to claim 8 , wherein the oxide semiconductor film does not include any one of copper, silver or antimony.

16. The semiconductor device according to claim 8 , wherein the gate electrode and the first region overlap with each other.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 8, 2021
From: AKIMOTO, KENGO; HONDA, TATSUYA; SONE, NORIHITO
To: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Reel/Frame 058045/0975 →
Priority Claims (1)
JP 2005-283782 · Sep 29, 2005 · national
Continuity (6)
Continuation 16459951 · Jul 2, 2019
Continuation 16162505 · Oct 17, 2018
Continuation 14816686 · Aug 3, 2015
Continuation 12542068 · Aug 17, 2009
Continuation 11524549 · Sep 21, 2006
Related Publication 20220069137A1 · Mar 3, 2022
Cited By (5)
US 12,243,881 US 12,490,518 US 12,520,589 US 12,543,366 US 12,740,152