IP Library › Granted Patent US 12,216,235
Granted Patent B2
US 12,216,235 · App. 17/766,572 · Granted Feb 4, 2025

Scintillator panel, radiation detector, scintillator panel manufacturing method, and radiation detector manufacturing method

Inventors: Masashi Hatanaka (Hamamatsu, JP); Haruki Yamaji (Hamamatsu, JP); Kazuhiro Shirakawa (Hamamatsu, JP); Keisuke Goto (Hamamatsu, JP); Jun Sakurai (Hamamatsu, JP)
Assignee: HAMAMATSU PHOTONICS K.K.
G01T1/202
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Quick Facts
Patent No.
US 12,216,235
App. No.
17/766,572
Granted
Feb 4, 2025
Kind
B2
Abstract

A scintillator panel includes: a first flexible support body having a first surface and a second surface on a side opposite to the first surface; a scintillator layer formed on the first surface and containing a plurality of columnar crystals; a second flexible support body provided on the second surface; an inorganic layer provided on the second flexible support body so as to be interposed between the second surface and the second flexible support body; and a first adhesive layer bonding the second surface and the inorganic layer to each other. A radiation detector includes: the scintillator panel; and a sensor panel including a photoelectric conversion element, in which the scintillator panel is provided on the sensor panel such that the first surface is on the sensor panel side with respect to the second surface.

Claims (27)

1. A scintillator panel comprising:

a first flexible support body having a first surface and a second surface on a side opposite to the first surface;

a scintillator layer formed on the first surface and containing a plurality of columnar crystals;

a second flexible support body provided on the second surface;

an inorganic layer provided on the second flexible support body so as to be interposed between the second surface and the second flexible support body; and

a first adhesive layer bonding the second surface and the inorganic layer to each other,

wherein the first flexible support body and the second flexible support body have a thickness of 50 μm or more and 250 μm or less in a first direction intersecting with the first surface, and

wherein the inorganic layer has a thickness of 10 μm or more and 100 μm or less in the first direction and is thinner than the first flexible support body and the second flexible support body in the first direction.

2. The scintillator panel according to claim 1 , comprising a protective layer provided so as to cover the first flexible support body, the scintillator layer, the second flexible support body, and the inorganic layer.

3. The scintillator panel according to claim 1 , comprising a second adhesive layer bonding the inorganic layer and the second flexible support body to each other.

4. The scintillator panel according to claim 1 , wherein a difference between the thickness of the first flexible support body and the thickness of the second flexible support body in the first direction is 0 or more and 90 μm or less.

5. The scintillator panel according to claim 1 , wherein the inorganic layer contains Al, Cu, Ti, Fe, or SUS as a material.

6. The scintillator panel according to claim 1 , wherein the first flexible support body and the second flexible support body contain PET, PEN, PI, PP, PE, or PMMA as a material.

7. A radiation detector comprising:

the scintillator panel according to claim 1 ; and

a sensor panel including a photoelectric conversion element,

wherein the scintillator panel is provided on the sensor panel such that the first surface is on the sensor panel side with respect to the second surface.

8. A radiation detector manufacturing method comprising:

a step of preparing the scintillator panel according to claim 1 ;

a step of preparing a sensor panel including a photoelectric conversion element; and

a step of providing the scintillator panel on the sensor panel such that the first surface is on the sensor panel side with respect to the second surface.

9. A scintillator panel manufacturing method comprising:

a step of forming a scintillator layer containing a plurality of columnar crystals on a first surface of a first flexible support body by an evaporation method;

a step of preparing a second flexible support body provided with an inorganic layer; and

a step of bonding the inorganic layer to the first flexible support body with a first adhesive layer such that the inorganic layer is interposed between a second surface of the first flexible support body on a side opposite to the first surface and the second flexible support body,

wherein the first flexible support body and the second flexible support body have a thickness of 50 μm or more and 250 μm or less in a first direction intersecting with the first surface, and

wherein the inorganic layer has a thickness of 10 μm or more and 100 μm or less in the first direction and is thinner than the first flexible support body and the second flexible support body in the first direction.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 5, 2022
From: HATANAKA, MASASHI; YAMAJI, HARUKI; SHIRAKAWA, KAZUHIRO; GOTO, KEISUKE; SAKURAI, JUN
To: HAMAMATSU PHOTONICS K.K.
Reel/Frame 059614/0788 →
Priority Claims (1)
JP 2019-193421 · Oct 24, 2019 · national
Continuity (1)
Related Publication 20240103189A1 · Mar 28, 2024
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