Alignment process for the transfer setup
A method of aligning a first substrate and a second substrate comprises positioning the first substrate having at least a first alignment mark in close proximity to the second substrate having at least a second alignment mark, measuring an alignment value between the first and second alignment marks of both the first and second substrate; and adjusting the position of the first substrate and the second substrate based on the measured alignment value.
1. A method of aligning a first substrate and a second substrate comprising:
positioning the first substrate in close proximity to the second substrate, wherein the first substrate has at least a first alignment mark comprising four plates and wherein the second substrate has at least a second alignment mark comprising a single plate, and wherein the close proximity is a proximity at which the first alignment mark and the second alignment mark form a capacitance;
measuring an alignment value between the first and second alignment marks of both the first and second substrate; and
adjusting the position of the first substrate and the second substrate based on the measured alignment value.
2. The method of claim 1 , wherein a detector and signal source are on the first substrate and a transfer medium is formed on the second substrate.
3. The method of claim 2 , wherein as the signal source and detector are aligned with the transfer medium, a signal detected by the detector is maximized.
4. The method of claim 3 , wherein the transfer medium can be a conductive trace.
5. The method of claim 3 , wherein a combination of signal, detector and transfer medium can be in different orientations to assist in different misalignment signals.
6. The method of claim 1 , wherein two detectors and signal source are on the first substrate and a transfer medium is formed on the second substrate.
7. The method of claim 6 , wherein as the signal source and detector are aligned with the transfer medium, a signal passed to the transfer medium is detected by the two detectors.
8. The method of claim 7 , wherein the signal received by both detectors is equalized and maximized such that each detector, signal and medium set assists in offset and rotation misalignment.
9. The method of claim 8 , wherein more sets can assist in fine tuning misalignment information.
10. The method of claim 8 , wherein a misalignment information is used to align substrates.
11. The method of claim 8 , where in a size of the transfer medium, the detector and the signal is used to define an alignment accuracy.
12. The method of claim 8 , where in a size of the detector and the signal is used to define an alignment accuracy.
13. The method of claim 11 , wherein if the size of the transfer medium is larger than the detector or the signal then coarse alignment is addressed.
14. The method of claim 11 , wherein if the size of the transfer medium is the same as the detector or the signal then fine alignment is addressed.
15. The method of claim 1 , wherein measuring the alignment value between the alignment marks of both the first and second substrate comprising:
extracting the alignment value at a current position of the substrates; and
moving the substrates with respect to each other in different directions to measure a change in the alignment value.
16. The method of claim 15 , further comprising:
comparing the alignment value to the change in the alignment value; and
adjusting the position of the first substrate and the second substrate based on comparing.
17. The method of claim 15 , wherein adjusting the position of the first substrate and the second substrate based on comparing comprises one of: maximizing, minimizing or equalizing the alignment value for each alignment mark.
18. The method of claim 1 , wherein the four plates and the single plate are metal plates or capacitive plates.
19. The method of claim 18 , wherein the alignment value is maximized between the capacitive plates.
20. The method of claim 1 , wherein the first alignment mark comprises charge trapped on a surface of the first substrate and the second alignment mark on the second substrate comprises a metal plate on a surface of the second substrate.
21. The method of claim 1 , wherein the first alignment mark comprises a shield plate on a surface of the first substrate and the alignment mark on the second substrate comprises a receiver plate on the second substrate.
22. The method of claim 21 , wherein the alignment value is minimized between the shield plate and the receiver plate.
23. The method of claim 1 , wherein the single plate is a metal plate.
24. The method of claim 23 , wherein the alignment value for the four plates and the single plate is equalized by moving one of the first substrate or the second substrate.
25. The method of claim 1 , wherein the alignment value comprises one of: a capacitance value, inductance value, a charge value, or another electrical signal value between the substrates.