Components of an electronic device and methods for their assembly
Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.
1. An electronic device comprising:
a housing:
a communication assembly coupled to the housing and configured to receive a signal; and
a cover plate coupled to the housing and defining a portion of a backside of the housing, the cover plate being transparent to the signal;
wherein an area defined by a backside of the housing opaque to the signals is greater than an area defined by the cover plate.
2. The electronic device of claim 1 , wherein the portion of the backside is opaque to light.
3. The electronic device of claim 1 , wherein the housing comprises sidewalls defining a front opening and a rear opening.
4. The electronic device of claim 3 , wherein the cover plate is disposed in the rear opening.
5. The electronic device of claim 4 , further comprising a cover glass positioned over the front opening opposite the cover plate.
6. The electronic device of claim 3 , wherein:
the cover plate and the side walls define a cavity;
the communication assembly comprises a first antenna assembly disposed in the cavity; and
the electronic device further comprises a second communication assembly disposed in the cavity.
7. The electronic device of claim 6 , wherein:
the first communication assembly is disposed within the cavity adjacent to the cover plate; and
the second communication assembly is disposed at an end of the housing.
8. The electronic device of claim 1 , wherein the area defined by a backside of the housing not transparent to the signals comprises metal.
9. The electronic device of claim 8 , wherein the metal comprises aluminum.
10. An electronic device housing comprising:
a backside coupled to the housing, the backside including:
an antenna configured to receive a signal;
a first region being transparent to the signal; and
a second region being non-transparent to the signal;
wherein an area defined by the second region is greater than an area defined by the first region.
11. The electronic device housing of claim 10 , wherein the first region of the backside comprises glass.
12. The electronic device housing of claim 10 , wherein the second region of the backside comprises metal.
13. The electronic device housing of claim 10 , wherein the first region of the backside comprises a first transparent region and a second transparent region.
14. The electronic device housing of claim 13 , wherein the first transparent region defines an end of the backside of the housing.
15. The electronic device housing of claim 14 , further comprising sidewalls disposed perpendicular to the backside;
wherein the first transparent region is adhered directly to the sidewalls.
16. An electronic device comprising:
a housing including a backside opposite a display and defining a radio frequency (RF)-opaque area; and
a cover plate defining an area of the backside and comprising an antenna assembly including a radio frequency (RF)-transparent cover coupled to the housing;
wherein:
the cover plate comprises two separate portions;
at least one portion of the two separate portions defines and end portion of the backside; and
the RF-opaque area is greater than an area defined by the cover plate.
17. The electronic device of claim 16 , wherein the RF-opaque area defined by the backside comprises aluminum.