IP Library Granted Patent US 12,247,288
Granted Patent B2
US 12,247,288 · App. 17/734,615 · Granted Mar 11, 2025

Substrate processing apparatus and method

Inventors: Väinö Kilpi (Masala, FI); Tom Blomberg (Masala, FI)
Assignee: Picosun Oy
C23C16/4583C23C16/45544H01L21/67748H01L21/6875
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Quick Facts
Patent No.
US 12,247,288
App. No.
17/734,615
Granted
Mar 11, 2025
Kind
B2
Abstract

A substrate processing apparatus ( 100 ), comprising a reaction chamber ( 20 ) having an upper portion ( 20 a ) and a lower portion ( 20 b ) sealing an inner volume of the reaction chamber ( 20 ) for substrate processing, the lower portion ( 20 b ) being movable apart from the upper portion ( 20 a ) to form a substrate loading gap therebetween, a substrate support system comprising a support table ( 31 ) and at least one support element ( 70 ) vertically movable in relation to the support table ( 31 ) and extending through the support table ( 31 ) to receive a substrate within the reaction chamber ( 20 ), and a stopper ( 90 ) stopping a downward movement of the at least one support element ( 70 ) at a substrate loading level.

Claims (19)

1. A substrate processing apparatus, comprising:

a reaction chamber having an upper portion and a lower portion sealing an inner volume of the reaction chamber for substrate processing, the lower portion being movable apart from the upper portion to form a substrate loading gap therebetween;

a substrate support system comprising a support table and at least one support element vertically movable in relation to the support table and extending through the support table to receive a substrate within the reaction chamber, the apparatus further comprising:

a stopper stopping a downward movement of the at least one support element at a substrate loading level, and

a stationary attachment part supporting the stopper,

wherein the upper portion and lower portion are configured to come into contact in order to seal the inner volume, and

wherein the lower portion comprises an exhaust line, wherein the stationary attachment part extends from the exhaust line.

2. The substrate processing apparatus of claim 1 , wherein the apparatus is configured to move the lower portion with the support table.

3. The substrate processing apparatus of claim 1 , wherein the apparatus is configured to move the at least one support element downwards with the support table until the at least one support element is stopped by the stopper.

4. The substrate processing apparatus of claim 3 , wherein the apparatus is configured to move the support table further downwards after the at least one support element has been stopped by the stopper.

5. The substrate processing apparatus of claim 1 , wherein the apparatus is configured to lift the at least one support element with the support table upwards to a substrate processing position.

6. The substrate processing apparatus of claim 1 , wherein the support table is attached to the reaction chamber and the support table and the lower portion of the reaction chamber are configured to move as one package up-and-down, the at least one support element and the support table are configured to rise together above a substrate loading level, and the at least one support element is configured to stay on the loading level, stopped by the stopper, while the support table is lowered, together with the lower portion, below the loading level.

7. The substrate processing apparatus of claim 1 , comprising an outer chamber at least partly surrounding the reaction chamber.

8. The substrate processing apparatus of claim 1 , wherein the at least one support element is in the form of a pin with an enlarged top.

9. The substrate processing apparatus of claim 1 , configured to process at least one substrate within the reaction chamber by sequential self-limiting surface reactions.

10. The substrate processing apparatus of claim 1 , wherein the at least one support element is vertically movable within an enclosure arranged in the substrate support system.

11. The substrate processing apparatus of claim 1 , wherein the stopper is configured to remain stationary relative to the upper portion of the reaction chamber.

12. The substrate processing apparatus of claim 1 , wherein the at least one support element comprises a pin, the stopper being configured to stop the pin such that a top of the pin remains at a loading height of a loading robot.

13. The substrate processing apparatus of claim 1 , wherein the at least one support element is configured to protrude from the support table during loading of a substrate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 2, 2022
From: KILPI, VAINO; BLOMBERG, TOM
To: PICOSUN OY
Reel/Frame 059783/0438 →
Priority Claims (1)
FI 20215556 · May 10, 2021 · national
Continuity (1)
Related Publication 20220356575A1 · Nov 10, 2022
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