Semiconductor device and method of manufacture
Semiconductor devices and methods which utilize a treatment process of a bottom anti-reflective layer are provided. The treatment process may be a physical treatment process in which material is added in order to fill holes and pores within the material of the bottom anti-reflective layer or else the treatment process may be a chemical treatment process in which a chemical reaction is used to form a protective layer. By treating the bottom anti-reflective layer the diffusion of subsequently applied chemicals is reduced or eliminated, thereby helping to prevent defects that arise from such diffusion.
1. A method of manufacturing a semiconductor device, the method comprising:
forming a hard mask over a gate layer;
placing and patterning a polymer layer over the hard mask;
filling pores within the polymer layer using capillary forces;
applying an etchant to the hard mask, wherein the pores are filled during the applying the etchant; and
removing the polymer layer after the applying the etchant.
2. The method of claim 1 , further comprising:
placing a photosensitive layer over the polymer layer prior to the patterning the polymer layer; and
removing the photosensitive layer prior to the filling the pores.
3. The method of claim 1 , wherein the filling the pores is performed with a first treatment chemical, the first treatment chemical having a viscosity of between about 1 cp and about 3 cp.
4. The method of claim 1 , wherein the filling the pores is performed with a first treatment chemical, the first treatment chemical having a surface tension of between about 10 mN/m and about 30 mN/m.
5. The method of claim 1 , wherein the filling the pores is performed with a first treatment chemical, the first treatment chemical having a specific gravity of between about 0.7 and about 2.
6. The method of claim 1 , wherein the filling the pores is performed with a first treatment chemical, the first treatment chemical having a water solubility of between about 10 −1 g/mL and about 10 −4 g/mL.
7. The method of claim 1 , wherein the filling the pores is performed with a first treatment chemical that does not chemically react with subsequently applied chemicals.
8. A method of manufacturing a semiconductor device, the method comprising:
forming a first gate layer over a raised semiconductor region;
applying a layer over the first gate layer;
using a photoresist to pattern the layer;
reacting a surface of the layer to form a barrier region; and
after the reacting, using an etchant to expose the first gate layer, wherein during the reacting the etchant is prevented from moving into the layer by the barrier region.
9. The method of claim 8 , wherein the reacting the surface of the layer utilizes at least in part citric acid.
10. The method of claim 8 , wherein the reacting the surface of the layer utilizes at least in part acetic acid.
11. The method of claim 8 , wherein the reacting the surface of the layer utilizes at least in part hexamethyldisilazane.
12. The method of claim 8 , wherein the reacting the surface of the layer utilizes at least in part an organic molecule with an OH group.
13. The method of claim 8 , wherein the reacting the surface of the layer utilizes at least in part an organic molecule with a carboxylic acid group.
14. The method of claim 8 , wherein the reacting the surface of the layer is performed at a temperature of between about 5° C. and about 25° C.
15. A method of manufacturing a semiconductor device, the method comprising:
forming a plurality of gate layers over a semiconductor fin;
depositing a polymer with a chromophore onto the plurality of gate layers; and
applying a first material and a second material to the polymer, wherein the first material works in conjunction with the polymer to protect the plurality of gate layers from the second material.
16. The method of claim 15 , wherein the second material comprises ammonium hydroxide.
17. The method of claim 15 , wherein the second material comprises phosphoric acid.
18. The method of claim 15 , wherein the second material comprises hydrogen peroxide.
19. The method of claim 15 , wherein the first material works in conjunction with the polymer to form a protective layer.
20. The method of claim 19 , wherein the protective layer has a thickness of between about 5 Å and about 10 Å.