Card-type medium and card-type medium manufacturing method
A card-type medium includes a card body; an exposed component that is accommodated inside an opening formed in a front surface of the card body and is disposed so as to be partially exposed on the front surface; and a circuit board that is embedded in the card body and to which the exposed component is attached. The exposed component includes a first exposed component that is attached to the circuit board with an intermediate spacer interposed therebetween. The first exposed component and the intermediate spacer are joined together by a first conductive joining material. The circuit board and the intermediate spacer are joined together by a second conductive joining material. A joint-forming temperature of the first conductive joining material and a joint-forming temperature of the second conductive joining material are different from each other.
1. A card-type medium, comprising:
a card body;
an exposed component that is accommodated inside an opening formed in a front surface of the card body and is disposed so as to be partially exposed on the front surface; and
a circuit board that is embedded in the card body and to which the exposed component is attached, wherein
the exposed component includes a first exposed component that is attached to the circuit board with an intermediate spacer interposed therebetween,
the first exposed component and the intermediate spacer are joined together by a first conductive joining material,
each of the first exposed component and the intermediate spacer comprises glass epoxy;
the circuit board and the intermediate spacer are joined together by a second conductive joining material, and,
a difference between a joint-forming temperature of the first conductive joining material and a joint-forming temperature of the second conductive joining material is 20° C. or higher.
2. The card-type medium of claim 1 , wherein
the joint-forming temperature of the first conductive joining material is higher than the joint-forming temperature of the second conductive joining material.
3. A card-type medium manufacturing method for manufacturing the card-type medium of claim 2 , the card-type medium manufacturing method comprising the steps of:
joining the first exposed component and the intermediate spacer together by the first conductive joining material; and
joining the intermediate spacer joined to the first exposed component and the circuit board together by the second conductive joining material.
4. The card-type medium of claim 2 , wherein the difference between a joint-forming temperature of the first conductive joining material and a joint-forming temperature of the second conductive joining material is 30° C. or higher.
5. The card-type medium of claim 1 , wherein
the joint-forming temperature of the second conductive joining material is higher than the joint-forming temperature of the first conductive joining material.
6. A card-type medium manufacturing method for manufacturing the card-type medium of claim 3 , the card-type medium manufacturing method comprising the steps of:
joining the circuit board and the intermediate spacer together by the second conductive joining material; and,
joining the intermediate spacer joined to the circuit board and the first exposed component together by the first conductive joining material.
7. The card-type medium of claim 5 , wherein the difference between a joint-forming temperature of the first conductive joining material and a joint-forming temperature of the second conductive joining material is 30° C. or higher.
8. The card-type medium of claim 1 , wherein
the exposed component includes a second exposed component that is directly joined to the circuit board.
9. The card-type medium of claim 8 , wherein
the first exposed component includes a fingerprint sensor, and
the second exposed component includes a contact terminal.
10. The card-type medium of claim 1 , wherein the difference between a joint-forming temperature of the first conductive joining material and a joint-forming temperature of the second conductive joining material is 30° C. or higher.
11. The card-type medium of claim 1 , wherein the joint-forming temperature of the first conductive joining material is between 200° C. and 250° C., inclusive and the joint-forming temperature of the second conductive joining material is between 120° C. and 180° C., inclusive.
12. The card-type medium of claim 11 , wherein the joint-forming temperature of the second conductive joining material is between 120° C. and 170° C., inclusive.
13. The card-type medium of claim 11 , wherein the first exposed component is a fingerprint sensor.
14. The card-type medium of claim 1 , wherein the joint-forming temperature of the second conductive joining material is between 120° C. and 170° C., inclusive.
15. The card-type medium of claim 1 , wherein the first exposed component is a fingerprint sensor.