Plasma-enhanced atomic layer deposition with radio-frequency power ramping
Methods and apparatuses for depositing thin films using plasma-enhanced atomic layer deposition (PEALD) with ramping radio-frequency (RF) power are provided herein. Embodiments involve increasing the RF power setting of PEALD cycles after formation of initial screening layers at low RF power settings.
1. A method of depositing a film, the method comprising:
providing a substrate to a process chamber;
depositing a first amount of a material over the substrate in a first plasma-enhanced atomic layer deposition (PEALD) cycle, the first PEALD cycle comprising:
exposing the substrate to a precursor under conditions allowing the precursor to adsorb onto a surface of the substrate, thereby forming a first adsorbed layer of the precursor; and
exposing the first adsorbed layer of the precursor to a first plasma generated using a first plasma power level;
depositing a second amount of the material over the substrate in a second PEALD cycle, the second PEALD cycle comprising:
exposing the substrate to the precursor under conditions allowing the precursor to adsorb onto the first amount of the material, thereby forming a second adsorbed layer of the precursor; and
exposing the second adsorbed layer of the precursor to a second plasma generated using a second plasma power level, wherein the second plasma power level is greater than the first plasma power level and wherein the second PEALD cycle is performed after the first PEALD cycle; and
depositing a third amount of the material over the substrate in a third PEALD cycle, the third PEALD cycle comprising:
exposing the substrate to the precursor under conditions allowing the precursor to adsorb onto the second amount of the material, thereby forming a third adsorbed layer of the precursor; and
exposing the third adsorbed layer of the precursor to a third plasma generated using a third plasma power level, wherein the third plasma power level is greater than the second plasma power level and wherein the third PEALD cycle is performed after the second PEALD cycle,
wherein the first amount of material and the second amount of the material comprise screening layers configured to block damage from deposition of the third amount of material, and wherein at least one of the second plasma power level or the third pasma power level is determined based at least in part on a damage threshold and are determined based on properties of the screening layers, the damage threshold being a per-cycle damage threshold determined based on a cumulative damage threshold indicating a maximum amount of one or more underlying layers that can be removed, wherein the per-cycle damage threshold accounts for a larger number of underlying layers removed during deposition of the first amount of material compared to the second amount of material.
2. The method of claim 1 , wherein the substrate comprises a 300-mm wafer, wherein the first plasma power level is less than 1.0 kilowatts for the 300-mm wafer, and wherein the third plasma power level is greater than 2.0 kilowatts for the 300-mm wafer.
3. The method of claim 1 , wherein the substrate comprises a 300-mm wafer, wherein the first plasma power level is less than 500 watts for the 300-mm wafer, and wherein the third plasma power level is greater than 3.5 kilowatts for the 300-mm wafer.
4. The method of claim 1 , wherein the first plasma power level is no more than one-half of the second plasma power level.
5. The method of claim 1 , wherein the substrate comprises a 300-mm wafer, wherein the first plasma power level is less than 1.0 kilowatts for the 300-mm wafer, and wherein the first PEALD cycle is repeated, including using the first plasma power level, until a thickness of a deposited material exceeds 20 angstroms.
6. The method of claim 1 , wherein the first PEALD cycle is repeated at least twenty times before the second PEALD cycle is performed.
7. The method of claim 1 , further comprising:
depositing a fourth amount of the material over the substrate in a fourth PEALD cycle, the fourth PEALD cycle comprising:
exposing the substrate to the precursor under conditions allowing the precursor to adsorb onto the surface of the substrate, thereby forming a fourth adsorbed layer of the precursor; and
exposing the fourth adsorbed layer of the precursor to a fourth plasma generated using a fourth plasma power level, wherein the fourth plasma power level is greater than the third plasma power level and wherein the fourth PEALD cycle is performed after the third PEALD cycle.
8. The method of claim 7 , wherein the substrate comprises a 300-mm wafer, wherein the first plasma power level is less than 500 watts for the 300-mm wafer, and wherein the fourth plasma power level is greater than 3.5 kilowatts for the 300-mm wafer.
9. The method of claim 1 , wherein the material comprises silicon oxide.
10. A method of depositing a film, the method comprising:
receiving a substrate in a process chamber; and
depositing a material over the substrate in a plurality of plasma-enhanced atomic layer deposition (PEALD) cycles, each cycle comprising:
exposing the substrate to a precursor under conditions allowing the precursor to adsorb onto a surface of the substrate, thereby forming an adsorbed layer of the precursor; and
exposing the adsorbed layer of the precursor to a plasma provided using a radio-frequency (RF) generator with a variable power setting,
wherein depositing the material over the substrate in the plurality of PEALD cycles comprises:
setting the variable power setting of the RF generator to a first power level for a first PEALD cycle to deposit a first amount of the material,
setting the variable power setting of the RF generator to a second power level for a second PEALD cycle to deposit a second amount of the material over the first amount of material, and
setting the variable power setting of the RF generator to a third power level for a third PEALD cycle to deposit a third amount of the material over the second amount of material,
wherein the third power level is greater than the second power level,
wherein the second power level is greater than the first power level,
wherein the third PEALD cycle occurs after the second PEALD cycle,
wherein the second PEALD cycle occurs after the first PEALD cycle,
wherein the first amount of material and the second amount of material each comprise screening layers configured to block damage from deposition of the third amount of material, and
wherein at least one of the second plasma power level or the third plasma power level is determined based at least in part on a damage threshold and are determined based on properties of the screening layers, the damage threshold being a per-cycle damage threshold determined based on a cumulative damage threshold indicating a maximum amount of one or more underlying layers that can be removed, wherein the per-cycle damage threshold accounts for a larger number of underlying layers removed during deposition of the first amount of material compared to the second amount of material.
11. The method of claim 10 , wherein the substrate comprises a single wafer, wherein the first power level is less than 1.0 kilowatts for the single wafer, and wherein the third power level is greater than 2.0 kilowatts for the single wafer.
12. The method of claim 10 , wherein the substrate comprises a single wafer, wherein the first power level is less than 500 watts for the single wafer, and wherein the third power level is greater than 3.5 kilowatts for the single wafer.
13. The method of claim 10 , wherein the first power level is no more than one-half of the third power level.
14. The method of claim 10 , wherein the substrate comprises a single wafer, wherein the first power level is less than 1.0 kilowatts for the single wafer, and wherein the first PEALD cycle is repeated, including using the first power level, until a thickness of a deposited material exceeds 20 angstroms.
15. The method of claim 10 , wherein the first PEALD cycle is repeated at least twenty times before the second PEALD cycle is performed.
16. The method of claim 10 , wherein depositing the material over the substrate in the plurality of PEALD cycles comprises setting the variable power setting of the RF generator to a fourth power level for a fourth PEALD cycle, wherein the fourth power level is greater than the third power level, and wherein the fourth PEALD cycle occurs after the third PEALD cycle.
17. The method of claim 16 , wherein the substrate comprises a single wafer, wherein the first power level is less than 500 watts for the single wafer, and wherein the fourth power level is greater than 3.5 kilowatts for the single wafer.
18. The method of claim 11 , wherein the material comprises silicon oxide.