IP Library › Granted Patent US 12,273,052
Granted Patent B2
US 12,273,052 · App. 18/500,462 · Granted Apr 8, 2025

Apparatus and method for contactless transportation of a carrier

Inventors: Thorsten Meiss (Darmstadt, DE); Alexander Sendobry (Mühltal, DE)
Assignee: Applied Materials, Inc.
H02N15/00
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,273,052
App. No.
18/500,462
Granted
Apr 8, 2025
Kind
B2
Abstract

An apparatus for contactless transportation of a carrier is provided. The apparatus includes the carrier, being a substrate carrier or a mask carrier. The apparatus includes a linear reluctance motor for providing both a contactless levitation and a contactless drive of the carrier. The linear reluctance motor includes one or more linear stators defining a transportation track for the carrier. The linear reluctance motor includes a mover attached to the carrier. The linear reluctance motor includes a set of electromagnets and a first magnetic material. The one or more linear stators include the set of electromagnets and the mover includes the first magnetic material, or the mover includes the set of electromagnets and the one or more linear stators include the first magnetic material. The apparatus includes a controller connected to the set of electromagnets.

Claims (52)

1. A substrate carrier assembly, comprising:

a carrier configured to support a substrate; and

a first mover coupled to the carrier, the first mover comprising:

a first set of poles extending in a first direction; and

a second mover coupled to the carrier, the second mover comprising:

a second set of poles extending in the first direction, wherein:

each pole of the first set and the second set comprise a ferromagnetic material;

the first set is spaced apart in a second direction from the second set; and

the first direction and the second direction are at a first angle to each other.

2. The substrate carrier assembly of claim 1 , wherein the first mover further comprises a first elongated bar that comprises the first set of poles, wherein the second mover further comprises a second elongated bar that comprises the second set of poles, and wherein the first elongated bar and the second elongated bar each comprise a single material.

3. The substrate carrier assembly of claim 2 , wherein the first set of poles and the second set of poles are formed in a linear array that extends in the first direction.

4. The substrate carrier assembly of claim 3 , wherein the first set of poles and the second set of poles extend in a third direction that is perpendicular to the first direction and the second direction.

5. The substrate carrier assembly of claim 1 , further comprising:

a third mover coupled to the carrier, the third mover comprising:

a third set of poles extending in the second direction; and

a fourth mover coupled to the carrier, the fourth mover comprising:

a fourth set of poles extending in the second direction, wherein:

each pole of the third set of poles and the fourth set of poles comprise a ferromagnetic material; and

the third set of poles is spaced apart in the first direction from the fourth set of poles.

6. The substrate carrier assembly of claim 1 , wherein the carrier comprises an opening for receiving the substrate.

7. The substrate carrier assembly of claim 6 , wherein the opening extends in the second direction and a third direction, wherein the third direction is perpendicular to the first direction and the second direction.

8. The substrate carrier assembly of claim 6 , further comprising one or more support portions coupled to the carrier and extending into the opening, the one or more support portions being configured to support the substrate.

9. The substrate carrier assembly of claim 1 , wherein the first set of poles and the second set of poles each comprise a surface that comprises a plurality protrusions.

10. The substrate carrier assembly of claim 1 , wherein

the carrier further comprises a first edge and a second edge, the second edge being opposite to the first edge,

the first set of poles are positioned adjacent to the first edge, and

the second set of poles are positioned adjacent to the second edge.

11. The substrate carrier assembly of claim 1 , wherein the carrier is configured to support a second substrate.

12. The substrate carrier assembly of claim 1 , further comprising a first elongated bar that comprises the first set of poles and a second elongated bar that comprises the second set of poles, and the first elongated bar and the second elongated bar each comprise a silicon steel, a ferritic steel or a martensitic steel.

13. A substrate carrier assembly, comprising:

a carrier configured to support a substrate; and

a first elongated bar coupled to the carrier, comprising:

a first set of poles extending in a first direction; and

a second elongated bar coupled to the carrier, comprising:

a second set of poles extending in a second direction, wherein:

each pole of the first set and the second set comprise a ferromagnetic material; and

the first direction and the second direction are at a first angle to each other.

14. The substrate carrier assembly of claim 13 , wherein the first set of poles form a first linear arrangement in the first direction, and wherein the second set of poles form a second linear arrangement in the second direction.

15. The substrate carrier assembly of claim 13 , wherein the carrier comprises an opening for receiving the substrate.

16. The substrate carrier assembly of claim 15 , further comprising one or more support portions coupled to the carrier and extending into the opening, the one or more support portions being configured to support the substrate.

17. The substrate carrier assembly of claim 13 , wherein the first elongated bar and the second elongated bar each comprise a silicon steel, a ferritic steel or a martensitic steel.

18. A substrate carrier assembly, comprising:

a carrier configured to support a substrate; and

a mover coupled to the carrier, the mover comprising:

a first set of poles extending in a first direction;

a second set of poles extending in a second direction; and

a third set of poles extending in the first direction or the second direction, wherein:

each pole of the first set, the second set, and the third set comprise ferromagnetic material; and

the first direction and the second direction are at a first angle to each other.

19. The substrate carrier assembly of claim 13 , wherein the carrier comprises an opening for receiving the substrate, and wherein the carrier substrate assembly further comprises:

one or more support portions coupled to the carrier and extending into the opening, the one or more support portions being configured to support the substrate.

20. The substrate carrier assembly of claim 18 , wherein the first set of poles are arranged to provide a reluctance-based angular force for moving the carrier in the first direction, and wherein the second set of poles are arranged to provide another reluctance-based angular force for moving the carrier in the second direction.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 30, 2023
From: MEISS, THORSTEN; SENDOBRY, ALEXANDER
To: MECATRONIX GMBH
Reel/Frame 065712/0665 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 30, 2023
From: MECATRONIX GBMH
To: APPLIED MATERIALS, INC.
Reel/Frame 065712/0699 →
Continuity (2)
Continuation 18081493 · Dec 14, 2022
Related Publication 20240204697A1 · Jun 20, 2024
References Cited (132)
US 5180048A · Kawada et al. · 1993 [cited by applicant]
US 5569350A · Osada et al. · 1996 [cited by applicant]
US 5641054A · Mori et al. · 1997 [cited by applicant]
US 6157106A · Tietz et al. · 2000 [cited by applicant]
US 6206176B1 · Blonigan et al. · 2001 [cited by applicant]
US 6231716B1 · White et al. · 2001 [cited by applicant]
US 7293850B2 · Bonora et al. · 2007 [cited by applicant]
US 7293950B2 · Bonora et al. · 2007 [cited by applicant]
US 7438175B2 · White et al. · 2008 [cited by applicant]
US 7841820B2 · Bonora et al. · 2010 [cited by applicant]
US 7948122B2 · Compter et al. · 2011 [cited by applicant]
US 7964038B2 · Patalay et al. · 2011 [cited by applicant]
US 7994486B2 · Smick et al. · 2011 [cited by applicant]
US 8104951B2 · Aderhold et al. · 2012 [cited by applicant]
US 8851817B2 · Bonora · 2014 [cited by examiner]
US 9390950B2 · Sorabji et al. · 2016 [cited by applicant]
US 9588443B2 · Shibazaki · 2017 [cited by applicant]
US 9964863B1 · Babayan et al. · 2018 [cited by applicant]
US 10204810B2 · Hoey et al. · 2019 [cited by applicant]
US 10236197B2 · Janakiraman et al. · 2019 [cited by applicant]
US 10256124B2 · Mooring · 2019 [cited by applicant]
US 10262887B2 · Hao et al. · 2019 [cited by applicant]
US 10283397B2 · Willwerth et al. · 2019 [cited by applicant]
US 10460977B2 · Breninger et al. · 2019 [cited by applicant]
US 10483141B2 · Janakiraman et al. · 2019 [cited by applicant]
US 10490436B2 · Ghosh et al. · 2019 [cited by applicant]
US 10734265B2 · Janakiraman et al. · 2020 [cited by applicant]
US 10770337B2 · Lee et al. · 2020 [cited by applicant]
US 10784142B2 · Marcelynas et al. · 2020 [cited by applicant]
US 10851453B2 · Tsai et al. · 2020 [cited by applicant]
US 10892180B2 · Chia et al. · 2021 [cited by applicant]
US 11232965B2 · Newman et al. · 2022 [cited by applicant]
US 11377310B2 · Aust et al. · 2022 [cited by applicant]
US 11508595B2 · Aust et al. · 2022 [cited by applicant]
US 11521870B2 · Kamesh · 2022 [cited by examiner]
US 11527424B2 · Berger et al. · 2022 [cited by applicant]
US 11774864B2 · Aoki · 2023 [cited by applicant]
US 20020018842A1 · Dunlow · 2002 [cited by applicant]
US 20020108842A1 · Bonora et al. · 2002 [cited by applicant]
US 20030178145A1 · Anderson et al. · 2003 [cited by applicant]
US 20030219977A1 · Pomarede et al. · 2003 [cited by applicant]
US 20040023495A1 · Butterfield et al. · 2004 [cited by applicant]
US 20040058293A1 · Nguyen et al. · 2004 [cited by applicant]
US 20040255442A1 · McDiarmid et al. · 2004 [cited by applicant]
US 20060102078A1 · Fairbairn et al. · 2006 [cited by applicant]
US 20060156981A1 · Fondurulia et al. · 2006 [cited by applicant]
US 20070160507A1 · Satoh et al. · 2007 [cited by applicant]
US 20070269297A1 · Meulen et al. · 2007 [cited by applicant]
US 20080175694A1 · Park et al. · 2008 [cited by applicant]
US 20080232947A1 · van der Meulen et al. · 2008 [cited by applicant]
US 20080266037A1 · Williams · 2008 [cited by applicant]
US 20090314211A1 · Du Bois et al. · 2009 [cited by applicant]
US 20100062592A1 · Clark · 2010 [cited by applicant]
US 20100136773A1 · Akae et al. · 2010 [cited by applicant]
US 20100226737A1 · Sakaue et al. · 2010 [cited by applicant]
US 20110312189A1 · Kim et al. · 2011 [cited by applicant]
US 20120109355A1 · Baccini et al. · 2012 [cited by applicant]
US 20120213614A1 · Bonora et al. · 2012 [cited by applicant]
US 20120249291A1 · Holcomb et al. · 2012 [cited by applicant]
US 20130171757A1 · Ponnekanti et al. · 2013 [cited by applicant]
US 20140020629A1 · Tsai et al. · 2014 [cited by applicant]
US 20150188399A1 · Fukasawa · 2015 [cited by examiner]
US 20160076910A1 · Ausserlechner · 2016 [cited by examiner]
US 20180339816A1 · Oldendorf et al. · 2018 [cited by applicant]
US 20180374732A1 · Klein et al. · 2018 [cited by applicant]
US 20190348264A1 · Tsai et al. · 2019 [cited by applicant]
US 20200026060A1 · Takato · 2020 [cited by applicant]
US 20200232088A1 · White et al. · 2020 [cited by applicant]
US 20200262060A1 · Hosek et al. · 2020 [cited by applicant]
US 20200262660A1 · Hosek et al. · 2020 [cited by applicant]
US 20200381276A1 · Yedla et al. · 2020 [cited by applicant]
US 20210024929A1 · Yokota et al. · 2021 [cited by applicant]
US 20210249291A1 · Raatz et al. · 2021 [cited by applicant]
US 20210265188A1 · Moura et al. · 2021 [cited by applicant]
US 20210296150A1 · Berger et al. · 2021 [cited by applicant]
US 20210328146A1 · Heymanns et al. · 2021 [cited by applicant]
US 20210354934A1 · Aust et al. · 2021 [cited by applicant]
US 20220003718A1 · Watanabe · 2022 [cited by applicant]
US 20220013383A1 · Savandaiah et al. · 2022 [cited by applicant]
US 20220037181A1 · Hatano et al. · 2022 [cited by applicant]
US 20220130700A1 · Newman et al. · 2022 [cited by applicant]
US 20220208426A1 · Aust et al. · 2022 [cited by applicant]
US 20220293451A1 · Sulyman et al. · 2022 [cited by applicant]
US 20220293452A1 · Sulyman et al. · 2022 [cited by applicant]
US 20220336258A1 · Srivastava et al. · 2022 [cited by applicant]
US 20220393618A1 · Aust et al. · 2022 [cited by applicant]
US 20220415635A1 · Yedla et al. · 2022 [cited by applicant]
US 20220415687A1 · Hatano et al. · 2022 [cited by applicant]
US 20220415688A1 · Hatano et al. · 2022 [cited by applicant]
US 20230132174A1 · Thanu et al. · 2023 [cited by applicant]
CN 101158852A · 2008 [cited by applicant]
CN 113707585A · 2021 [cited by applicant]
DE 102018006259A1 · 2019 [cited by applicant]
EP 1681261A1 · 2006 [cited by applicant]
EP 4222779A1 · 2023 [cited by applicant]
JP 62121134A · 1987 [cited by applicant]
JP H06324297A · 1994 [cited by applicant]
KR 1020210081597A · 2021 [cited by applicant]
KR 1020220099611A · 2022 [cited by applicant]
TW 202141675A · 2021 [cited by applicant]
WO 2008077048A2 · 2008 [cited by applicant]
WO 2011102410A1 · 2011 [cited by applicant]
WO 2015007385A1 · 2015 [cited by applicant]
WO 2015043712A1 · 2015 [cited by applicant]
WO 2015140155A1 · 2015 [cited by applicant]
WO 2015158725A1 · 2015 [cited by applicant]
WO 2015162177A1 · 2015 [cited by applicant]
WO 2015189263A1 · 2015 [cited by applicant]
WO 2016162288A1 · 2016 [cited by applicant]
WO 2019037858A1 · 2019 [cited by applicant]
WO 2019052657A1 · 2019 [cited by applicant]
WO 2019145035A1 · 2019 [cited by applicant]
WO 2019238416A1 · 2019 [cited by applicant]
WO 2020126040A1 · 2020 [cited by applicant]
WO 2020192911A1 · 2020 [cited by applicant]
WO 2021106796A1 · 2021 [cited by applicant]
WO 2021106799A1 · 2021 [cited by applicant]
WO 2021223843A1 · 2021 [cited by applicant]
WO 2022044834A1 · 2022 [cited by applicant]
International Search Report/ Written Opinion issued to PCT/US2023/079455 on Mar. 6, 2024. [cited by applicant]
U.S. Appl. No. 18/081,493, filed Dec. 14, 2022. [cited by applicant]
U.S. Appl. No. 18/141,909, filed May 1, 2023. [cited by applicant]
U.S. Appl. No. 18/141,914, filed May 1, 2023. [cited by applicant]
U.S. Appl. No. 18/141,920, filed May 1, 2023. [cited by applicant]
U.S. Appl. No. 18/141,923, filed May 1, 2023. [cited by applicant]
U.S. Appl. No. 18/141,926, filed May 1, 2023. [cited by applicant]
U.S. Appl. No. 18/141,931, filed May 1, 2023. [cited by applicant]
International Search Report and Written Opinion in related application PCT/US2023/035709 dated Feb. 5, 2024. [cited by applicant]
Yu et al.; Controller design and implementation of six-degree-of-freedom magnetically levitated positioning system with high precision; Proc. IMechE vol. 222 Part I: J. Systems and Control Engineering; 12 pages. [cited by applicant]
Zhu et al; Design and Control of a Six Degrees-of-Freedom Magnetically Levitated Positioning System; IFAC PapersOnLine 49-21 (2016) pp. 127-132. [cited by applicant]
Temposonics; Sensor Selector Guide; Retrieved from the Internet at: <https://www.temposonics.com/docs/temposonicslibraries/literature/sensor_selector_guide_industrial_551814_en.pdf?sfvrsn=5fde8874_12>; 21 pages. [cited by applicant]
Linear Motion Tips; How do Magnettostrictive sensors work?; Retrieved from the Internet at: <https://www.linearmotiontips.com/how-do-magnetostrictive-sensors-work/> 9 Pages. [cited by applicant]