Multilayer ceramic electronic component with a multilayer external electrode
A multilayer ceramic electronic component includes a ceramic body including a dielectric layer and first and second internal electrodes disposed to be alternately stacked with the dielectric layer interposed therebetween, a first external electrode and a second external electrode connected to the first and the second internal electrode respectively. The first external electrode includes a first base electrode layer disposed in contact with the ceramic body, a first glass layer disposed on the first base electrode layer, and a first resin electrode layer disposed on the first glass layer. The second external electrode includes a second base electrode layer disposed in contact with the ceramic body, a second glass layer disposed on the second base electrode layer, and a second resin electrode layer disposed on the second glass layer.
1. A multilayer ceramic electronic component comprising:
a ceramic body including a dielectric layer and first and second internal electrodes disposed to be alternately stacked with the dielectric layer interposed therebetween;
a first external electrode disposed on a first surface of the ceramic body and connected to the first internal electrode of the ceramic body; and
a second external electrode disposed on a second surface of the ceramic body and connected to the second internal electrode, the second surface being opposite the first surface in a first direction,
wherein the first external electrode includes a first base electrode layer contacting the first internal electrode, having a metal, disposed in contact with the ceramic body, and a first glass layer disposed on the first base electrode layer, and
the second external electrode includes a second base electrode layer contacting the second internal electrode, having a metal, disposed in contact with the ceramic body, and a second glass layer disposed on the second base electrode layer,
wherein each of the first and second base electrode layers have a metal coating layer randomly disposed thereon and within the corresponding first and second glass layers.
2. The multilayer ceramic electronic component of claim 1 ,
wherein the first external electrode further includes a first resin electrode layer disposed on the first glass layer, and
the second external electrode further includes a second resin electrode layer disposed on the second glass layer,
wherein each of the first and second glass layers includes a conductive glass including a glass component and a conductive metal coated on a surface of the glass component,
wherein the first and second resin electrode layers include a conductive filler comprising carbon,
wherein the conductive glass has an electrical conductivity of 1×10 −13 S/cm or more.
3. The multilayer ceramic electronic component of claim 2 , wherein each of the first and second base electrodes includes one or more metal components selected from a group consisting of copper (Cu), nickel (Ni), tin (Sn), palladium (Pd), platinum (Pt), iron (Fe), gold (Au), silver (Ag), tungsten (W), titanium (Ti), lead (Pb), and alloys thereof.
4. The multilayer ceramic electronic component of claim 2 , wherein the first and second glass layers include one or more selected from a group consisting of silicon (Si), boron (B), aluminum (Al), transition metal, alkali metals, alkaline earth metals, and oxide nitrides, carbides and carbonates thereof.
5. The multilayer ceramic electronic component of claim 2 , wherein an average surface roughness Ra of each of the first and second glass layers is 1.0 μm or more.
6. The multilayer ceramic electronic component of claim 2 , wherein the first and second glass layers are disposed to cover the first and second base electrode layers, respectively.
7. The multilayer ceramic electronic component of claim 2 , wherein each of the first and second resin electrode layers includes a conductivity imparting agent and a base resin.
8. The multilayer ceramic electronic component of claim 2 , wherein the first and second resin electrode layers are disposed to cover the first and second glass layers, respectively.
9. The multilayer ceramic electronic component of claim 2 , further comprising first and second plating layers disposed on the first and second resin electrode layers, respectively.
10. The multilayer ceramic electronic component of claim 1 , wherein the first and second base electrode layers are sintered electrodes.
11. The multilayer ceramic electronic component of claim 1 , wherein each of the first and second glass layers includes conductive glass.
12. The multilayer ceramic electronic component of claim 1 , wherein a thickness of each of the first and second glass layers is 1 μm or more and 20 μm or less.
13. The multilayer ceramic electronic component of claim 1 ,
wherein the first and second external electrodes further include first and second resin electrode layers disposed on the first and second glass layers, respectively, and
the metal coating layer comprises a first metal coating layer disposed between the first glass layer and the first resin electrode layer and a second metal coating layer disposed between the second glass layer and the second resin electrode layer.