Gate-all-around integrated circuit structures having insulator fin on insulator substrate
Gate-all-around integrated circuit structures having an insulator fin on an insulator substrate, and methods of fabricating gate-all-around integrated circuit structures having an insulator fin on an insulator substrate, are described. For example, an integrated circuit structure includes an insulator fin on an insulator substrate. A vertical arrangement of horizontal semiconductor nanowires is over the insulator fin. A gate stack surrounds a channel region of the vertical arrangement of horizontal semiconductor nanowires, and the gate stack is overlying the insulator fin. A pair of epitaxial source or drain structures is at first and second ends of the vertical arrangement of horizontal semiconductor nanowires and at first and second ends of the insulator fin.
1. An integrated circuit structure, comprising:
an insulator fin directly on an insulator layer of an insulator substrate;
a semiconductor nanowire over the insulator fin;
a gate stack surrounding a channel region of the semiconductor nanowire, and the gate stack overlying the insulator fin; and
a pair of epitaxial source or drain structures at first and second ends of the semiconductor nanowire and laterally adjacent to and in contact with first and second ends of the insulator fin, the pair of epitaxial source or drain structures having a bottommost surface at a same level as a bottommost surface of the insulator fin.
2. The integrated circuit structure of claim 1 , wherein the insulator fin has a vertical thickness approximately the same as a vertical thickness of the semiconductor nanowire.
3. The integrated circuit structure of claim 1 , wherein the insulator fin has a vertical thickness greater than a vertical thickness of the semiconductor nanowire.
4. The integrated circuit structure of claim 1 , wherein the insulator fin has a vertical thickness less than a vertical thickness of the semiconductor nanowire.
5. The integrated circuit structure of claim 1 , wherein the insulator fin comprises silicon oxide, and the semiconductor nanowire comprises silicon.
6. The integrated circuit structure of claim 1 , wherein the semiconductor nanowire comprises silicon germanium or a group III-V material.
7. The integrated circuit structure of claim 1 , wherein the insulator substrate comprises a layer of silicon oxide, and the insulator fin is on the layer of silicon oxide.
8. The integrated circuit structure of claim 1 , wherein the insulator substrate comprises a layer of silicon nitride, and the insulator fin is on the layer of silicon nitride.
9. The integrated circuit structure of claim 1 , wherein a bottom of the pair of epitaxial source or drain structures is on the insulator substrate.
10. The integrated circuit structure of claim 1 , wherein the insulator substrate comprises a remnant catalyst material beneath the insulator fin.
11. The integrated circuit structure of claim 1 , wherein a bottom of the pair of epitaxial source or drain structures is on the insulator substrate.
12. An integrated circuit structure, comprising:
an insulator fin directly on an insulator layer of an insulator substrate, the insulator fin having a bottommost surface;
a semiconductor nanowire over the insulator fin;
a gate stack surrounding a channel region of the semiconductor nanowire, and the gate stack overlying the insulator fin; and
a pair of epitaxial source or drain structures at first and second ends of the semiconductor nanowire, each of the pair of epitaxial source or drain structures having a bottommost surface at a different level than the bottommost surface of the insulator fin, and each of the pair of epitaxial source or drain structures in contact with a corresponding sidewall of the insulator fin, wherein each of the pair of epitaxial source or drain structures does not vertically overlap with the insulator fin, and wherein the pair of epitaxial source or drain structures has a bottommost surface at a same level as a bottommost surface of the insulator fin.
13. The integrated circuit structure of claim 12 , wherein the insulator fin has a vertical thickness approximately the same as a vertical thickness of the semiconductor nanowire.
14. The integrated circuit structure of claim 12 , wherein the insulator fin has a vertical thickness greater than a vertical thickness of the semiconductor nanowire.
15. The integrated circuit structure of claim 12 , wherein the insulator fin has a vertical thickness less than a vertical thickness of the semiconductor nanowire.
16. The integrated circuit structure of claim 12 , wherein the insulator fin comprises silicon oxide, and the semiconductor nanowire comprises silicon.
17. The integrated circuit structure of claim 12 , wherein the semiconductor nanowire comprises silicon germanium or a group III-V material.
18. The integrated circuit structure of claim 12 , wherein the insulator substrate comprises a layer of silicon oxide, and the insulator fin is on the layer of silicon oxide.
19. The integrated circuit structure of claim 12 , wherein the insulator substrate comprises a layer of silicon nitride, and the insulator fin is on the layer of silicon nitride.
20. The integrated circuit structure of claim 12 , wherein the insulator substrate comprises a remnant catalyst material beneath the insulator fin.