Semiconductor light emitting device including circular ring-shaped metal ring body and regulation holes define bottom of lens, and method for manufacturing same
A semiconductor light emitting device includes a plane substrate having a flat substrate surface, a semiconductor light emitting element mounted on the substrate surface, and a lens formed of a resin which embeds the semiconductor light emitting element and condenses light emitted from the semiconductor light emitting element. A circular ring-shaped metal ring body surrounding the semiconductor light emitting element, and a plurality of regulation holes arranged inside the metal ring body at positions rotationally symmetric with respect to the center of the metal ring body are provided on the substrate surface. A bottom of the lens is defined by the metal ring body and the regulation holes. A body part of the lens has a plurality of valley portions extending toward the top of the lens from the positions of the regulation holes. The top of the lens has a surface as a spheroid surface with an axis vertical to the substrate surface and passing through the center of the metal ring body as a major axis.
1. A semiconductor light emitting device comprising:
a plane substrate having a flat substrate surface;
a semiconductor light emitting element mounted on the substrate surface; and
a lens formed of a resin which embeds the semiconductor light emitting element and condenses light emitted from the semiconductor light emitting element, and
wherein a circular ring-shaped metal ring body is provided on the surface of the substrate and forms a ring-shaped frame surrounding the semiconductor light emitting element such that the semiconductor light emitting element is arranged inside the ring-shaped metal ring body, and
wherein a plurality of regulation holes which are recessed portions of the substrate are provided on the substrate surface and are arranged on the substrate surface inside the metal ring body at positions rotationally symmetric with respect to a center of the metal ring body,
wherein a bottom of the lens is defined by the metal ring body and the regulation holes,
wherein a body part of the lens has a plurality of valley portions which are recessed portions from a surface of the lens and extend toward the top of the lens from the positions of the regulation holes, and
wherein the top of the lens has a surface of a spheroid with an axis vertical to the substrate surface and passing through the center of the metal ring body as a major axis.
2. The semiconductor light emitting device according to claim 1 , wherein the metal ring body has a circular ring-shaped body part, and a plurality of protrusion parts connected to the body part so as to protrude from the body part to the outside at positions rotationally symmetric with respect to the center of the body part, and
wherein the regulation holes are provided inside the protrusion parts.
3. The semiconductor light emitting device according to claim 1 , wherein the regulation holes have a cylindrical shape.
4. The semiconductor light emitting device according to claim 2 , wherein the regulation holes have a cylindrical shape.
5. The semiconductor light emitting device according to claim 1 , wherein the valley portions are reduced in depth and width toward a leading end the top of the lens from the surface of the lens.
6. The semiconductor light emitting device according to claim 2 , wherein the valley portions are reduced in depth and width toward a leading end the top of the lens from the surface of the lens.
7. A semiconductor light emitting device comprising:
a plane substrate having a flat substrate surface;
a semiconductor light emitting element mounted on the substrate surface; and
a lens formed of a resin which embeds the semiconductor light emitting element and condenses light emitted from the semiconductor light emitting element,
wherein a circular ring-shaped metal ring body surrounding the semiconductor light emitting element and a plurality of regulation holes arranged inside the metal ring body at positions rotationally symmetric with respect to the center of the metal ring body are provided on the substrate surface,
wherein a bottom of the lens is defined by the metal ring body and the regulation holes,
wherein a body part of the lens has a plurality of valley portions extending toward the top of the lens from the positions of the regulation holes,
wherein the top of the lens has a surface of a spheroid with an axis vertical to the substrate surface and passing through the center of the metal ring body as a major axis, and
wherein the plane substrate is a low-temperature fired laminated ceramic substrate.
8. The semiconductor light emitting device according to claim 1 , wherein the lens is a silicone resin containing nanosilica.
9. A method for manufacturing a semiconductor light emitting device comprising: a plane substrate having a flat substrate surface; a semiconductor light emitting element mounted on the substrate surface; and a lens formed of a resin which embeds the semiconductor light emitting element and condenses light emitted from the semiconductor light emitting element, wherein a circular ring-shaped metal ring body surrounding the semiconductor light emitting element and a plurality of regulation holes arranged inside the metal ring body at positions rotationally symmetric with respect to the center of the metal ring body are provided on the substrate surface, wherein a bottom of the lens is defined by the metal ring body and the regulation holes, wherein a body part of the lens has a plurality of valley portions extending toward the top of the lens from the positions of the regulation holes, wherein the top of the lens has a surface of a spheroid with an axis vertical to the substrate surface and passing through the center of the metal ring body as a major axis, the method comprising:
(a) providing, on the substrate surface, the circular ring-shaped metal ring body which surrounds the semiconductor light emitting element, and the plurality of regulation holes arranged inside the metal ring body at positions rotationally symmetric with respect to the center of the metal ring body;
(b) potting a lens resin inside the metal ring body from above the metal ring body; and
(c) curing the lens resin subjected to the potting.
10. The method for manufacturing the semiconductor light emitting device according to claim 9 , wherein the lens resin is comprised of one kind of resin.
11. The semiconductor light emitting device according to claim 1 , wherein an inner edge portion of the metal ring body and the body part of the lens are in contact with each other.
12. The semiconductor light emitting device according to claim 11 , wherein the body part of the lens is in contact with the inner edge portion of the metal ring body at a contact portion in which the body part of the lens swells so as to cover the metal ring body and forms an acute angle θ 1 (0<θ 1 <90°) with respect to the surface of the plane substrate.
13. The semiconductor light emitting device according to claim 1 , wherein an inner edge portion of each of the regulation holes and the body part of the lens are in contact with each other.
14. The semiconductor light emitting device according to claim 13 , wherein the body part of the lens is in contact with the inner edge portion of each of the regulation holes at a contact portion in which the body part of the lens swells and forms an acute angle θ 2 (0<θ 2 <90° with respect to the surface of the plane substrate.
15. The semiconductor light emitting device according to claim 2 ,
wherein each of the protrusion parts has a semi-circular shape, and
wherein each of the regulation holes has a diameter smaller than an inner edge portion of each of the protrusion parts.
16. The semiconductor light emitting device according to claim 1 , wherein the regulation holes are provided away from the metal ring body.