Package with underfill containment barrier
An apparatus is provided which comprises: a substrate, a die site on the substrate to couple with a die, a die side component site on the substrate to couple with a die side component, and a raised barrier on the substrate between the die and die side component sites to contain underfill material disposed at the die site, wherein the raised barrier comprises electroplated metal. Other embodiments are also disclosed and claimed.
1. An apparatus comprising:
a substrate;
a first die and a second die over a surface of the substrate, the second die laterally spaced apart from the first die;
an interconnect bridge coupled to the substrate, the interconnect bridge beneath the first die and the second die, the interconnect bridge partially within a footprint of the first die and partially within a footprint of the second die, and the interconnect bridge coupled to the first die and the second die;
a metal structure on the surface of the substrate, the metal structure extending away from the surface of the substrate, and the metal structure laterally surrounding the first die and the second die; and
a dielectric material laterally between the metal structure and the first die or the second die, wherein the dielectric material does not extend beyond the metal structure.
2. The apparatus of claim 1 , wherein the interconnect bridge is in the substrate.
3. The apparatus of claim 1 , wherein the metal structure includes at least one anchor extending into the surface of the substrate.
4. The apparatus of claim 3 , wherein a continuous portion of the metal structure on the surface of the substrate is coupled to two or more anchors extending into the surface of the substrate.
5. The apparatus of claim 1 , wherein the metal structure comprises discontinuous segments.
6. The apparatus of claim 5 , wherein the discontinuous segments form a rectangle.
7. The apparatus of claim 1 , wherein the metal structure is continuous around the first die and the second die.
8. The apparatus of claim 1 , wherein the interconnect bridge communicatively couples the first die and the second die.
9. The apparatus of claim 1 , further comprising:
a die side component on the surface of the substrate, the die side component outside of the metal structure.
10. The apparatus of claim 1 , wherein the dielectric material is in contact with both the first die and the second die.
11. The apparatus of claim 10 , wherein the dielectric material is laterally between the first die and the second die.
12. A system, comprising:
a display subsystem;
a wireless communication interface; and
an integrated circuit package, the integrated circuit package comprising:
a substrate;
a first die and a second die over a surface of the substrate, the second die laterally spaced apart from the first die;
an interconnect bridge coupled to the substrate, the interconnect bridge beneath the first die and the second die, the interconnect bridge partially within a footprint of the first die and partially within a footprint of the second die, and the interconnect bridge coupled to the first die and the second die;
a metal structure on the surface of the substrate, the metal structure extending away from the surface of the substrate, and the metal structure laterally surrounding the first die and the second die; and
a dielectric material laterally between the metal structure and the first die or the second die, wherein the dielectric material does not extend beyond the metal structure.
13. The apparatus of claim 12 , wherein the interconnect bridge is in the substrate.
14. The system of claim 12 , wherein the metal structure includes at least one anchor extending into the surface of the substrate.
15. The system of claim 14 , wherein a continuous portion of the metal structure on the surface of the substrate is coupled to two or more anchors extending into the surface of the substrate.
16. The system of claim 12 , wherein the metal structure comprises discontinuous segments.
17. The system of claim 16 , wherein the discontinuous segments form a rectangle.
18. The system of claim 12 , wherein the metal structure is continuous around the first die and the second die.
19. The system of claim 12 , wherein the interconnect bridge communicatively couples the first die and the second die.
20. The apparatus of claim 12 , further comprising:
a die side component on the surface of the substrate, the die side component outside of the metal structure.