IP Library › Granted Patent US 12,332,717
Granted Patent B2
US 12,332,717 · App. 18/210,601 · Granted Jun 17, 2025

Server farm with at least one hybrid computing module operating at clock speed optimally matching intrinsic clock speed of a related semiconductor die related thereto

Inventor: L. Pierre de Rochemont (Austin, TX)
G06F1/324G05B9/02
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Quick Facts
Patent No.
US 12,332,717
App. No.
18/210,601
Granted
Jun 17, 2025
Kind
B2
Abstract

A server farm with at least one hybrid computing module operating at clock speed optimally matching intrinsic clock speed of a related semiconductor die related thereto.

Claims (26)

1. A server farm comprising:

a plurality of servers, a power management system that delivers electrical power to the server farm and requires three or fewer high efficiency stages between a power and/or primary power source and any intrinsic AC or DC power bus in the server farm that consumes electric power,

each one of the plurality of servers comprising:

a semiconductor die embedded in a high-speed semiconductor chip stack or a semiconductor carrier,

at least one hybrid computing module operating at a system clock speed that optimally matches an intrinsic clock speed of the semiconductor die embedded within the high-speed semiconductor chip stack or mounted upon the semiconductor carrier; and

one or more high-speed semiconductor chip stacks bonded to a surface of semiconductor carrier in which at least one passive component element maintains critical performance tolerances and has a polarization response time determined solely by orbital deformations and operates in phase, thus does not distort, any of an applied signal components forming a high-speed digital pulse operating at clock speeds that run into a terahertz (THz) frequency domain;

wherein the servers of the server farm are mounted within a plurality of slots in a server rack, further comprising a first harness that forms a communications bus interface, preferably an optical interface, with other servers mounted within the server rack; and

wherein the server racks are assembled to form a server tower comprising a plurality of server racks and a second harness that forms a communications bus interface, preferably an optical interface, with other servers mounted within the server tower.

2. The server farm of claim 1 , wherein a plurality of towers are used to form at least one row of server towers or a plurality of rows of server towers and a third harness that forms a communications bus interface, preferably an optical interface, with other server towers distributed within a row of server towers or between rows of server towers.

3. The server farm of claim 1 comprising a server, wherein the server or servers comprise:

the hybrid computing module within the server or plurality of servers comprises a power management device that further comprises a resonant gate transistor;

wherein the hybrid computing module configured for Minimal Instruction Set Computing by means of a chip that comprises a FORTH engine mounted on the semiconductor carrier or embedded within the high-speed semiconductor chip stack; and

wherein the servers are mounted within a plurality of slots in the server rack, further comprising the first harness that forms a communications bus interface, preferably an optical interface, with other servers mounted within the server rack.

4. The server farm of claim 3 , wherein the server racks are assembled to form the server tower comprising the plurality of server racks and the second harness forms a communications bus interface, preferably an optical interface, with other servers mounted within the server tower.

5. The server farm of claim 1 , wherein the hybrid computing module configured for Minimal Instruction Set Computing by means of a chip that comprises a FORTH engine mounted on the semiconductor carrier or embedded within the high-speed semiconductor chip stack;

wherein the hybrid computing module configured for Minimal Instruction Set Computing utilizes a computing language other than FORTH, but the processor chip that enables the engine to adopt a Stack Machine Architecture has features similar to a FORTH engine including:

the ability to access multiple memory spaces simultaneously in a single microprocessor clock cycle; and,

that utilizes a minimal number of instruction sets through the use of separate buses to access memory holding a data stack, a return stack, and a program memory, among other useful program utilities.

6. The server farm of claim 5 , wherein, the hybrid computing module within the server or plurality of servers comprises a power management device that further comprises a resonant gate transistor;

wherein the hybrid computing module configured for Minimal Instruction Set Computing by means of a chip that comprises FORTH engine mounted on the semiconductor carrier or embedded within the high-speed semiconductor chip stack; and

wherein the server farm has no need for cache memory or predictive algorithms.

7. The server farm of claim 6 that processes a function using the most efficient algorithm type (iterative, recursive, or deeply nested loop) for that specific function.

8. The server farm of claim 5 wherein the hybrid computing module does not comprise a predictive algorithm to manage the sequence of data or instructions sets flowing into a processor chip.

9. The server farm of claim 5 , wherein the servers are mounted within the plurality of slots in the server rack, further comprising the first harness that forms a communications bus interface, preferably an optical interface, with other servers mounted within the server rack.

10. The server farm of claim 9 , wherein the server racks are assembled to form the server tower comprising the plurality of server racks and the second harness forms a communications bus interface, preferably an optical interface, with other servers mounted within the server tower.

11. The server farm of claim 1 , wherein the server does not comprise a printed circuit board.

Continuity (3)
Division 16403411 · May 3, 2019
Provisional Application 62666124 · May 3, 2018
Related Publication 20230367384A1 · Nov 16, 2023
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