IP Library Granted Patent US 12,340,165
Granted Patent B2
US 12,340,165 · App. 18/741,003 · Granted Jun 24, 2025

Semiconductor device having power rail with non-linear edge

Inventors: Jung-Chan Yang (Hsinchu, TW); Hui-Zhong Zhuang (Hsinchu, TW); Ting-Wei Chiang (Hsinchu, TW); Chi-Yu Lu (Hsinchu, TW)
Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
G06F30/398G03F1/36G03F1/70G06F30/30G06F30/392G06F30/394G06F30/3953G06F2119/18
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Quick Facts
Patent No.
US 12,340,165
App. No.
18/741,003
Granted
Jun 24, 2025
Kind
B2
Abstract

A semiconductor device includes a plurality of active regions extending in a first direction. The semiconductor device further includes a gate electrode over the plurality of active regions, wherein the gate electrode extends in a second direction perpendicular to the first direction. The semiconductor device further includes a power rail extending in the first direction. The power rail includes a first power rail portion adjacent to the first boundary, wherein the first power rail portion has a first inner edge, and a second power rail portion adjacent to the second boundary, wherein the second power rail portion has a second inner edge, and the first inner edge is offset from the second inner edge in the second direction.

Claims (40)

1. A semiconductor device, comprising:

a plurality of active regions extending in a first direction;

a gate electrode over the plurality of active regions, wherein the gate electrode extends in a second direction perpendicular to the first direction;

a power rail extending in the first direction, wherein the power rail comprises:

a first power rail portion adjacent to the first boundary, wherein the first power rail portion has a first inner edge, and

a second power rail portion adjacent to the second boundary, wherein the second power rail portion has a second inner edge, and the first inner edge is offset from the second inner edge in the second direction.

2. The semiconductor device of claim 1 , wherein a maximum width, in the second direction, of the first power rail portion is equal to a maximum width, in the second direction, of the second power rail portion.

3. The semiconductor device of claim 1 , wherein a maximum width, in the second direction, of the first power rail portion is greater than a maximum width, in the second direction, of the second power rail portion.

4. The semiconductor device of claim 1 , wherein the first power rail portion has a first outer edge, and the second power rail portion has a second outer edge aligned with the first outer edge.

5. The semiconductor device of claim 1 , wherein the first power rail portion has a first outer edge, and the second power rail portion has a second outer edge offset from the first outer edge in the second direction.

6. The semiconductor device of claim 1 , wherein each of the plurality of active regions comprises a fin.

7. The semiconductor device of claim 1 , further comprising:

a first contact line between the gate electrode and a first boundary of a cell;

a second contact line between the gate electrode and a second boundary of the cell, wherein the first contact line and the second contact line extend over at least one of the plurality of active regions.

8. A semiconductor device, comprising:

a plurality of active regions extending in a first direction;

a gate electrode over the plurality of active regions, wherein the gate electrode extends in a second direction perpendicular to the first direction;

a power rail extending in the first direction, wherein the power rail comprises:

a first power rail portion adjacent to the first boundary, wherein the first power rail portion has a first outer edge, and

a second power rail portion adjacent to the second boundary, wherein the second power rail portion has a second outer edge, and the first outer edge is offset from the second outer edge in the second direction.

9. The semiconductor device of claim 8 , further comprising a conductive line extending in the first direction, wherein the conductive line is over the gate electrode.

10. The semiconductor device of claim 9 , wherein the first outer edge is closer to the conductive line than the second outer edge.

11. The semiconductor device of claim 8 , wherein a width of the first power rail portion adjacent to the first boundary is equal to a width of the second power rail portion adjacent to the second boundary.

12. The semiconductor device of claim 8 , further comprising a second power rail on an opposite side of the semiconductor device from the power rail.

13. The semiconductor device of claim 12 , wherein the second power rail comprises:

a third power rail portion adjacent to the first boundary, wherein the third power rail portion has a third outer edge, and

a fourth power rail portion adjacent to the second boundary, wherein the fourth power rail portion has a fourth outer edge, and the third outer edge is offset from the fourth outer edge in the second direction.

14. The semiconductor device of claim 8 , wherein a width of the power rail at a junction of the first power rail portion and the second power rail portion is less than a width of the first power rail portion adjacent to the first boundary.

15. A semiconductor device, comprising:

a plurality of active regions extending in a first direction;

a gate electrode over the plurality of active regions, wherein the gate electrode extends in a second direction perpendicular to the first direction;

a first power rail extending in the first direction, wherein the first power rail comprises:

a first power rail portion adjacent to the first boundary, wherein the first power rail portion has a first width,

a second power rail portion adjacent to the second boundary, wherein the second power rail portion has the first width, and

the first power rail has a second width at an intersection of the first power rail portion and the second power rail portion.

16. The semiconductor device of claim 15 , further comprising a second power rail on an opposite side of the semiconductor device from the first power rail.

17. The semiconductor device of claim 16 , wherein the second power rail comprises a third power rail portion adjacent to the first boundary, and the third power rail portion has the first width.

18. The semiconductor device of claim 15 , further comprising a conductive line extending in the first direction.

19. The semiconductor device of claim 18 , wherein the first power rail portion has a first inner edge, the second power rail portion has a second inner edge, and the first inner edge is closer to the conductive line than the second inner edge.

20. The semiconductor device of claim 18 , wherein the first power rail portion has a first outer edge, the second power rail portion has a second outer edge, and the first outer edge is farther from the conductive line than the second outer edge.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 20, 2024
From: YANG, JUNG-CHAN; CHIANG, TING-WEI; ZHUANG, HUI-ZHONG; LU, CHI-YU
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 067784/0821 →
Continuity (4)
Division 17383153 · Jul 22, 2021
Division 16659305 · Oct 21, 2019
Provisional Application 62753234 · Oct 31, 2018
Related Publication 20240330564A1 · Oct 3, 2024
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