Wafer alignment apparatus and method for multi-cassette load port
A method of a handling semiconductor wafers in a space of a semiconductor wafer processing facility includes: loading a cassette containing at least one semiconductor wafer into a storage buffer of a load port; measuring, from within the storage buffer, a position of a selected at least one semiconductor wafer being retrieve from the cassette residing in the storage buffer; and determining, at least in part based on said measuring, a variation of the position of the selected semiconductor wafer from a nominal position.
1. A method of a handling semiconductor wafers in a space of a semiconductor wafer processing facility, said method comprising:
loading a cassette containing at least one semiconductor wafer into a storage buffer of a load port;
measuring, from within the storage buffer using an optical sensor disposed in the storage buffer, a position of a selected at least one semiconductor wafer being retrieved from the cassette residing in the storage buffer;
determining, at least in part based on said measuring, a variation of the position of the selected semiconductor wafer from a nominal position; and
communicating the determined variation to an equipment front end module coupled to the load port, such that the equipment front end module controls its handling of the selected semiconductor wafer, at least in part, based on the determined variation.
2. The method of claim 1 , wherein said variation comprises variation of the position of the selected semiconductor wafer from the nominal position in at least three dimensions.
3. The method of claim 1 , wherein said determining comprises at least one of:
determining a warpage of the selected semiconductor wafer in a first direction; and
determining a lateral shift of the selected semiconductor wafer in a second direction within a plane normal to the first direction.
4. The method of claim 1 , further comprising:
converting the determined variation to wafer location off-set data that is communicated to an equipment front end module, such that the equipment front end module controls its handling of the selected semiconductor wafer, at least in part, based on the wafer location off-set data.
5. The method of claim 4 , wherein the location off-set data represents, in a coordinate system recognized by the equipment front end module, the determined variation.
6. The method of claim 1 , wherein said measuring is performed by a machine vision sensor housed within the storage buffer of the load port.
7. The method of claim 6 , wherein the machine vision sensor comprises at least one of an area camera, a pair of stereo cameras, a line scanner and a laser displacement sensor.
8. The method of claim 6 , wherein the machine vision sensor is aimed normal to a travel path followed by the selected semiconductor wafer as it is being retrieve from the cassette.
9. The method of claim 6 , wherein the machine vision sensor is aimed in a range of plus or minus 30 degrees to normal of a travel path followed by the selected semiconductor wafer as it is being retrieved from the cassette.
10. The method of claim 6 , wherein the machine vision sensor has a field-of-view interposed between the cassette loaded into the storage buffer of the load port and a robot of an equipment front end module coupled to the load port for transferring the selected semiconductor wafer to a chamber of a tool in which the selected semiconductor wafer is to be processed.
11. A method of compensating for a semiconductor wafer varying in position from an otherwise expected nominal location, said method comprising:
holding at least one cassette in a storage buffer, said at least one cassette carrying at least one semiconductor wafer therein;
detecting, from within the storage buffer, a position of a selected at least one semiconductor wafer being retrieved from the at least one cassette held in the storage buffer; and
determining, at least in part based on said detected position, a variation of the selected semiconductor wafer from the nominal location,
wherein said determining comprises determining a first variation of the selected semiconductor wafer in a first direction; and determining a second variation of the selected semiconductor wafer in a second direction within a plane normal to the first direction.
12. The method of claim 11 , further comprising:
determining a wafer location off-set data based, at least in part, on the first and second variations.
13. The method of claim 12 , further comprising:
sending the wafer location off-set data to an equipment front end module, such that the equipment front end module controls a robot's handling of the selected semiconductor wafer subsequent to the equipment front end module receiving said wafer location off-set data, at least in part, based on the received wafer location off-set data.
14. The method of claim 13 , wherein said detecting is performed by an optical sensor having a field-of-view interposed between the at least one cassette held in the storage buffer and the robot.
15. The method of claim 14 , wherein the optical sensor is housed within the storage buffer.
16. A load port for staging semiconductor wafers, said load port comprising:
a storage buffer that holds at least one cassette, the at least one cassette carrying at least one semiconductor wafer therein; and
a sensor that detects a position of a selected at least one semiconductor wafer being retrieved by a robot from the at least one cassette, said sensor being contained in the storage buffer;
wherein a variation in a position of the selected semiconductor wafer from a nominal position is determined by the load port, at least in part, based on the position detected by said sensor,
wherein the at least one cassette includes a plurality of cassettes;
wherein the storage buffer includes a plurality of buffering spaces, each buffering space accommodating one of the plurality of cassettes; and
wherein the storage buffer is configured to selectively move the plurality of buffering spaces in order to align a selected one of the plurality of buffering spaces with a gateway through which cassettes are selectively loaded into the storage buffer.
17. The load port of claim 16 , wherein the position detected by the sensor is a three-dimensional position.
18. The load port of claim 16 , wherein the determined variation is communicated to an equipment front end module coupled to the load port, such that the equipment front end module controls its handling of the selected semiconductor wafer, at least in part, based on the determined variation.
19. The load port of claim 16 , wherein the determined variation is determined by at least one of:
determining a warpage of the selected semiconductor wafer in a first direction; and
determining a lateral shift of the selected semiconductor wafer in a second direction within a plane normal to the first direction.
20. The load port of claim 16 , wherein the determined variation is converted to wafer location off-set data that is communicated to an equipment front end module, such that the equipment front end module controls its handling of the selected semiconductor wafer, at least in part, based on the wafer location off-set data.