Substrate processing apparatus
An embodiment of the present invention provides a buff process module. The buff process module includes: a buff table on which a processing target object is mounted; a buff head that holds a buff pad for applying a predetermined process to the processing target object; a buff arm that supports and swings the buff head; a dresser for dressing the buff pad; and a cleaning mechanism that is disposed between the buff table and the dresser and is for cleaning the buff pad.
1. An apparatus for buff-processing a processing target object, comprising:
a buff table that includes a support surface for supporting the processing target object;
a nozzle for supplying the support surface with a chemical solution for cleaning the support surface of the buff table; and
a buff head to which a buff pad for buff-processing the processing target object through physical contact is attached, wherein a cleaning member including a brush or a sponge member for cleaning the support surface of the buff table through physical contact is attached to the buff head, wherein the buff pad attached to the buff head and the cleaning member attached to the buff head are configured to independently ascend and descend relative to each other, and wherein the cleaning member protrudes with respect to the buff pad when cleaning the support surface of the buff table;
wherein the buff table includes a fluid passage that extends to the support surface and is for supplying a fluid to the support surface through the buff table while the support surface of the buff table is cleaned,
wherein the fluid passage is connected to a pure water and/or chemical solution supply source, and
wherein the fluid passage is configured to be communicable with a vacuum source for causing the processing target object to be vacuum-sucked onto the support surface while the processing target object is buff-processed.
2. The apparatus for buff-processing according to claim 1 , wherein the buff table includes a stage film, and a surface of the stage film serves as the support surface for supporting the processing target object.
3. The apparatus for buff-processing according to claim 1 , wherein the nozzle is configured such that a direction of the nozzle can be changed in a plane of the buff table.
4. The apparatus for buff-processing according to claim 1 , wherein the nozzle is configured such that a direction of the nozzle can be changed in a plane perpendicular to a plane of the buff table.
5. The apparatus for buff-processing according to claim 1 , wherein the nozzle is configured such that a position of the nozzle can be changed in a direction perpendicular to a plane of the buff table.
6. The apparatus for buff-processing according to claim 1 , further including a fluid passage for supplying a fluid to the support surface through the buff head and the buff pad.
7. The apparatus for buff-processing according to claim 1 , further including a roll sponge member configured to clean the support surface of the buff table through physical contact by rotating on the buff table.
8. The apparatus for buff-processing according to claim 1 , further including at least one of an atomizer cleaner, an ultrasonic cleaner, and a cavitation jet cleaner for cleaning the support surface of the buff table.
9. The apparatus for buff-processing according to claim 1 , wherein the buff table includes a conveyor mechanism for conveying the processing target object to and/or from the buff table, and the apparatus is configured such that the conveyor mechanism is cleaned while the support surface is cleaned.