Granted Patent B2

US 12,354,891 · App. 18/423,199 · Granted Jul 8, 2025

Inventors: Jeroen Gerard Gosen (Westport, CT); Te-Yu Chen (San Jose, CA); Dennis Herman Caspar Van Banning (Best, NL); Edwin Cornelis Kadijk (Eindhoven, NL); Martijn Petrus Christianus Van Heumen (Santa Clara, CA); Erheng Wang (San Jose, CA); Johannes Andreas Henricus Maria Jacobs (Veldhoven, NL)

Assignee: ASML Netherlands B.V.

H01L21/67201G03F7/70841G03F7/70858H01L21/67098

Abstract

Claims (35)

1. A load lock system, comprising:

a supporting structure configured to support a wafer;

a first sensor configured to measure a temperature of the wafer on the supporting structure; and

a controller including a processor and a memory, the controller configured to assist with thermal conditioning of the wafer before the wafer is transferred from the load lock system to a main chamber for inspection,

wherein the controller is further configured to assist with thermal conditioning of the wafer based on a temperature of a wafer stage in the main chamber.

2. The load lock system of claim 1 , wherein the controller is further configured to set a target temperature of the wafer for thermal conditioning based on the temperature of the wafer stage in the main chamber.

3. The load lock system of claim 2 , wherein the controller is further configured to finish the thermal conditioning of the wafer when the temperature of the wafer measured by the first sensor reaches the target temperature.

4. The load lock system of claim 2 , wherein the target temperature is a stable temperature relative to the temperature of the wafer stage.

5. The load lock system of claim 1 , wherein the controller is further configured to receive temperature information of the wafer stage in the main chamber.

6. The load lock system of claim 5 , wherein the temperature information is acquired from a second sensor configured to measure the temperature of the wafer stage.

7. The load lock system of claim 1 , wherein the controller is further configured to monitor the temperature of the wafer using the first sensor before the wafer is transferred from the load lock system to the main chamber.

8. The load lock system of claim 1 , wherein when transferred to the main chamber, a temperature of the conditioned wafer is a stable temperature relative to a temperature of the wafer stage in the main chamber.

9. The load lock system of claim 1 , further comprising: a gas vent configured to provide a gas having a conditioned temperature to adjust the temperature of the wafer,

wherein the controller configured to assist with control of the gas to condition the wafer before the wafer is transferred from the load lock system to the main chamber.

10. The load lock system of claim 9 , wherein the gas is thermally preconditioned to have the conditioned temperature before being provided via the gas vent.

11. A method for thermally conditioning a wafer before the wafer is transferred to a main chamber for inspection, comprising:

placing the wafer on a supporting structure in a load lock system;

setting a target temperature of the wafer on the supporting structure;

monitoring a temperature of the wafer on the supporting structure using a first sensor that is configured to measure the temperature of the wafer; and

thermally conditioning the wafer on the supporting structure before the wafer is transferred from the load lock system to the main chamber for inspection,

wherein the target temperature is determined based on a temperature of a wafer stage in the main chamber.

12. The load lock system of claim 11 , further comprising:

finishing the thermal conditioning of the wafer when the temperature of the wafer measured by the first sensor reaches the target temperature.

13. The method of claim 11 , further comprising:

transferring the conditioned wafer from the load lock system onto the wafer stage in the main chamber.

14. The method of claim 11 , wherein the target temperature is a stable temperature relative to the temperature of the wafer stage.

15. The method of claim 11 , further comprising:

receiving temperature information of the wafer stage in the main chamber.

16. The method of claim 15 , wherein the temperature information is acquired from a second sensor configured to measure a temperature of the wafer stage.

17. The method of claim 11 , wherein monitoring the temperature of the wafer on the supporting structure using the first sensor comprises:

monitoring the temperature of the wafer using the first sensor before the wafer is transferred from the load lock system to the main chamber.

18. The method of claim 13 , wherein when transferred to the main chamber, a temperature of the conditioned wafer is a stable temperature relative to a temperature of the wafer stage in the main chamber.

19. The method of claim 11 , wherein thermally conditioning the wafer comprises:

providing a gas having a conditioned temperature to adjust the temperature of the wafer.

20. The method of claim 19 , wherein the gas is thermally preconditioned to have the conditioned temperature before being provided via the gas vent.

Assignments (1)

Continuity (5)

References Cited (45)