Semiconductor device
A semiconductor package including a semiconductor chip, a redistribution layer structure disposed under the semiconductor chip, a bump pad disposed under the redistribution layer structure and having an upper structure of a first width and a lower structure of a second width less than the first width, a metal seed layer disposed along a lower surface of the upper structure and a side surface of the lower structure, an insulating layer surrounding the redistribution layer structure and the bump pad, and a bump structure disposed under the bump pad. A first undercut is disposed at one end of the metal seed layer that contacts the upper structure, and a second undercut is disposed at an other end of the metal seed layer that contacts the lower.
1. A method of manufacturing a semiconductor package, the method comprising:
forming an adhesive layer and a lower protective layer on a support substrate;
forming a preliminary seed layer on an upper surface of the adhesive layer and a front surface of the lower protective layer;
forming a bump pad on the preliminary seed layer;
forming a metal seed layer by performing first wet etching on the preliminary seed layer;
forming a redistribution layer structure on the bump pad;
forming an insulating layer surrounding the redistribution layer structure and the bump pad;
mounting a semiconductor chip on the redistribution layer structure and forming a molding member surrounding the semiconductor chip;
attaching a carrier substrate and removing the support substrate;
removing the adhesive layer by performing second wet etching; and
forming a bump structure on the bump pad and removing the carrier substrate,
wherein the bump pad has an upper structure of a first width and a lower structure of a second width less than the first width,
wherein undercuts are respectively formed at one end of the metal seed layer contacting the upper structure and at an other end of the metal seed layer contacting the lower structure.
2. The method of claim 1 , wherein the forming of the redistribution layer structure comprises:
forming a plurality of redistribution layer lines; and
forming a plurality of vias connected to the plurality of redistribution layer lines,
wherein the plurality of vias have a tapered shape that narrows away from the semiconductor chip.
3. The method of claim 1 , wherein the performing of the first wet etching comprises forming a first undercut in a horizontal direction on the metal seed layer disposed between the bump pad and the lower protective layer.
4. The method of claim 3 , wherein the forming of the insulating layer comprises filling the first undercut with the insulating layer.
5. The method of claim 3 , wherein the performing of the second wet etching comprises forming a second undercut in a vertical direction on the metal seed layer disposed between the bump pad and the lower protective layer.
6. The method of claim 5 , wherein,
in the forming of the bump structure on the bump pad,
the second undercut is filled with the bump structure.
7. The method of claim 5 , wherein,
in the forming of the bump structure on the bump pad,
the second undercut is not filled with the bump structure.
8. The method of claim 5 , wherein the first undercut is formed at the one end of the metal seed layer, the second undercut is formed at the other end of the metal seed layer, and the first undercut and the second undercut are orthogonal to each other.
9. The method of claim 1 , wherein a level of a lower surface of the lower structure and a level of a lowest surface of the insulating layer are substantially the same,
wherein the bump structure is in contact with a side surface and the lower surface of the lower structure, and
the bump structure is in contact with a side surface of the insulating layer and is not in contact with the lower surface of the insulating layer.
10. The method of claim 1 , wherein an upper surface of the upper structure is upwardly convex or downwardly concave.
11. A method of manufacturing a semiconductor package, the method comprising:
forming a first sub-package;
forming a second sub-package; and
mounting the second sub-package on the first sub-package by using an inter-package connection structure,
wherein each of the forming of the first sub-package and the forming of the second sub-package comprises:
forming an adhesive layer and a lower protective layer on a support substrate;
forming a preliminary seed layer on an upper surface of the adhesive layer and a front surface of the lower protective layer;
forming a bump pad on the preliminary seed layer;
forming a metal seed layer by performing first wet etching on the preliminary seed layer;
forming a redistribution layer structure on the bump pad;
forming an insulating layer surrounding the redistribution layer structure and the bump pad;
mounting a semiconductor chip on the redistribution layer structure and forming a molding member surrounding the semiconductor chip;
attaching a carrier substrate and removing the support substrate;
removing the adhesive layer by performing second wet etching; and
forming a bump structure on the bump pad and removing the carrier substrate,
wherein the bump pad comprises an upper structure of a first width and a lower structure of a second width less than the first width,
wherein undercuts are respectively formed at one end of the metal seed layer contacting the upper structure and at an other end of the metal seed layer contacting the lower structure.
12. The method of claim 11 , wherein the forming of the first sub-package further comprises forming a frame structure disposed around a side surface of the semiconductor chip,
wherein the frame structure of the first sub-package and the redistribution layer structure of the first sub-package are electrically connected to each other through a through electrode inside the frame structure.
13. The method of claim 12 , wherein,
in the forming of the inter-package connection structure,
the inter-package connection structure is configured to electrically connect the frame structure of the first sub-package to the redistribution layer structure of the second sub-package.
14. The method of claim 12 , wherein,
in the forming of the frame structure,
the through electrode penetrating the frame structure comprises a plurality of wiring layers as a multi-stage structure.
15. The method of claim 11 , wherein the performing of the first wet etching comprises forming a first undercut in a horizontal direction on the metal seed layer disposed between the bump pad and the lower protective layer.
16. The method of claim 15 , wherein the performing of the second wet etching comprises forming a second undercut in a vertical direction on the metal seed layer disposed between the bump pad and the lower protective layer.
17. The method of claim 16 , wherein
a length of the first undercut from a side surface of the upper structure is about 2 μm or less, and
a length of the second undercut from a lower surface of the lower structure is about 3 μm or less.
18. The method of claim 16 , wherein
the forming of the insulating layer comprises forming the insulating layer to fill the first undercut, and
the forming of the bump structure on the bump pad comprises forming the bump structure to fill the second undercut.
19. The method of claim 16 , wherein the first undercut is formed at the one end of the metal seed layer, the second undercut is formed at the other end of the metal seed layer, and the first undercut and the second undercut are orthogonal to each other.
20. The method of claim 11 , wherein a level of a lower surface of the lower structure and a level of a lowest layer of the insulating layer are substantially the same,
wherein the bump structure is in contact with a side surface and the lower surface of the lower structure, and
the bump structure is in contact with a side surface of the insulating layer and is not in contact with the lower surface of the insulating layer.