Electronic component module
A module includes a substrate, a component mounted on a top surface that is one principal surface of the substrate, a first shielding film provided on a top surface and a side surface of the component, a sealing resin provided on the top surface of the substrate and seals the component, and a second shielding film provided on a top surface of the sealing resin. A hole is provided on a top surface of the sealing resin, to reach at least a part of the first shielding film. The second shielding film disposed in the hole is brought into contact with the first shielding film at positions facing a top surface and a side surface of the component.
1. A module comprising:
a substrate;
a component mounted on a top surface being one principal surface of the substrate;
a first shielding film provided on a top surface and a side surface of the component;
a sealing resin provided on the top surface of the substrate and sealing the component; and
a second shielding film provided on a top surface of the sealing resin, wherein
a hole is provided on the top surface of the sealing resin to reach at least a part of the first shielding film,
the second shielding film disposed in the hole is brought into contact with the first shielding film at positions facing the top surface and the side surface of the component,
a recess is provided on the top surface of the sealing resin in a manner recessed toward the top surface of the substrate,
a depth of the hole is greater than a depth of the recess, and
each of the hole and the recess delineates an identifier including at least one of a character, a number, a symbol, a dot-shaped recognition code, a barcode, a two-dimensional code, a logo, and a graphic, in a plan view of the sealing resin.
2. A module according to claim 1 , wherein
the hole includes a first area overlapping with the top surface of the component and a second area not overlapping with the top surface of the component in a plan view of the sealing resin, and
the second shielding film provided in the hole is brought into contact with the first shielding film at a first position facing the top surface of the component, the first position being inside the first area, and is brought into contact with the first shielding film at a second position facing the side surface of the component, the second position being inside the second area.
3. A module according to claim 2 , wherein each of the depths of the hole in the first area and the second area is greater than the depth of the recess.
4. A module comprising:
a substrate;
a component mounted on a top surface being one principal surface of the substrate;
a first shielding film provided on a top surface and a side surface of the component;
a sealing resin provided on the top surface of the substrate and sealing the component; and
a second shielding film provided on a top surface of the sealing resin, wherein
a hole is provided on the top surface of the sealing resin to reach at least a part of the first shielding film,
the hole includes a first area overlapping with the top surface of the component and a second area not overlapping with the top surface of the component in a plan view of the sealing resin,
the second shielding film provided in the hole is brought into contact with the first shielding film at a first position facing the top surface of the component, the first position being inside the first area, and is brought into contact with the first shielding film at a second position facing the side surface of the component, the second position being inside the second area,
a recess is provided on the top surface of the sealing resin in a manner recessed toward the top surface of the substrate,
each of depths of the hole in the first area and the second area is greater than a depth of the recess, and
each of the hole and the recess delineates an identifier including at least one of a character, a number, a symbol, a dot-shaped recognition code, a barcode, a two-dimensional code, a logo, and a graphic, in a plan view of the sealing resin.