Carrier based high volume system level testing of devices with pop structures
A testing apparatus comprises a tester comprising a plurality of racks, wherein each rack comprises a plurality of slots, wherein each slot comprises: (a) an interface board affixed in a slot of a rack, wherein the interface board comprises test circuitry and a plurality of sockets, each socket operable to receive a device under test (DUT); and (b) a carrier comprising an array of DUTs, wherein the carrier is operable to displace into the slot of the rack; and (c) an array of POP memory devices, wherein each POP memory device is disposed adjacent to a respective DUT in the array of DUTs. Further, the testing apparatus comprises a pick-and-place mechanism for loading the array of DUTs into the carrier and an elevator for transporting the carrier to the slot of the rack.
1. A tester comprising:
a socket structure configured to receive a device-under-test (DUT) held in a membrane pocket;
a package-on-package (POP) structure configured to couple to the DUT from a vertical position relative to the DUT; and
an actuator configured to engage the POP structure, the DUT, the membrane pocket, and the socket structure into a testing arrangement that pushes the DUT through the membrane pocket to make electrical and physical contact with the socket structure.
2. The tester of claim 1 , further comprising a carrier comprising pockets on a thin membrane,
wherein a plurality of said DUTs are situated in said pockets, and
wherein the carrier is operable to carry the DUT and to position the DUT to facilitate the testing arrangement.
3. The tester of claim 2 , wherein if the DUT is untested, the carrier is configured to move the DUT into a testing position, and wherein if the DUT is completed with testing, the carrier is configured to move the DUT from the testing position.
4. The tester of claim 1 , wherein the DUT comprises a ball-grid array, and
wherein solder balls of the ball-grid are pushed through the membrane to make contact with the socket structure.
5. The tester of claim 1 , wherein the POP structure comprises an interposer layer configured to facilitate electrical connection.
6. The tester of claim 1 , wherein the POP structure comprises a first type of device, and wherein the DUT comprises a second type of device.
7. The tester of claim 1 , wherein the POP structure comprises a frame structure configured to facilitate alignment.
8. A tester comprising:
a carrier configured to carry a device-under-test (DUT) and comprising a membrane pocket configured to hold the DUT;
a slot configured to receive the carrier and to run a test on a testing arrangement;
the testing arrangement comprising a package-on package (POP) structure, the DUT, the membrane pocket, and a socket structure; and
an actuator configured to press on the testing arrangement to push the DUT through the membrane pocket to make electrical and physical contact with the socket structure.
9. The tester of claim 8 , wherein the DUT comprises a ball-grid array, and
wherein the membrane is configured to be pushed through by solder balls of the ball-grid array to make electrical electrical contact with the socket structure.
10. The tester of claim 8 , wherein if the DUT is untested, the carrier is configured to move the DUT into a testing position, and wherein if the DUT is completed with testing, the carrier is configured to move the DUT from the testing position.
11. The tester of claim 8 , wherein the POP structure comprises at least one from a memory device or an RF device.
12. The tester of claim 8 , wherein the POP structure comprises an interposer layer configured to facilitate electrical connection.
13. The tester of claim 8 , wherein the POP structure comprises a first type of device, and wherein the DUT comprises a second type of device.
14. The tester of claim 8 , wherein the POP structure comprises a frame structure configured to facilitate alignment.
15. A tester comprising:
a carrier configured to carry a device-under-test (DUT) and comprising a membrane pocket configured to hold the DUT;
a slot configured to receive the carrier and comprising an interface board in a fixed position in the slot, wherein the interface board comprises a socket structure, wherein the slot is further configured to facilitate a testing arrangement comprising a package-on-package (POP) structure, the DUT, the membrane pocket, and the socket structure; and
an actuator configured to press on the testing arrangement to push the DUT through the membrane pocket to make electrical and physical contact with the socket structure.
16. The tester of claim 15 , wherein if the DUT is untested, the carrier is configured to move the DUT into a testing position, and wherein if the DUT is completed with testing, the carrier is configured to move the DUT from the testing position.
17. The tester of claim 15 , wherein the POP structure comprises at least one from a memory device or an RF device.
18. The tester of claim 15 , wherein the DUT comprises a ball-grid array, and
wherein solder balls of the ball-grid array are configured to be pushed through the membrane to make contact with the socket.
19. The tester of claim 15 , wherein the POP structure comprises a first type of device, and wherein the DUT comprises a second type of device.
20. The tester of claim 15 , wherein the POP structure comprises a frame structure configured to facilitate alignment.