Granted Patent B2

US 12,396,280 · App. 18/761,785 · Granted Aug 19, 2025

Inventor: Shou-Chian Hsu (Zhubei, TW)

Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

H10F39/8057H10F39/024H10F39/026H10F39/804H10F39/811H01L21/56H01L24/95

Abstract

Claims (42)

1. A method of forming an image sensor package, the method comprising:

providing an optically transmissive lid comprising a first side and a second side, the optically transmissive lid comprising a plurality of recesses on the second side of the optically transmissive lid;

coupling a semiconductor wafer to the first side of the optically transmissive lid;

singulating the semiconductor wafer and the optically transmissive lid between each of a plurality of active areas in the semiconductor wafer to form a plurality of image sensor packages;

coupling the second side of the optically transmissive lid of each image sensor package to a carrier wafer, wherein the plurality of recesses on the optically transmissive lid form a space between the carrier wafer and the optically transmissive lid;

applying a light blocking material to each image sensor package, the light blocking material encapsulating each image sensor package from a first side of the package into and including the recesses on the optically transmissive lid; and

singulating the plurality of image sensor packages into a plurality of encapsulated image sensor packages;

wherein the light blocking material is configured to ensure that light only enters a portion of a single side of the optically transmissive lid of each image sensor package.

2. The method of claim 1 , further comprising forming the plurality of recesses on the

second side of the optically transmissive lid through one of etching or laser ablation.

3. The method of claim 1 , wherein the light blocking material is configured to prevent flare.

4. The method of claim 1 , further comprising forming a plurality of through silicon vias (TSVs), a passivation layer, a redistribution layer, a solder mask, and coupling solder bumps to each image sensor package.

5. The method of claim 1 , wherein an opening in the light blocking material on each of the plurality image sensor packages corresponds with an active area in a semiconductor die.

6. The method of claim 1 , wherein the image sensor package is a chip scale package.

7. A method of forming an image sensor, the method comprising:

providing an optically transmissive lid comprising a first side and a second side opposite the first side;

coupling a semiconductor wafer to the first side of the optically transmissive lid;

singulating the semiconductor wafer and the optically transmissive lid to form a plurality of image sensor packages; and

applying light blocking material to each of the image sensor packages;

wherein each of the image sensor packages are configured to receive light only through an opening through the light blocking material on the second side of the optically transmissive lid.

8. The method of claim 7 , wherein the image sensor package is a chip scale package.

9. The method of claim 7 , wherein the optically transmissive lid comprises a plurality of recesses in the second side.

10. The method of claim 7 , wherein the light blocking material comprises a mold compound.

11. The method of claim 7 , further comprising coupling the second side of the optically transmissive lids of each image sensor package to a carrier wafer prior to applying the light blocking material.

12. The method of claim 7 , wherein the light block material is configured to prevent flare within each image sensor package.

13. The method of claim 7 , wherein an outermost surface of the light blocking material covering the second side of the optically transmissive lid is coplanar with an outermost surface of the second side of the optically transmissive lid.

14. A method of forming a semiconductor package, the method comprising:

providing an optically transmissive lid comprising a first side and a second side opposite the first side, the optically transmissive lid comprising a plurality of recesses on the second side of the optically transmissive lid;

forming a panel of semiconductor packages through coupling a semiconductor wafer to the first side of the optically transmissive lid;

forming a plurality of through-silicon vias (TSVs) through the semiconductor wafer;

coupling a redistribution layer over the semiconductor wafer;

singulating the panel of semiconductor packages to form a plurality of semiconductor packages;

coupling the second side of the optically transmissive lids of each semiconductor package to a carrier wafer;

applying light blocking material to each semiconductor package, the light blocking material configured to prevent flare within each of the semiconductor packages; and

singulating through the light blocking material to form a plurality of encapsulated semiconductor packages.

15. The method of claim 14 , further comprising forming the plurality of recesses on the

second side of the optically transmissive lid through one of etching or laser ablation.

16. The method of claim 14 , wherein the light blocking material covers at least a portion of each side of each semiconductor package.

17. The method of claim 14 , wherein an opening in the light blocking material on each of the plurality semiconductor packages corresponds with an active area in a semiconductor die.

18. The method of claim 14 , further comprising forming a plurality of dams between the optically transmissive lid and the semiconductor wafer.

19. The method of claim 14 , wherein the semiconductor package is a chip scale package.

20. The method of claim 14 , wherein an outermost surface of the light blocking material covering the second side of the optically transmissive lid is coplanar with an outermost surface of the second side of the optically transmissive lid.

Assignments (1)

Continuity (4)

References Cited (10)