Electronic device multilevel package substrate for improved electromigration performance
An electronic device includes a multilevel package substrate with first and second levels extending in planes of first and second directions and spaced apart from one another along a third direction, the first level having a first side with landing areas spaced apart from one another along the first direction. The multilevel package substrate includes a conductive structure having first and second ends and conductive portions in the first and second levels that provide a conductive path along the first direction from the landing areas toward the second end, where the conductive structure includes indents that extend into the conductive portions in the first level, the indents spaced apart from one another along the first direction and positioned along the first direction between respective pairs of the landing areas.
1. A method for making an electronic device, comprising:
forming a multilevel package substrate having a first level, a second level, a conductive structure, and conductive leads;
forming molded dielectric features and patterning conductive features in the first and second levels;
extending the first level in a plane of a first direction and an orthogonal second direction, the first level including a conductive first trace layer and a conductive first via layer, the first level having a first side with landing areas spaced apart from one another along the first direction;
the second level including a conductive second trace layer and a conductive second via layer, the second trace layer spaced apart from the first trace layer along a third direction that is orthogonal to the first and second directions;
the conductive structure having a first end and a second end that is spaced apart from the first end along the first direction, the conductive structure including conductive portions in the first and second levels that provide a conductive path along the first direction from the landing areas toward the second end;
forming indents in the conductive structure that extend into the conductive portions in the first level, the indents spaced apart from one another along the first direction, and the indents positioned along the first direction between respective pairs of the landing areas;
electrically coupling conductive terminals of a die to respective ones of the landing areas; and
enclosing the die and a portion of the multilevel package substrate with a package structure.
2. The method for claim 1 , wherein the indents extend into the conductive features in the second level.
3. The method for claim 2 , wherein the indents extend into the conductive structure along the third direction.
4. The method for claim 3 , wherein the indents extend through the conductive portions in the first level.
5. The method for claim 3 , wherein:
the indents extend through the first trace layer along a third direction; and
the indents laterally surround the landing areas.
6. The method for claim 3 , further including extending second indents into the conductive structure along the second direction.
7. The method for claim 2 , wherein the indents extend into the conductive structure along the second direction.
8. The electronic device of claim 1 , wherein the indents extend into the conductive structure along the third direction.
9. The electronic device of claim 8 , wherein the indents extend through the conductive portions in the first level.
10. The method for claim 8 , wherein:
the indents extend through the first trace layer along a third direction; and
the indents laterally surround the landing areas.
11. The method for claim 1 , wherein the indents extend into the conductive structure along the second direction.
12. A method for making a multilevel package substrate, comprising:
forming a first level;
forming a second level; and
forming a conductive structure;
the first and second levels each having patterned conductive features and molded dielectric features;
the first level extending in a plane of a first direction and an orthogonal second direction, the first level including a conductive first trace layer and a conductive first via layer, the first level having a first side with landing areas spaced apart from one another along the first direction, the landing areas adapted to be soldered to conductive terminals of a die;
the second level including a conductive second trace layer and a conductive second via layer, the second trace layer spaced apart from the first trace layer along a third direction that is orthogonal to the first and second directions;
the conductive structure having a first end and a second end that is spaced apart from the first end along the first direction, the conductive structure including conductive portions in the first and second levels that provide a conductive path along the first direction from the landing areas toward the second end; and
extending indents from the conductive structure into the conductive portions in the first level, the indents spaced apart from one another along the first direction, and the indents positioned along the first direction between respective pairs of the landing areas.
13. The method for claim 12 , wherein the indents extend into the conductive features in the second level.
14. The method for claim 13 , wherein the indents extend into the conductive structure along the second direction.
15. The method for claim 12 , wherein the indents extend into the conductive structure along the third direction.
16. The method for claim 15 , wherein the indents extend through the conductive portions in the first level.
17. The method for claim 15 , wherein:
the indents extend through the first trace layer along a third direction; and
the indents laterally surround the landing areas.
18. The method for multilevel package substrate of claim 12 , wherein the indents extend into the conductive structure along the second direction.