Thin film transistor and manufacturing method thereof, array substrate, and display device
The present disclosure provides a TFT. The TFT includes an active layer and a gate insulating layer, the active layer includes a first active sub-layer and a second active sub-layer which are arranged in a stacked manner, the second active sub-layer is between the gate insulating layer and the first active sub-layer, a Fermi potential of the first active sub-layer is larger than a Fermi potential of the second active sub-layer, a maximum thickness of a depletion region in the first active sub-layer is equal to a thickness of the first active sub-layer, and a maximum thickness of a depletion region in the second active sub-layer is equal to a thickness of the second active sub-layer.
1. A thin film transistor (TFT), comprising: an active layer, a gate insulating layer, a source electrode and a drain electrode,
wherein the active layer comprises a first active sub-layer and a second active sub-layer which are arranged in a stacked manner, the second active sub-layer is between the gate insulating layer and the first active sub-layer, a Fermi potential of the first active sub-layer is larger than a Fermi potential of the second active sub-layer,
materials of the first and second active sub-layers each comprise indium gallium zinc oxide;
the first active sub-layer is formed by magnetron sputtering in a process environment with an oxygen partial pressure of a first preset value a 1 ,
the second active sub-layer is formed by magnetron sputtering in a process environment with an oxygen partial pressure of a second preset value a 2 ,
the first preset value a 1 is 30% and the second preset value a 2 is 40% or 50%,
the second active sub-layer is connected to the source electrode and the drain electrode through via holes, and
both the first active sub-layer and the second active sub-layer extend beyond the gate insulating layer, the second active sub-layer covers the first active sub-layer, the material of a region of the second active sub-layer covered by the gate insulating layer consists of gallium zinc oxide; the material of a region of the first active sub-layer not covered by the gate insulating layer consists of gallium zinc oxide, and the material of a region of the second active sub-layer not covered by the gate insulating layer consists of IGZ.
2. The TFT of claim 1 , wherein in response to a gate voltage applied to a gate electrode of the TFT being less than or equal to a threshold voltage of the TFT, each of a thickness of the depletion region in the first active sub-layer and a thickness of the depletion region in the second active sub-layer is at its maximum thickness.
3. The TFT of claim 2 , wherein in response to the gate voltage being greater than the threshold voltage and equal to or less than a first voltage, as the gate voltage increases, the thickness of the depletion region in the first active sub-layer gradually decreases and the thickness of the depletion region in the second active sub-layer is at its maximum thickness, wherein the first voltage is a voltage that causes the thickness of the depletion region in the first active sub-layer to be zero.
4. The TFT of claim 3 , wherein in response to the gate voltage being greater than the first voltage and less than a second voltage, as the gate voltage increases, the thickness of the depletion region in the first active sub-layer remains zero and the thickness of the depletion region in the second active sub-layer gradually decreases, wherein the second voltage is a voltage that causes the thickness of the depletion region in the second active sub-layer to be zero.
5. The TFT of claim 1 , wherein the second active sub-layer is in direct contact with the gate insulating layer.
6. The TFT of claim 1 , wherein carrier concentration of the first active sub-layer is greater than carrier concentration of the second active sub-layer.
7. The TFT of claim 1 , further comprising: a gate electrode on a side of the gate insulating layer facing away from the active layer.
8. A display device, comprising a thin film transistor, which comprises an active layer, a gate insulating layer, a source electrode and a drain electrode,
wherein the active layer comprises a first active sub-layer and a second active sub-layer which are arranged in a stacked manner, the second active sub-layer is between the gate insulating layer and the first active sub-layer, a Fermi potential of the first active sub-layer is larger than a Fermi potential of the second active sub-layer,
materials of the first and second active sub-layers each comprise indium gallium zinc oxide;
the first active sub-layer is formed by magnetron sputtering in a process environment with an oxygen partial pressure of a first preset value a 1 ,
the second active sub-layer is formed by magnetron sputtering in a process environment with an oxygen partial pressure of a second preset value a 2 ,
the first preset value a 1 is 30% and the second preset value a 2 is 40% or 50%,
the second active sub-layer is connected to the source electrode and the drain electrode through via holes, and
both the first active sub-layer and the second active sub-layer extend beyond the gate insulating layer, the second active sub-layer covers the first active sub-layer, the material of a region of the second active sub-layer covered by the gate insulating layer consists of gallium zinc oxide; the material of a region of the first active sub-layer not covered by the gate insulating layer consists of gallium zinc oxide, and the material of a region of the second active sub-layer not covered by the gate insulating layer consists of IGZ.
9. A manufacturing method of a thin film transistor (TFT), comprising:
forming a gate insulating layer;
forming an active layer, the active layer comprising a first active sub-layer and a second active sub-layer arranged in a stacked manner; and
forming a source electrode and a drain electrode,
wherein the second active sub-layer is between the gate insulating layer and the first active sub-layer, a Fermi potential of the first active sub-layer is larger than a Fermi potential of the second active sub-layer, materials of the first and second active sub-layers each comprise indium gallium zinc oxide;
the first active sub-layer is formed by magnetron sputtering in a process environment with an oxygen partial pressure of a first preset value a 1 ,
the second active sub-layer is formed by magnetron sputtering in a process environment with an oxygen partial pressure of a second preset value a 2 ,
the first preset value a 1 is 30% and the second preset value a 2 is 40% or 50%,
the second active sub-layer is connected to the source electrode and the drain electrode through via holes, and
both the first active sub-layer and the second active sub-layer extend beyond the gate insulating layer, the second active sub-layer covers the first active sub-layer, the material of a region of the second active sub-layer covered by the gate insulating layer consists of gallium zinc oxide; the material of a region of the first active sub-layer not covered by the gate insulating layer consists of gallium zinc oxide, and the material of a region of the second active sub-layer not covered by the gate insulating layer consists of IGZ.
10. The manufacturing method of claim 9 , wherein forming the active layer comprises:
forming a first active material thin film;
forming a second active material thin film; and
performing a patterning process on the first active material thin film and the second active material thin film to form a pattern of the first active sub-layer and a pattern of the second active sub-layer.
11. The manufacturing method of claim 10 , wherein the first active material thin film and the second active material thin film are made of a same material.
12. The manufacturing method of claim 11 , wherein forming the gate insulating layer and forming the active layer comprise:
forming the first active material thin film on a base substrate;
forming a second active material thin film on a side of the first active material thin film facing away from the base substrate;
performing a pattern process on the first active material thin film and the second active material thin film to form the pattern of the first active sub-layer and the pattern of the second active sub-layer;
forming a gate insulating material thin film on a side of the second active sub-layer facing away from the base substrate; and
performing a pattern process on the gate insulating material thin film to form a pattern of the gate insulating layer.
13. The manufacturing method of claim 9 , further comprising:
forming a gate electrode on a side of the gate insulating layer facing away from the base substrate;
forming an interlayer dielectric layer on a side of the gate electrode facing away from the base substrate, wherein via holes connected to the second active sub-layer are formed in the interlayer dielectric layer; and
forming the source electrode and the drain electrode on a side of the interlayer dielectric layer facing away from the base substrate, wherein the source electrode and the drain electrode are connected to the second active sub-layer through the via holes, respectively.
14. The manufacturing method of claim 9 , wherein forming the gate insulating layer and forming the active layer comprise:
forming, on a base substrate, a gate insulating material thin film as the gate insulating layer;
forming a second active material thin film on a side of the gate insulating layer facing away from the base substrate;
forming a first active material thin film on a side of the second active material thin film facing away from the base substrate; and
performing a patterning process on the first active material thin film and the second active material thin film to form a pattern of the first active sub-layer and a pattern of the second active sub-layer.
15. The manufacturing method of claim 14 , wherein before forming the gate insulating material thin film on the base substrate, the manufacturing method further comprises:
forming a gate electrode on the base substrate;
after performing the patterning process on the first active material thin film and the second active material thin film, the manufacturing method further comprises:
forming the source electrode and the drain electrode on a side of the first active sub-layer facing away from the base substrate.