Integrated chip including an upper conductive structure having multilayer stack to decrease fabrication costs and increase performance
Various embodiments of the present disclosure are directed towards an integrated chip. The integrated chip includes an interconnect structure overlying a semiconductor substrate and comprising a conductive wire. A passivation structure overlies the interconnect structure. An upper conductive structure overlies the passivation structure and comprises a first conductive layer, a dielectric layer, and a second conductive layer. The first conductive layer is disposed between the dielectric layer and the passivation structure. The second conductive layer extends along a top surface of the dielectric layer and penetrates through the first conductive layer and the passivation structure to the conductive wire.
1. An integrated chip, comprising:
an interconnect structure overlying a semiconductor substrate and comprising a conductive wire, wherein the conductive wire is disposed in a topmost wire level over the semiconductor substrate;
a passivation structure overlying the interconnect structure; and
an upper conductive structure overlying the passivation structure and comprising a first conductive layer, a dielectric layer, and a second conductive layer, wherein the first conductive layer is disposed between the dielectric layer and the passivation structure, wherein the second conductive layer extends along a top surface of the dielectric layer and penetrates through the first conductive layer and the passivation structure to the conductive wire, wherein the first conductive layer directly contacts a top surface of the passivation structure, wherein the dielectric layer directly contacts a top surface of the first conductive layer and a lower surface of the second conductive layer.
2. The integrated chip of claim 1 , wherein the first conductive layer and the second conductive layer comprise a first conductive material.
3. The integrated chip of claim 2 , wherein the conductive wire comprises a second conductive material different from the first conductive material.
4. The integrated chip of claim 1 , wherein a first thickness of the first conductive layer is less than a second thickness of the second conductive layer.
5. The integrated chip of claim 1 , wherein the second conductive layer comprises a center conductive segment and a peripheral conductive segment that extends outwardly from the center conductive segment, wherein the peripheral conductive segment continuously laterally wraps around the center conductive segment and directly contacts the top surface of the dielectric layer.
6. The integrated chip of claim 5 , wherein the center conductive segment directly contacts a top surface of the conductive wire, and wherein the center conductive segment contacts inner sidewalls of the dielectric layer, inner sidewalls of the first conductive layer, and inner sidewalls of the passivation structure.
7. The integrated chip of claim 1 , wherein outer sidewalls of the first conductive layer, outer sidewalls of the dielectric layer, and outer sidewalls of the second conductive layer are respectively straight and aligned with one another.
8. The integrated chip of claim 1 , wherein outer sidewalls of the second conductive layer and outer sidewalls of the dielectric layer are curved inward towards a center of the upper conductive structure.
9. An integrated chip, comprising:
a dielectric structure overlying a semiconductor substrate;
a conductive wire disposed within the dielectric structure, wherein a top surface of the conductive wire is aligned with a top surface of the dielectric structure;
a passivation structure disposed over the dielectric structure and comprising opposing sidewalls defining a trench over the conductive wire; and
an upper conductive structure disposed within the trench and electrically coupled to the conductive wire, wherein the upper conductive structure comprises a first conductive layer, a dielectric layer, and a second conductive layer, wherein the first conductive layer and the dielectric layer are disposed along a top surface of the passivation structure, wherein the second conductive layer lines the trench and directly contacts the top surface of the conductive wire, wherein a top surface of the second conductive layer is above the dielectric layer, wherein outer opposing sidewalls of the first conductive layer are aligned with outer opposing sidewalls of the second conductive layer.
10. The integrated chip of claim 9 , wherein the first conductive layer and the dielectric layer each laterally wrap around a center segment of the second conductive layer.
11. The integrated chip of claim 9 , further comprising:
a bond bump structure overlying the second conductive layer and filling the trench, wherein a bottom surface of the bond bump structure is disposed below a bottom surface of the first conductive layer; and
a solder ball disposed along a top surface of the bond bump structure.
12. The integrated chip of claim 9 , further comprising:
a light-emitting device overlying the passivation structure, wherein the light-emitting device is laterally adjacent to the upper conductive structure, and wherein the light-emitting device comprises a light-emitting structure over an electrode.
13. The integrated chip of claim 12 , wherein the electrode continuously extends from above the second conductive layer, along inner sidewalls of the second conductive layer, to a point below the top surface of the passivation structure, wherein the light-emitting structure directly overlies the upper conductive structure.
14. The integrated chip of claim 13 , wherein the electrode directly contacts an individual outer sidewall in the outer opposing sidewalls of the first conductive layer, an outer sidewall of the dielectric layer, and an individual outer sidewall in the outer opposing sidewalls of the second conductive layer.
15. An integrated chip, comprising:
an interconnect structure overlying a semiconductor substrate and comprising a conductive wire;
a passivation structure overlying the interconnect structure; and
an upper conductive structure overlying the passivation structure and comprising a first conductive layer, a dielectric layer, and a second conductive layer, wherein the first conductive layer is disposed between the dielectric layer and the passivation structure, wherein the second conductive layer comprises a middle segment extending through the passivation structure to contact the conductive wire, wherein the middle segment comprises a first sidewall that contacts an inner sidewall of the first conductive layer and an inner sidewall of the dielectric layer, wherein the dielectric layer and the first conductive layer are disposed on opposing sides of the middle segment, and wherein outer sidewalls of the first conductive layer are slanted inward toward the middle segment.
16. The integrated chip of claim 15 , wherein the second conductive layer further comprises a peripheral segment extending outwardly from the first sidewall of the middle segment to a top surface of the dielectric layer.
17. The integrated chip of claim 15 , wherein a bottom surface of the upper conductive structure is vertically above a bottom surface of the conductive wire.
18. The integrated chip of claim 15 , wherein a vertical thickness of the first conductive layer is less than a lateral thickness of the middle segment disposed along the inner sidewall of the first conductive layer.
19. The integrated chip of claim 15 , wherein a first distance between outer sidewalls of the second conductive layer is less than a width of the conductive wire and is greater than a second distance between outermost sidewalls of the dielectric layer.
20. The integrated chip of claim 15 , wherein the first conductive layer comprises a first segment contacting the first sidewall of the middle segment and a second segment contacting a second sidewall of the middle segment.