Narrowing single diffusion break
Embodiments herein describe semiconductor devices with single diffusion breaks that are narrower than the gates of transistors in those devices. That is, rather than forming the diffusion breaks using a dummy gate (which would result in the diffusion breaks having the same width as the gates of the transistors) the embodiments herein use different means to establish the width of the diffusion break. As a result, the diffusion break can be narrower than traditional diffusion breaks formed using dummy gates, thereby saving area in the semiconductor device.
1. A semiconductor device comprising:
a first active region comprising a first transistor with a first gate disposed on a substrate;
a second active region comprising a second transistor with a second gate disposed on the substrate;
a diffusion break region disposed between the first and second active regions, the diffusion break region comprising a diffusion break that extends into the substrate and has a width that is less than widths of the first and second gates; and
a first spacer liner contacting sides of the first and second gates;
a second spacer liner contacting (i) the first spacer liner, wherein the first and second spacer liners both contact the sides of the diffusion break, wherein a width of the second spacer liner and the diffusion break define a total width of the diffusion break region, and wherein the second spacer liner contacts source/drain (S/D) regions in the first active region and the second active region; and
wherein the diffusion break region further comprises:
portions of channels disposed along the sides of the diffusion break, wherein the portions of the channels are disposed underneath the second spacer liner and contact the S/D regions.
2. The semiconductor device of claim 1 , wherein a width of the diffusion break is 9 nm or less and a width of the second spacer liner is 3 nm or less, wherein the total width of the diffusion break region is 15 nm or less.
3. The semiconductor device of claim 1 , wherein the diffusion break is a dielectric material.
4. The semiconductor device of claim 3 , wherein the dielectric material comprises at least one of: SIN, SiC, or SiCO.
5. The semiconductor device of claim 1 , wherein the first and second transistors each comprises a plurality of channels surrounded by the first and second gates, respectively.
6. The semiconductor device of claim 5 , wherein the first and second gates are replacement high-k metal gates (HKMG).
7. A semiconductor device comprising:
a first active region comprising a first transistor;
a second active region comprising a second transistor; and
a diffusion break region disposed between the first and second active regions, the diffusion break region comprising:
a diffusion break and a spacer liner disposed on both sides of the diffusion break, wherein a combined width of the diffusion break and the spacer liner is 15 nm or less and wherein the spacer liner contacting the sides of the diffusion break also contacts source/drain (S/D) regions in the first active region and the second active region; and
portions of channels disposed along the sides of the diffusion break, wherein the portions of the channels are disposed underneath the spacer liner and also contact the S/D regions.
8. The semiconductor device of claim 7 , wherein the first transistor comprises a first gate and the second transistor comprises a second gate, wherein a width of the diffusion break is less than widths of the first and second gates.