Semiconductor device with voltage resistant structure
A semiconductor device of the present invention includes a semiconductor layer of a first conductivity type having a cell portion and an outer peripheral portion disposed around the cell portion, formed with a gate trench at a surface side of the cell portion, and a gate electrode buried in the gate trench via a gate insulating film, forming a channel at a portion lateral to the gate trench at ON-time, the outer peripheral portion has a semiconductor surface disposed at a depth position equal to or deeper than a depth of the gate trench, and the semiconductor device further includes a voltage resistant structure having a semiconductor region of a second conductivity type formed in the semiconductor surface of the outer peripheral portion.
1. A wide band gap semiconductor device comprising:
a semiconductor substrate;
a first gate insulating film on the semiconductor substrate;
a first gate electrode on the first gate insulating film;
a second gate insulating film on the semiconductor substrate;
a second gate electrode on the second gate insulating film;
a surface insulating film formed over the first gate electrode and the second gate electrode; and
a source electrode over the semiconductor substrate and at least placed over the first gate electrode and the second gate electrode, an outermost portion of the source electrode including an inclined surface in a cross section,
wherein a first portion of a surface of the semiconductor substrate between a center of the first gate electrode and a center of the second gate electrode is recessed compared to a second portion under the center of the first gate electrode and a third portion under the center of the second gate electrode,
the peripheral portion of the semiconductor substrate is recessed and reaches to an edge of the semiconductor substrate, and
a first thickness of at least part of the surface insulating film under the source electrode is thinner than a second thickness of at least part of the surface insulating film formed in an area other than under the source electrode when viewed in a cross section.
2. The semiconductor device according to claim 1 , wherein an impurity region of P-type material is formed at a surface of the peripheral portion.
3. The semiconductor device according to claim 2 , wherein a source contact region is formed in a region between the first gate electrode and the second gate electrode.
4. The semiconductor device according to claim 3 , wherein at least one of the first gate electrode and the second gate electrode is a planer type gate electrode.
5. The semiconductor device according to claim 4 , wherein
a gate finger is formed between the source electrode and a peripheral portion of the semiconductor substrate in a cross section, and
a height of the gate finger is approximately the same as a height of the source electrode.
6. The semiconductor device according to claim 5 , wherein the source electrode is made of a material including an aluminum.
7. The semiconductor device according to claim 6 , wherein the gate finger is made of a material including an aluminum.
8. The semiconductor device according to claim 7 , wherein a peripheral source electrode is formed between the gate finger and the peripheral portion of the semiconductor substrate.
9. The semiconductor device according to claim 8 , wherein the semiconductor substrate is made of SiC, GaN, or diamond.
10. The semiconductor device according to claim 9 , further comprising a titanium material between the source electrode and the semiconductor substrate at the source contact region.
11. The semiconductor device according to claim 10 , wherein the gate insulating film is made of a material including silicon.
12. The semiconductor device according to claim 11 , wherein the gate electrode is made of a material including a polysilicon.
13. The semiconductor device according to claim 12 , wherein a surface of the source electrode is dented according to the surface of the semiconductor substrate.
14. The semiconductor device according to claim 12 , wherein a depth of the recess of the portion of the surface of the semiconductor substrate between the center of the first gate electrode and the center of the second gate electrode is approximately the same as a depth of the recess of the peripheral portion.
15. The semiconductor device according to claim 12 , wherein the recess of the portion of surface of the semiconductor substrate between the center of the first gate electrode and the center of the second gate electrode is fabricated at a same time with the recess of the peripheral portion.
16. The semiconductor device according to claim 12 , wherein the recessed part of the peripheral portion has a flat surface at a bottom thereof.
17. The semiconductor device according to claim 16 , further comprising a gate pad electrically connected to the gate finger and arranged in the vicinity of a side of the semiconductor substrate.
18. The semiconductor device according to claim 1 , wherein the surface insulating film has a thickness smaller than a thickness of the source electrode.
19. The semiconductor device according to claim 18 , wherein at least a part of the peripheral portion of the semiconductor substrate is covered with the surface insulating film.