Semiconductor device
A semiconductor device with a novel structure is provided. The semiconductor device includes a memory circuit including a first transistor and a second transistor. The first transistor is formed on a silicon substrate. The second transistor is formed in a layer above a layer where the first transistor is provided. The first transistor includes a first gate electrode and a first back gate electrode with a first channel formation region interposed therebetween. The first gate electrode is electrically connected to one of a source and a drain of the second transistor. The first back gate electrode is formed using a region where an impurity element imparting a conductivity type is selectively introduced in the silicon substrate. The second transistor includes a second channel formation region. The second channel formation region includes a metal oxide.
1. A semiconductor device comprising a memory circuit comprising a first transistor and a second transistor,
wherein the first transistor is formed on a silicon substrate,
wherein the second transistor is formed in a layer above a layer where the first transistor is provided,
wherein the first transistor comprises a first gate electrode and a first back gate electrode with a first channel formation region interposed therebetween,
wherein the first gate electrode is electrically connected to one of a source and a drain of the second transistor,
wherein one of a source and a drain of the first transistor is electrically connected to one of a source and a drain of a third transistor,
wherein the third transistor comprises a third gate electrode and a third back gate electrode with a third channel formation region interposed therebetween,
wherein the first back gate electrode is electrically connected to the third back gate electrode, and
wherein the first back gate electrode is formed using a region where an impurity element imparting a conductivity type is selectively introduced in the silicon substrate.
2. The semiconductor device according to claim 1 ,
wherein the first transistor comprises an insulating layer between the first back gate electrode and the first channel formation region, and
wherein the insulating layer is an insulating layer formed with a buried oxide.
3. The semiconductor device according to claim 1 ,
wherein the second transistor comprises a second channel formation region, and
wherein the second channel formation region comprises a metal oxide.
4. The semiconductor device according to claim 3 , wherein the metal oxide comprises In, Ga, and Zn.
5. The semiconductor device according to claim 1 , wherein the second transistor comprises a second back gate electrode.
6. A semiconductor device comprising a memory circuit comprising a first transistor and a second transistor,
wherein a channel formation region of the first transistor is provided in a silicon substrate,
wherein the second transistor is formed above the first transistor,
wherein the first transistor comprises a first gate electrode and a first back gate electrode with a first channel formation region interposed therebetween,
wherein the first gate electrode is electrically connected to one of a source and a drain of the second transistor,
wherein one of a source and a drain of the first transistor is electrically connected to one of a source and a drain of a third transistor,
wherein the third transistor comprises a third gate electrode and a third back gate electrode with a third channel formation region interposed therebetween,
wherein the first back gate electrode is electrically connected to the third back gate electrode, and
wherein the first back gate electrode is formed using a region where an impurity element is selectively introduced in the silicon substrate.
7. The semiconductor device according to claim 6 ,
wherein the first transistor comprises an insulating layer between the first back gate electrode and the first channel formation region, and
wherein the insulating layer is an insulating layer formed with a buried oxide.