Normally-off transistor with reduced on-state resistance and manufacturing method
A normally-off electronic device, comprising: a semiconductor body including a heterostructure that extends over a buffer layer; a recessed-gate electrode, extending in a direction orthogonal to the plane; a first working electrode and a second working electrode at respective sides of the gate electrode; and an active area housing, in the on state, a conductive path for a flow of electric current between the first and second working electrodes. A resistive region extends at least in part in the active area that is in the buffer layer and is designed to inhibit the flow of current between the first and second working electrodes when the device is in the off state. The gate electrode extends in the semiconductor body to a depth at least equal to the maximum depth reached by the resistive region.
1. A device, comprising:
a semiconductor body including a buffer region and a first heterostructure on the buffer region, the buffer region including:
an electrical-conduction layer with a first surface; and
a resistive layer on the first surface of the electrical-conduction layer;
an insulation layer on the semiconductor body, the insulation layer having a first surface;
a trench extending through the insulation layer and at least partially through the buffer region along a first direction;
a gate dielectric layer in the trench and on the first surface of the insulation layer, the gate dielectric layer having a first surface coplanar with the first surface of the electrical-conduction layer;
a gate electrode in the trench, the gate electrode extending into the semiconductor body and at least partially through the buffer region;
a conductive source electrode extending along the first direction through the insulation layer, the source electrode being in direct contact with the gate dielectric layer;
a conductive drain electrode extending along the first direction through the insulation layer, the gate electrode disposed between the source and drain electrodes along a second direction that is transverse to the first direction, the drain electrode being in direct contact with the gate dielectric layer; and
an active area extending in the buffer region, the active area having a depth extending along the first direction that is greater than a depth of the gate electrode, and having a width extending along the second direction between the source electrode and the drain electrode,
wherein each of the gate electrode, the source electrode, and the drain electrode includes respective portions which extend over the first surface of the insulation layer along the first direction.
2. The device of claim 1 , wherein the gate dielectric layer extends along the first direction directly between the first surface of the insulation layer and the respective portions of the gate electrode, the source electrode, and the drain electrode.
3. The device of claim 1 , wherein:
the active area is configured to, in a first operating condition in which a first voltage between the gate electrode and one of the source electrode or the drain electrode is higher than a threshold voltage, provide a conductive path for a flow of an electric current between the source and drain electrodes,
the active area in the buffer region includes the resistive layer configured to, in a second operating condition in which a second voltage between the gate electrode and the one of the source electrode or the drain electrode is lower than the threshold voltage, hinder an electric current flow between the source and drain electrodes.
4. The device of claim 3 , wherein the resistive layer is a layer of a compound formed by elements of Groups III-V with a doping of a P-type.
5. The device of claim 3 , wherein the active area in the buffer region includes the electrical-conduction layer of a compound formed by elements of Groups III-V of an intrinsic type or with a doping of N-type, the resistive layer disposed on the electrical-conduction layer.
6. The device of claim 5 , further comprising a conductive channel between the source electrode and the drain electrode, the conductive channel extending through the electrical-conduction layer and around the gate electrode through the electrical-conduction layer.
7. The device of claim 6 , wherein the semiconductor body includes an interface layer of a compound formed by elements of Groups III-V and extending between the substrate and the electrical-conduction layer.
8. The device of claim 1 , wherein the first heterostructure includes a channel layer, of a material that is a compound formed by elements of Groups III-V including nitride, and an electron-supply layer extending over the channel layer.
9. A device, comprising:
a semiconductor body including a buffer region and a first heterostructure on the buffer region, the buffer region including a resistive layer and a conductive layer;
an insulation layer on the semiconductor body, the insulation layer having a first surface;
a trench extending through the insulation layer and at least partially through the buffer region along a first direction;
a gate dielectric layer in the trench and entirely covering the first surface of the insulation layer, the gate dielectric layer extending along the first direction entirely through the resistive layer, reaching an interface between the resistive layer and the conductive layer;
a gate electrode in the trench, the gate electrode extending into the semiconductor body and at least partially through the buffer region;
a source electrode and a drain electrode extending entirely through the insulation layer along the first direction, the gate electrode disposed between the source and drain electrodes along a second direction that is transverse to the first direction; and
an active area extending in the buffer region, the active area having a depth extending along the first direction that is greater than a depth of the gate electrode, and having a width extending along the second direction between the source electrode and the drain electrode,
wherein the active area includes a portion of the conductive layer, which includes gallium nitride of an intrinsic type or with N-type doping, and a portion of the resistive layer, which includes gallium nitride of P-type doping on the conductive layer,
wherein each of the gate electrode, the source electrode, and the drain electrode includes respective portions which extend over the first surface of the insulation layer along the first direction.
10. The device of claim 9 , wherein the resistive layer has a density of dopant species between 10 15 ions/cm 3 and 10 20 ions/cm 3 .
11. The device of claim 9 , wherein the conductive layer has a thickness along the first direction between 20 nm and 10 μm.
12. A device, comprising:
a buffer region including a resistive layer on a first surface of an electrical-conduction layer;
a first heterostructure on the buffer region;
an insulation layer on the first heterostructure, the insulation layer having a first surface;
a trench extending through the insulation layer and into the buffer region in a first direction;
a gate dielectric layer in the trench and entirely covering the first surface of the insulation layer, the gate dielectric layer extending into the trench along the first direction, reaching an interface between the resistive layer and the electrical-conduction layer, the gate dielectric layer being in direct physical contact with the resistive layer;
a gate electrode in the trench, the gate electrode extending into the first heterostructure and into the buffer region;
a source electrode extending entirely through the insulation layer, the source electrode being in direct contact with the gate dielectric layer;
a drain electrode extending entirely through the insulation layer, the drain electrode being in direct contact with the gate dielectric layer, the gate electrode between the source and drain electrodes extending in a second direction that is transverse to the first direction; and
an active area extending in the buffer region, the active area having a depth extending in the first direction that is greater than a depth of the gate electrode, and having a width extending in the second direction between the source electrode and the drain electrode, each of the gate electrode, the source electrode, and the drain electrode includes respective portions that extend on the first surface of the insulation layer in the first direction.
13. The device of claim 12 , wherein the resistive layer includes P-type dopants.
14. The device of claim 13 , wherein the electrical-conduction layer includes N-type dopants.
15. The device of claim 14 , wherein the first heterostructure includes an interface layer of a compound formed by elements of Groups III-V.
16. The device of claim 14 , further comprising a conductive channel between the source electrode and the drain electrode, the conductive channel extending through the electrical-conduction layer.
17. The device of claim 12 , wherein the gate dielectric layer includes a first face that is coplanar with a first surface of the electrical-conduction layer.
18. The device of claim 12 , wherein the gate dielectric layer is in direct contact with the electrical-conduction layer, the resistive layer, the first heterostructure, and the insulation layer.