Semiconductor device
A part among a plurality of through vias formed in a non-transistor region is a floating via having a floating potential.
1 . A semiconductor device comprising:
a semiconductor chip having a transistor region and a non-transistor region; and
a plurality of through vias formed in the non-transistor region,
wherein the plurality of through vias include:
an active via electrically connected to a circuit;
a floating via having a floating potential, the floating via being disposed between the active via and a boundary between the transistor region and the non-transistor region in a plan view, the floating via being configured to undergo dielectric breakdown during plasma charge-up to become electrically connected to a back surface wiring to which a ground potential is supplied, thereby protect the active via from plasma-induced damage; and
a damage via having a ground potential, the damage via being disposed between the active via and the boundary between the transistor region and the non-transistor region in a plan view, the damage via being formed by the floating via becoming electrically connected to the back surface wiring to which the ground potential is supplied due to the dielectric breakdown occurring in the floating via.
2 . The semiconductor device according to claim 1 ,
wherein the damage via is formed on a back surface of the semiconductor chip and is connected to the back surface wiring to which the ground potential is supplied.