IP Library › Granted Patent US 12,464,889
Granted Patent B2
US 12,464,889 · App. 17/830,533 · Granted Nov 4, 2025

Light-emitting device and method for manufacturing light-emitting device

Inventors: Akihiro Chida (Kanagawa, JP); Tomoya Aoyama (Kanagawa, JP)
Assignee: Semiconductor Energy Laboratory Co., Ltd.
H10K50/8426H10K77/111
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Quick Facts
Patent No.
US 12,464,889
App. No.
17/830,533
Granted
Nov 4, 2025
Kind
B2
Abstract

A highly reliable flexible light-emitting device is provided. The light-emitting device includes a first flexible substrate, a second flexible substrate, a light-emitting element between the first flexible substrate and the second flexible substrate, a first bonding layer; and a second bonding layer in a frame shape surrounding the first bonding layer. The first bonding layer and the second bonding layer are between the second flexible substrate and the light-emitting element. The light-emitting element includes layer containing a light-emitting organic compound between the pair of electrodes. The second bonding layer has a higher gas barrier property than the first bonding layer.

Claims (16)

1 . A light-emitting device comprising:

a first flexible substrate;

a light-emitting element over the first flexible substrate;

a first bonding layer over the light-emitting element;

two second bonding layers arranged so as to be in contact with the first bonding layer; and

a second flexible substrate over the first bonding layer and the two second bonding layers,

wherein an oxygen permeability of the two second bonding layers is lower than an oxygen permeability of the first bonding layer, and

wherein the two second bonding layers are spaced apart from each other.

2 . A light-emitting device comprising:

a first flexible substrate;

a light-emitting element over the first flexible substrate;

a first bonding layer over the light-emitting element;

two second bonding layers arranged so as to be in contact with the first bonding layer; and

a second flexible substrate over the first bonding layer and the two second bonding layers,

wherein a water vapor permeability of the two second bonding layers is lower than a water vapor permeability of the first bonding layer, and

wherein the two second bonding layers are spaced apart from each other.

Priority Claims (2)
JP 2013-184698 · Sep 6, 2013 · national
JP 2013-218601 · Oct 21, 2013 · national
Continuity (4)
Continuation 16900034 · Jun 12, 2020
Continuation 15707383 · Sep 18, 2017
Division 14476154 · Sep 3, 2014
Related Publication 20220302411A1 · Sep 22, 2022
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