Warpage control of packages using embedded core frame
View Patent ↗A method includes placing a package component over a carrier. The package component includes a device die. A core frame is placed over the carrier. The core frame forms a ring encircling the package component. The method further includes encapsulating the core frame and the package component in an encapsulant, forming redistribution lines over the core frame and the package component, and forming electrical connectors over and electrically coupling to the package component through the redistribution lines.
1 . A package comprising:
a package component comprising a device die therein;
a core frame comprising a first portion and a second portion on opposite sides of the package component, wherein the core frame comprises:
a dielectric core; and
a first metal plate overlapping the dielectric core, wherein first edges of the first metal plate overlap, and are vertically aligned to, respective second edges of the dielectric core;
an encapsulant, wherein both of the device die and the core frame are in the encapsulant;
a plurality of dielectric layers over the core frame, wherein edges of the plurality of dielectric layer are over, and are vertically aligned to, an edge of the encapsulant; and
redistribution lines in the plurality of dielectric layers, wherein the redistribution lines are electrically connected to the package component, and are electrically decoupled from the core frame.
2 . The package of claim 1 further comprising a second metal plate on a second side of the dielectric core, wherein the core frame is free from conductive features in the dielectric core and connecting the first metal plate to the second metal plate.
3 . The package of claim 1 further comprising a second metal plate on a second side of the dielectric core, wherein third edges of the second metal plate are vertically aligned to respective fourth edges of the dielectric core.
4 . The package of claim 3 , wherein the first metal plate is electrically decoupled from the second metal plate.
5 . The package of claim 1 , wherein the core frame has a ring shape in a top view of the package, and wherein the first portion and the second portion are parts of the core frame that has the ring shape.
6 . The package of claim 1 , wherein the encapsulant contacts opposing edges of the core frame.
7 . The package of claim 1 , wherein the encapsulant comprises a portion overlapping the first portion of the core frame and overlapped by the plurality of dielectric layers, and wherein the portion of the encapsulant forms a horizontal interface with the first portion of the core frame.
8 . The package of claim 1 , wherein the core frame comprises fiber glass.
9 . The package of claim 1 further comprising a package substrate joined to the package component, wherein the package substrate comprises:
an additional core dielectric; and
conductive pipes in the additional core dielectric.
10 . The package of claim 1 , wherein the device die has a first surface coplanar with a second surface of the core frame.
11 . The package of claim 1 , wherein the package comprises a straight package edge, and the straight package edge comprises:
the edges of the plurality of dielectric layers; and
the edge of the encapsulant.
12 . The package of claim 1 , wherein in a top view of the package, the core frame forms a ring, and the encapsulant comprises a first part in the ring, and a second part outside of the ring.
13 . A package comprising:
a package component comprising a device die therein;
a core frame forming a ring encircling the package component, wherein the core frame comprises a dielectric core;
an encapsulant, wherein the package component and the core frame are in the encapsulant, and wherein the encapsulant comprises:
a top portion overlapping the core frame and forming a horizontal interface with a top surface of the core frame; and
a side portion aside of the core frame and forming a vertical interface with a sidewall of the core frame, wherein the top portion and the side portion comprise a same dielectric material;
a plurality of dielectric layers over the encapsulant; and
redistribution lines in the plurality of dielectric layers, wherein the redistribution lines are electrically connected to the package component.
14 . The package of claim 13 , wherein the horizontal interface is parallel to interfaces that are formed between neighboring ones of the plurality of dielectric layers.
15 . The package of claim 13 , wherein the core frame comprises:
a first metal plate on a first side of the dielectric core; and
a second metal plate on a second side of the dielectric core opposite to the first side, wherein the first metal plate and the second metal plate comprise first edges vertically aligned to a second edge of the dielectric core.
16 . The package of claim 15 , wherein the dielectric core, the first metal plate, and the second metal plate are in physical contact with the sidewall of the encapsulant.
17 . The package of claim 13 , wherein the package comprises an edge, and the edge comprises:
first edges of the plurality of dielectric layers; and
a second edge of the encapsulant.
18 . A package comprising:
a package component comprising a device die therein;
a core frame forming a ring encircling the package component, wherein the core frame comprises:
a dielectric core;
a first metal plate over, and forming a first horizontal interface with, the dielectric core; and
a second metal plate under, and forming a second horizontal interface with, the dielectric core;
a molding compound, wherein the first metal plate, the second metal plate, and the dielectric core physically contact the molding compound to form a vertical-and-straight interface;
a plurality of dielectric layers over the molding compound; and
redistribution lines in the plurality of dielectric layers, wherein the redistribution lines are electrically connected to the package component, and are electrically decoupled from the core frame.
19 . The package of claim 18 , wherein the molding compound further comprises a second portion encircled by the core frame, wherein the second portion further encircles the package component.
20 . The package of claim 18 , wherein the package comprises an edge, and the edge comprises:
first edges of the plurality of dielectric layers; and
a second edge of the molding compound.