Semiconductor device and manufacturing method thereof
A semiconductor device includes first and second FETs including first and second channel regions, respectively. The first and second FETs include first and second gate structures, respectively. The first and second gate structures include first and second gate dielectric layers formed over the first and second channel regions and first and second gate electrode layers formed over the first and second gate dielectric layers. The first and second gate structures are aligned along a first direction. The first gate structure and the second gate structure are separated by a separation plug made of an insulating material. The first gate electrode layer is in contact with a side wall of the separation plug.
1 . A semiconductor device, comprising:
a first field effect transistor (FET) including a first channel region made of a semiconductor material and a first gate structure, the first gate structure including, a first gate dielectric layer formed over the first channel region, a first gate electrode layer formed over the first gate dielectric layer, and sidewall spacers; and
an insulating plug made of silicon nitride and adjacent to the first gate structure,
wherein the insulating plug has a curved portion convex toward the first gate electrode in plan view.
2 . The semiconductor device of claim 1 , wherein the first gate electrode layer of the first gate structure is in contact with the insulating plug and the insulating plug is in contact with at least one of the sidewall spacers.
3 . The semiconductor device of claim 1 , wherein the first gate electrode layer is in direct contact with the insulating plug.
4 . The semiconductor device of claim 3 , wherein the first gate electrode layer includes a plurality of conductive layers that are in direct contact with the insulating plug.
5 . The semiconductor device of claim 1 , wherein the first channel region is a part of a fin structure.
6 . The semiconductor device of claim 1 , further comprising:
a second FET including a second channel region made of a semiconductor material and a second gate structure, the second gate structure including, a second gate dielectric layer formed over the second channel region, a second gate electrode layer formed over the second gate dielectric layer, and the sidewall spacers,
wherein the insulating plug has another curved portion convex toward the second gate electrode in plan view.
7 . The semiconductor device of claim 6 , wherein:
the sidewall spacers are continuous between the first FET and the second FET, and
the insulating plug has side faces between the curved portion and the another curved portion, which are in contact with the sidewall spacers.
8 . The semiconductor device of claim 6 , wherein the insulating plug is in direct contact with the second gate electrode layer of the second gate structure.
9 . The semiconductor device of claim 6 , further comprising an interlayer dielectric layer adjacent to the sidewall spacers and continuous between the first FET and the second FET.
10 . The semiconductor device of claim 9 , wherein the insulating plug is made of a different material than the interlayer dielectric layer.
11 . A semiconductor device, comprising:
a first gate structure including a first gate dielectric layer formed over a first fin structure and a first gate electrode layer formed over the first gate dielectric layer and extending in a first direction;
a second gate structure including a second gate dielectric layer formed over a second fin structure and a second gate electrode layer formed over the second gate dielectric layer and extending in the first direction;
an insulating plug disposed between the first gate structure and the second gate structure so that the first gate structure, the insulating plug and the second gate structure are aligned in this order in the first direction; and
sidewall spacers disposed on opposing side faces of the first gate structure, opposing side faces of the insulating plug and opposing side faces of the second gate structure,
wherein the insulating plug has opposing curved portions convex toward the first gate structure and the second gate structure, respectively, in plan view.
12 . The semiconductor device of claim 11 , further comprising an interlayer dielectric layer disposed adjacent to the sidewall spacers and made of a different material than the insulating plug.
13 . The semiconductor device of claim 11 , wherein the insulating plug is a single layer.
14 . The semiconductor device of claim 11 , wherein:
each of the first gate electrode layer and the second gate electrode layer includes underlying conductive layers and a main metal electrode layer, and
the main metal electrode layer is in direct contact with a side face of the insulating plug.
15 . The semiconductor device of claim 14 , wherein the underlying conductive layers are in direct contact with the side face of the insulating plug.
16 . The semiconductor device of claim 15 , wherein the first and second gate dielectric layers are in direct contact with side faces of the insulating plug, respectively.
17 . A semiconductor device, comprising:
a first gate structure including a first gate dielectric layer formed over a first fin structure and a first gate electrode layer formed over the first gate dielectric layer and extending in a first direction;
a second gate structure including a second gate dielectric layer formed over a second fin structure and a second gate electrode layer formed over the second gate dielectric layer and extending in the first direction;
an insulating plug disposed between the first gate structure and the second gate structure so that the first gate structure, the insulating plug and the second gate structure are aligned in this order in the first direction;
sidewall spacers disposed on opposing side faces of the first gate structure, opposing side faces of the insulating plug and opposing side faces of the second gate structure; and
an interlayer dielectric layer,
wherein a first end of the first gate structure is in contact with the insulating plug, a second end of the first gate structure is in contact with the interlayer dielectric layer, and the insulating plug has a curved portion convex toward the second gate electrode in plan view.
18 . The semiconductor device of claim 17 , wherein a part of the first gate dielectric layer is disposed between the first gate electrode layer and the interlayer dielectric layer.
19 . The semiconductor device of claim 17 , wherein the insulating plug, the sidewall spacers and the interlayer dielectric layers are made of different dielectric material from each other.
20 . The semiconductor device of claim 17 , wherein an upper surface of the insulating plug is flush with an upper surface of the gate structures.