Transfer apparatus
A transfer apparatus includes a first vacuum transfer module; a first transfer robot disposed in the first vacuum transfer module and at least one ring. In addition, a second vacuum transfer module is provided; and a second transfer robot is disposed in the second vacuum transfer module. A tubular connecting module is disposed between the first vacuum transfer module and the second vacuum transfer module. Further, the first vacuum transfer module, the second vacuum transfer module and the tubular connecting module are arranged along a first direction, with the tubular connecting module having a first length in the first direction, and the first length is smaller than the diameter of the wafer. A wafer support is rotatably attached to the tubular connecting module and at least three ring supporting members outwardly extend from the wafer support to support the at least one ring.
1 . A transfer apparatus, comprising:
a first vacuum transfer module;
a first transfer robot disposed in the first vacuum transfer module;
a second vacuum transfer module;
a second transfer robot disposed in the second vacuum transfer module;
a connecting module disposed between the first vacuum transfer module and the second vacuum transfer module;
a wafer support disposed in the connecting module; and
a plurality of ring supporting members outwardly extending from the wafer support, the plurality of ring supporting members including a first ring supporting member and a second ring supporting member, the first ring supporting member extending into the first vacuum transfer module, the second ring supporting member extending into the second vacuum transfer module.
2 . The transfer apparatus of claim 1 , wherein the first vacuum transfer module, the second vacuum transfer module and the connecting module is arranged along a first direction, the connecting module having a first length in the first direction.
3 . The transfer apparatus of claim 2 , wherein the wafer support includes a wafer stage having a wafer support surface, and the wafer support surface has a diameter smaller than the first length.
4 . The transfer apparatus of claim 1 , wherein the wafer support is rotatable.
5 . The transfer apparatus of claim 1 , wherein the plurality of ring supporting members are rotatable.
6 . The transfer apparatus of claim 4 , wherein the plurality of ring supporting members are rotatable.
7 . The transfer apparatus of claim 3 , wherein the wafer support further includes a shaft member extending downward from the wafer stage, and
each of the plurality of ring supporting members includes a rod-shaped portion and a protruding portion, wherein one end of the rod-shaped portion is attached to the shaft member, and the protruding portion protrudes upward from the other end of the rod-shaped portion and has a ring support surface at an upper end thereof.
8 . The transfer apparatus of claim 7 , wherein the ring support surface is located at the same height as the wafer support surface.
9 . The transfer apparatus of claim 7 , wherein the ring support surface is located at a height different from the height of the wafer support surface.
10 . The transfer apparatus of claim 7 , wherein the plurality of ring supporting members include three ring supporting members arranged at intervals of 120° around the shaft member.
11 . The transfer apparatus of claim 6 , further comprising:
a controller configured to control the first transfer robot to place a wafer on the wafer support, control the wafer support to rotate the wafer on the wafer support by a predetermined angle, and control the second transfer robot to transfer the wafer on the wafer support into the second vacuum transfer module.
12 . The transfer apparatus of claim 11 , wherein the controller is configured to control the first transfer robot to place at least one ring on the plurality of ring supporting members, and control the second transfer robot to transfer the at least one ring on the plurality of ring supporting members into the second vacuum transfer module.
13 . A transfer apparatus, comprising:
a first vacuum transfer module;
a first transfer robot disposed in the first vacuum transfer module;
a second vacuum transfer module;
a second transfer robot disposed in the second vacuum transfer module;
a connecting module disposed between the first vacuum transfer module and the second vacuum transfer module;
a wafer support disposed in the connecting module; and
a plurality of ring supporting members outwardly extending from the wafer support, the plurality of ring supporting members including a first ring supporting member extending into the first vacuum transfer module or the second vacuum transfer module.
14 . The transfer apparatus of claim 13 , wherein the first vacuum transfer module, the second vacuum transfer module and the connecting module is arranged along a first direction, the connecting module having a first length in the first direction.
15 . The transfer apparatus of claim 14 , wherein the wafer support includes a wafer stage having a wafer support surface, and the wafer support surface has a diameter smaller than the first length.
16 . The transfer apparatus of claim 14 , wherein the wafer support is rotatable.
17 . The transfer apparatus of claim 16 , wherein the plurality of ring supporting members are rotatable.
18 . The transfer apparatus of claim 15 , wherein the wafer support further includes a shaft member extending downward from the wafer stage, and
each of the plurality of ring supporting members includes a rod-shaped portion and a protruding portion, wherein one end of the rod-shaped portion is attached to the shaft member, and the protruding portion protrudes upward from the other end of the rod-shaped portion and has a ring support surface at an upper end thereof.
19 . The transfer apparatus of claim 17 , further comprising:
a controller configured to control the first transfer robot to place a wafer on the wafer support, control the wafer support to rotate the wafer on the wafer support by a predetermined angle, and control the second transfer robot to transfer the wafer on the wafer support into the second vacuum transfer module.
20 . The transfer apparatus of claim 19 , wherein the controller is configured to control the first transfer robot to place at least one ring on the plurality of ring supporting members, and control the second transfer robot to transfer the at least one ring on the plurality of ring supporting members into the second vacuum transfer module.