Method and device for boosting performance of FinFETs via strained spacer
A semiconductor device and a method of forming the same are provided. A semiconductor device according to an embodiment includes a P-type field effect transistor (PFET) and an N-type field effect transistor (NFET). The PFET includes a first gate structure formed over a substrate, a first spacer disposed on a sidewall of the first gate structure, and an unstrained spacer disposed on a sidewall of the first spacer. The NET includes a second gate structure formed over the substrate, the first spacer disposed on a sidewall of the second gate structure, and a strained spacer disposed on a sidewall of the first spacer.
1 . A structure, comprising:
an isolation structure;
a first dielectric fin, a second dielectric fin, and a third dielectric fin extending parallel to one another and vertically into the isolation structure;
a first semiconductor fin disposed in the isolation structure and between the first dielectric fin and the second dielectric fin;
a second semiconductor fin disposed in the isolation structure and between the second dielectric fin and the third dielectric fin;
a first source/drain feature disposed on the first semiconductor fin and spanning a first width;
a second source/drain feature disposed on the second semiconductor fin and spanning a second width less than the first width;
a first spacer feature over the isolation structure and disposed between the first dielectric fin and the second dielectric fin; and
a second spacer feature over the isolation structure and disposed between the second dielectric fin and the third dielectric fin,
wherein a bottom portion of the first source/drain feature is lined by the first spacer feature, and the second source/drain feature is spaced apart from the second dielectric fin and the third dielectric fin by the second spacer feature.
2 . The structure of claim 1 , wherein a top surface of the second spacer feature is higher than a top surface of the first spacer feature.
3 . The structure of claim 1 , wherein the first spacer feature comprises a first dielectric layer extending along sidewalls and bottom surface of a second dielectric layer, and the second spacer feature comprises the first dielectric layer surrounding a lower portion of a third dielectric layer, and wherein the second and third dielectric layers have different compositions.
4 . The structure of claim 3 , wherein the first dielectric layer comprises silicon carbonitride (SiCN).
5 . The structure of claim 4 , wherein the second dielectric layer comprises silicon oxy-carbonitride (SiOCN).
6 . The structure of claim 1 , wherein in a cross-sectional view, an entirety of the first spacer feature is disposed directly under the first source/drain feature.
7 . The structure of claim 1 , wherein a distance between the first dielectric fin and the second dielectric fin is substantially equal to a distance between the second dielectric fin and the third dielectric fin.
8 . The structure of claim 7 , wherein a distance between the first dielectric fin and the first semiconductor fin is substantially equal to a distance between the second dielectric fin and the first semiconductor fin.
9 . The structure of claim 7 , further comprising:
a low-k dielectric layer in direct contact with top surfaces of the first and second source/drain features, top surfaces of the first, second, third dielectric fins, and top surface of the second spacer feature.
10 . A semiconductor structure, comprising:
a semiconductor fin protruding from a substrate;
an isolation feature adjacent to the semiconductor fin;
a dielectric fin spaced apart from the semiconductor fin by the isolation feature;
an epitaxial source/drain feature over the semiconductor fin and spaced apart from the dielectric fin by a first distance; and
a first spacer disposed between the epitaxial source/drain feature and the dielectric fin and having an upper portion spanning a first width equal to the first distance and a lower portion spanning a second width less than the first distance.
11 . The semiconductor structure of claim 10 , further comprising:
a second spacer extending along sidewall surfaces and a bottom surface of the lower portion of the first spacer.
12 . The semiconductor structure of claim 10 , wherein the epitaxial source/drain feature comprises an N-type source/drain feature.
13 . The semiconductor structure of claim 10 , wherein the first spacer is compressively strained.
14 . The semiconductor structure of claim 10 , wherein the first spacer comprises silicon nitride (SiN), silicon oxide (SiO), or hydrocarbon doped silicon nitride (SiOHCN).
15 . The semiconductor structure of claim 10 , further comprising:
a low-k dielectric layer extending along top surfaces of the dielectric fin, epitaxial source/drain feature and first spacer.
16 . A semiconductor structure, comprising:
a first source/drain feature over a first semiconductor fin;
a first spacer extending along a lower portion of a sidewall surface of the first source/drain feature, the first spacer comprising: a first dielectric layer on a bottom surface and sidewalls of a second dielectric layer;
a second source/drain feature over a second semiconductor fin; and
a second spacer extending along a lower portion of a sidewall surface of the second source/drain feature, the second spacer comprising: the first dielectric layer on a bottom surface and a lower portion of sidewalls of a third dielectric layer,
wherein the second dielectric layer and the third dielectric layer have different compositions, and
wherein, in a cross-sectional view cut through the first source/drain feature and the second source/drain feature, a thickness of the second dielectric layer is greater than a thickness of the lower portion of the third dielectric layer.
17 . The semiconductor structure of claim 16 , wherein the first source/drain feature is a P-type source/drain feature spanning a first width, the second source/drain feature is an N-type source/drain feature spanning a second width less than the first width.
18 . The semiconductor structure of claim 16 , wherein the third dielectric layer further extends along an upper portion of the sidewall surface of the first source/drain feature, and a middle portion of the sidewall surface of the first source/drain feature is exposed to air.
19 . The semiconductor structure of claim 16 , further comprising:
a dielectric fin disposed between the first source/drain feature and the second source/drain feature and having a top surface above a top surface of the third dielectric layer.
20 . The semiconductor structure of claim 19 , further comprising:
a gate structure adjacent to the second source/drain feature,
wherein, in a cross-sectional view cut through the gate structure and the second source/drain feature, a height of the first dielectric layer is greater than a height of the third dielectric layer.