Protective metal oxy-fluoride coatings
An article has a body having a protective coating. The protective coating is a thin film that includes a metal oxy-fluoride. The metal oxy-fluoride has an empirical formula of M x O y F z , where M is a metal, y has a value of 0.1 to 1.9 times a value of x and z has a value of 0.1 to 3.9 times the value of x. The protective coating has a thickness of 1 to 30 microns and a porosity of less than 0.1%.
1 . A thin film comprising:
a metal oxy-fluoride having an empirical formula of M x O y F z , where M is a metal comprising at least one of aluminum, calcium, or strontium, y has a value of 0.1 to 1.9 times a value of x and z has a value of 0.1 to 3.9 times the value of x;
wherein the thin film has a thickness of 1 to 30 microns and a porosity of less than 0.1%, and
wherein one of:
the metal has a valence of 2 and the metal oxy-fluoride comprises approximately 37-48 at. % of the metal, approximately 10-43 at. % oxygen, and approximately 10-53 at. % fluorine,
the metal has a valence of 3 and the metal oxy-fluoride comprises approximately 27-38 at. % of the metal, approximately 10-52 at. % oxygen, and approximately 10-63 at. % fluorine, or
the metal has a valence of 4 and the metal oxy-fluoride comprises approximately 22-32 at. % of the metal, approximately 10-58 at. % oxygen, and approximately 10-68 at. % fluorine.
2 . The thin film of claim 1 , wherein the thin film coats at least one surface of a chamber component for semiconductor processing equipment.
3 . The thin film of claim 1 , wherein the metal has the valence of 2 and the metal oxy-fluoride comprises approximately 37-48 at. % of the metal, approximately 10-43 at. % oxygen, and approximately 10-53 at. % fluorine.
4 . The thin film of claim 1 , wherein the metal has the valence of 3 and the metal oxy-fluoride comprises approximately 27-38 at. % of the metal, approximately 10-52 at. % oxygen, and approximately 10-63 at. % fluorine.
5 . The thin film of claim 1 , wherein the metal has valence of 4 and the metal oxy-fluoride comprises approximately 22-32 at. % of the metal, approximately 10-58 at. % oxygen, and approximately 10-68 at. % fluorine.
6 . An article comprising:
a body comprising a thin film on at least a portion of the body;
the thin film comprising:
a metal oxy-fluoride having an empirical formula of M x O y F z , where M is a metal comprising at least one of aluminum, calcium, or strontium, y has a value of 0.1 to 1.9 times a value of x and z has a value of 0.1 to 3.9 times the value of x;
wherein the thin film has a thickness of 1 to 30 microns and a porosity of less than 0.1%.
7 . The article of claim 6 , wherein the metal has a valence of 2 and the metal oxy-fluoride comprises approximately 37-48 at. % of the metal, approximately 10-43 at. % oxygen, and approximately 10-53 at. % fluorine.
8 . The article of claim 6 , wherein the metal has a valence of 3 and the metal oxy-fluoride comprises approximately 27-38 at. % of the metal, approximately 10-52 at. % oxygen, and approximately 10-63 at. % fluorine.
9 . The article of claim 6 , wherein the metal has a valence of 4 and the metal oxy-fluoride comprises approximately 22-32 at. % of the metal, approximately 10-58 at. % oxygen, and approximately 10-68 at. % fluorine.
10 . The article of claim 6 , wherein the thin film is at least one of a sputtered thin film, an evaporated thin film, amorphous or at least partially crystalline.
11 . The article of claim 6 , wherein the article is a chamber component.
12 . The article of claim 11 , wherein the chamber component is selected from the group consisting of a substrate support assembly, an electrostatic chuck, a ring, a chamber wall, a base, a gas distribution plate, a showerhead, a liner, a liner kit, a shield, a plasma screen, a flow equalizer, a cooling base, a chamber viewport, a chamber lid, a face plate and a selectivity modulation device, or
wherein the chamber component is a showerhead comprising holes and wherein the thin film is thin enough not to block the holes.
13 . The article of claim 11 , wherein the chamber component comprises a material selected from the group consisting of Al 2 O 3 , Y 203 , yttrium aluminum garnet, Y 4 Al 2 O 9 , a solid-solution of Y 2 O 3 —ZrO 2 , SiC, AlN, TIO, TiN and AlF.
14 . The article of claim 11 , wherein the chamber component is composed at least partially of a material selected from the group consisting of Al 2 O 3 , Al, stainless steel, Y 2 O 3 , AlN and SiC.
15 . The article of claim 6 , wherein the thin film conforms to surface features of the body.