Complementary field effect transistor with hybrid nanostructure
An integrated circuit includes a complimentary field effect transistor (CFET). The CFET includes a first transistor having a first semiconductor nanostructure corresponding to a channel region of the first semiconductor nanostructure and a first gate metal surrounding the second semiconductor nanostructure. The CFET includes a transistor including a second semiconductor nanostructure above the first semiconductor nanostructure and a second gate metal surrounding the second semiconductor nanostructure. The CFET includes an isolation structure between the first and second semiconductor nanostructures.
1 . An integrated circuit comprising:
a first transistor including:
a first semiconductor nanostructure corresponding to a channel region of the first transistor; and
a first gate metal surrounding the first semiconductor nanostructure;
a second transistor including:
a second semiconductor nanostructure above the first semiconductor nanostructure and corresponding to a channel region of the second transistor; and
a second gate metal surrounding the second semiconductor nanostructure;
an isolation structure including:
a dielectric layer between the first semiconductor nanostructure and the second semiconductor nanostructure, wherein the first gate metal contacts the second gate metal at a height lower than a top surface of the dielectric layer;
a first semiconductor layer above and in contact with the dielectric layer; and
a second semiconductor layer below and in contact with the dielectric layer.
2 . The integrated circuit of claim 1 , wherein first and second semiconductor layers each have a vertical thickness less than a vertical thickness of the first semiconductor nanostructure.
3 . The integrated circuit of claim 1 comprising a gate dielectric layer positioned on the first semiconductor nanostructure, the second semiconductor nanostructure, and the isolation structure.
4 . The integrated circuit of claim 1 , wherein the dielectric layer has a vertical thickness greater than a vertical thickness of the first semiconductor nanostructure.
5 . The integrated circuit of claim 1 , wherein the dielectric layer has concave sidewalls.
6 . The integrated circuit of claim 1 , wherein the dielectric layer includes:
a first dielectric sublayer;
a second dielectric sublayer on the first dielectric sublayer and having a material different than the first dielectric sublayer; and
a third dielectric sublayer on the second dielectric sublayer and having a same materials the first dielectric sublayer.
7 . The integrated circuit of claim 1 , wherein the contact height of the first and second gate metals is and higher than a bottom surface of the dielectric layer.
8 . The integrated circuit of claim 1 , wherein the dielectric layer has a lateral width substantially equal to a lateral width of the first semiconductor nanostructure.
9 . The integrated circuit of claim 1 , comprising:
a first source/drain region of the first transistor coupled to the first semiconductor nanostructure;
a second source/drain region of the second transistor above the first semiconductor nanostructure and coupled to the second semiconductor nanostructure; and
a dielectric structure between the first and second nanostructure and in contact with the first source/drain region, the second source/drain region, and the dielectric layer.
10 . An integrated circuit, comprising:
a complementary field effect transistor including:
a first transistor having a first semiconductor nanostructure corresponding to a channel region of the first transistor a first gate metal surrounding the first semiconductor nanostructure;
a second transistor having a second semiconductor nanostructure above the first semiconductor nanostructure and corresponding to a channel region of the second transistor a second gate metal surrounding the second semiconductor nanostructure, the second gate metal being above and in contact with the first gate metal; and
an isolation structure including:
a dielectric layer between the first semiconductor nanostructure and the second semiconductor nanostructure,
a first semiconductor layer between the dielectric layer and the first semiconductor nanostructure; and
a second semiconductor layer between the dielectric layer and the second semiconductor nanostructure, wherein the first and second semiconductor layers are thinner than the first semiconductor nanostructure.
11 . The integrated circuit of claim 10 , wherein:
the first gate metal has a top surface lower than a top of the isolation structure; and
the second gate metal has a bottom surface higher than a bottom of the isolation structure.